{"id":"https://openalex.org/W4310717051","doi":"https://doi.org/10.1109/icta56932.2022.9962977","title":"Formation Mechanism of high Ni content (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> in Cu/Sn/Ni microbump for solid state aging","display_name":"Formation Mechanism of high Ni content (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> in Cu/Sn/Ni microbump for solid state aging","publication_year":2022,"publication_date":"2022-10-28","ids":{"openalex":"https://openalex.org/W4310717051","doi":"https://doi.org/10.1109/icta56932.2022.9962977"},"language":"en","primary_location":{"id":"doi:10.1109/icta56932.2022.9962977","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta56932.2022.9962977","pdf_url":null,"source":{"id":"https://openalex.org/S4363608577","display_name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101650550","display_name":"Haiyang Yu","orcid":null},"institutions":[{"id":"https://openalex.org/I4387153688","display_name":"Beijing Institute of Radio Metrology and Measurement","ror":"https://ror.org/02c8ctc21","country_code":null,"type":"company","lineage":["https://openalex.org/I15089104","https://openalex.org/I4387153688"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Haiyang Yu","raw_affiliation_strings":["Beijing Institute of Radio Measurement,Beijing,China","Beijing Institute of Radio Measurement, Beijing, China"],"affiliations":[{"raw_affiliation_string":"Beijing Institute of Radio Measurement,Beijing,China","institution_ids":["https://openalex.org/I4387153688"]},{"raw_affiliation_string":"Beijing Institute of Radio Measurement, Beijing, China","institution_ids":["https://openalex.org/I4387153688"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5044796911","display_name":"C. R. Kao","orcid":"https://orcid.org/0000-0001-6685-0639"},"institutions":[{"id":"https://openalex.org/I16733864","display_name":"National Taiwan University","ror":"https://ror.org/05bqach95","country_code":"TW","type":"education","lineage":["https://openalex.org/I16733864"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"C.R. Kao","raw_affiliation_strings":["National Taiwan University,Department of Materials Science and Engineering,Taipei,China","Department of Materials Science and Engineering, National Taiwan University, Taipei, China"],"affiliations":[{"raw_affiliation_string":"National Taiwan University,Department of Materials Science and Engineering,Taipei,China","institution_ids":["https://openalex.org/I16733864"]},{"raw_affiliation_string":"Department of Materials Science and Engineering, National Taiwan University, Taipei, China","institution_ids":["https://openalex.org/I16733864"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5101650550"],"corresponding_institution_ids":["https://openalex.org/I4387153688"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1857213,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"48","issue":null,"first_page":"20","last_page":"21"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.961899995803833,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/phase","display_name":"Phase (matter)","score":0.6108355522155762},{"id":"https://openalex.org/keywords/solid-state","display_name":"Solid-state","score":0.4939921498298645},{"id":"https://openalex.org/keywords/mechanism","display_name":"Mechanism (biology)","score":0.48789072036743164},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.4642636775970459},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.433908611536026},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.3564731478691101},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.35200726985931396},{"id":"https://openalex.org/keywords/stereochemistry","display_name":"Stereochemistry","score":0.3503432273864746},{"id":"https://openalex.org/keywords/chemical-engineering","display_name":"Chemical engineering","score":0.34026893973350525},{"id":"https://openalex.org/keywords/physical-chemistry","display_name":"Physical chemistry","score":0.3018260896205902},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.2477351725101471},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1791040301322937},{"id":"https://openalex.org/keywords/organic-chemistry","display_name":"Organic chemistry","score":0.15232238173484802},{"id":"https://openalex.org/keywords/quantum-mechanics","display_name":"Quantum mechanics","score":0.09974756836891174}],"concepts":[{"id":"https://openalex.org/C44280652","wikidata":"https://www.wikidata.org/wiki/Q104837","display_name":"Phase (matter)","level":2,"score":0.6108355522155762},{"id":"https://openalex.org/C107814960","wikidata":"https://www.wikidata.org/wiki/Q611957","display_name":"Solid-state","level":2,"score":0.4939921498298645},{"id":"https://openalex.org/C89611455","wikidata":"https://www.wikidata.org/wiki/Q6804646","display_name":"Mechanism (biology)","level":2,"score":0.48789072036743164},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.4642636775970459},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.433908611536026},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.3564731478691101},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.35200726985931396},{"id":"https://openalex.org/C71240020","wikidata":"https://www.wikidata.org/wiki/Q186011","display_name":"Stereochemistry","level":1,"score":0.3503432273864746},{"id":"https://openalex.org/C42360764","wikidata":"https://www.wikidata.org/wiki/Q83588","display_name":"Chemical engineering","level":1,"score":0.34026893973350525},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.3018260896205902},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.2477351725101471},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1791040301322937},{"id":"https://openalex.org/C178790620","wikidata":"https://www.wikidata.org/wiki/Q11351","display_name":"Organic chemistry","level":1,"score":0.15232238173484802},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.09974756836891174}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icta56932.2022.9962977","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta56932.2022.9962977","pdf_url":null,"source":{"id":"https://openalex.org/S4363608577","display_name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2022 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W2804872970","https://openalex.org/W2886469639","https://openalex.org/W2888450400","https://openalex.org/W2965769537"],"related_works":["https://openalex.org/W2058940780","https://openalex.org/W2090404944","https://openalex.org/W2046332915","https://openalex.org/W2354424856","https://openalex.org/W2375093060","https://openalex.org/W2605776044","https://openalex.org/W2392473810","https://openalex.org/W2803456621","https://openalex.org/W2357211366","https://openalex.org/W3045762471"],"abstract_inverted_index":{"Due":[0],"to":[1],"its":[2],"low":[3],"cost,":[4],"the":[5,9,21,24,58,70],"Cu/Sn/Ni":[6],"microbump":[7],"is":[8],"most":[10],"widely":[11],"used":[12],"structure":[13],"in":[14,29],"electronic":[15],"packaging.":[16],"Recent":[17],"studies":[18],"have":[19],"characterized":[20],"evolution":[22],"of":[23,61,69,73],"microstructure":[25],"and":[26,32,82],"phase":[27,43],"formation":[28,59,71],"this":[30,62],"system,":[31],"a":[33,48,67],"unique":[34],"(Cu,Ni)":[35,74],"<inf":[36,40,75,79],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[37,41,76,80],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">6</inf>":[38,77],"Sn":[39,78],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">5</inf>":[42,81],"has":[44,54],"been":[45,55],"discovered":[46],"with":[47],"high":[49],"Ni":[50],"content.":[51],"However,":[52],"there":[53],"debate":[56],"over":[57],"mechanism":[60,72],"phase.":[63],"This":[64],"study":[65],"builds":[66],"model":[68],"provides":[83],"direct":[84],"proof.":[85]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}