{"id":"https://openalex.org/W3128202774","doi":"https://doi.org/10.1109/icta50426.2020.9332071","title":"Reliability Design of a X-Band 2\u00d7 2 Tile-Type T/R Module under Thermal Shock and Random Vibration","display_name":"Reliability Design of a X-Band 2\u00d7 2 Tile-Type T/R Module under Thermal Shock and Random Vibration","publication_year":2020,"publication_date":"2020-11-23","ids":{"openalex":"https://openalex.org/W3128202774","doi":"https://doi.org/10.1109/icta50426.2020.9332071","mag":"3128202774"},"language":"en","primary_location":{"id":"doi:10.1109/icta50426.2020.9332071","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta50426.2020.9332071","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5022386176","display_name":"Huanpeng Wang","orcid":"https://orcid.org/0009-0009-4755-4813"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Huanpeng Wang","raw_affiliation_strings":["School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063026979","display_name":"Jingrou Wang","orcid":null},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jingrou Wang","raw_affiliation_strings":["School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100705952","display_name":"Yuehang Xu","orcid":"https://orcid.org/0000-0003-1706-2681"},"institutions":[{"id":"https://openalex.org/I150229711","display_name":"University of Electronic Science and Technology of China","ror":"https://ror.org/04qr3zq92","country_code":"CN","type":"education","lineage":["https://openalex.org/I150229711"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuehang Xu","raw_affiliation_strings":["School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China"],"affiliations":[{"raw_affiliation_string":"School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu, China","institution_ids":["https://openalex.org/I150229711"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5022386176"],"corresponding_institution_ids":["https://openalex.org/I150229711"],"apc_list":null,"apc_paid":null,"fwci":0.2055,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.53551612,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"100","last_page":"101"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10670","display_name":"Aluminum Alloy Microstructure Properties","score":0.9879999756813049,"subfield":{"id":"https://openalex.org/subfields/2202","display_name":"Aerospace Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.980400025844574,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.8836206197738647},{"id":"https://openalex.org/keywords/random-vibration","display_name":"Random vibration","score":0.6952574253082275},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6841278076171875},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6327325701713562},{"id":"https://openalex.org/keywords/vibration","display_name":"Vibration","score":0.6247027516365051},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.5190101861953735},{"id":"https://openalex.org/keywords/thermal-shock","display_name":"Thermal shock","score":0.509486973285675},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4786716401576996},{"id":"https://openalex.org/keywords/miniaturization","display_name":"Miniaturization","score":0.4704524576663971},{"id":"https://openalex.org/keywords/tile","display_name":"Tile","score":0.4555063247680664},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4301239848136902},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.41951465606689453},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.40884965658187866},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.35262662172317505},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.2569581866264343},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.245286762714386},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2187560796737671},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1106901466846466},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.08660927414894104}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.8836206197738647},{"id":"https://openalex.org/C130076159","wikidata":"https://www.wikidata.org/wiki/Q7291997","display_name":"Random vibration","level":3,"score":0.6952574253082275},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6841278076171875},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6327325701713562},{"id":"https://openalex.org/C198394728","wikidata":"https://www.wikidata.org/wiki/Q3695508","display_name":"Vibration","level":2,"score":0.6247027516365051},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.5190101861953735},{"id":"https://openalex.org/C176177977","wikidata":"https://www.wikidata.org/wiki/Q960836","display_name":"Thermal shock","level":2,"score":0.509486973285675},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4786716401576996},{"id":"https://openalex.org/C57528182","wikidata":"https://www.wikidata.org/wiki/Q1271842","display_name":"Miniaturization","level":2,"score":0.4704524576663971},{"id":"https://openalex.org/C2780728851","wikidata":"https://www.wikidata.org/wiki/Q468402","display_name":"Tile","level":2,"score":0.4555063247680664},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4301239848136902},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.41951465606689453},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.40884965658187866},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.35262662172317505},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.2569581866264343},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.245286762714386},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2187560796737671},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1106901466846466},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.08660927414894104},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icta50426.2020.9332071","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icta50426.2020.9332071","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5699999928474426,"display_name":"Responsible consumption and production","id":"https://metadata.un.org/sdg/12"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2053247862","https://openalex.org/W2142429461","https://openalex.org/W2766854515","https://openalex.org/W2808420880","https://openalex.org/W2922414278","https://openalex.org/W3023954954"],"related_works":["https://openalex.org/W1975509756","https://openalex.org/W4250289843","https://openalex.org/W1922568553","https://openalex.org/W2965877994","https://openalex.org/W2111250640","https://openalex.org/W2888528082","https://openalex.org/W2351793893","https://openalex.org/W2370051463","https://openalex.org/W3197577028","https://openalex.org/W3214159384"],"abstract_inverted_index":{"With":[0],"the":[1,13,19,48,58,64,79,82,92,95],"further":[2],"miniaturization":[3],"of":[4,12,21,41,81,94],"RF":[5],"systems,":[6],"its":[7],"reliability":[8,20,93],"has":[9],"become":[10],"one":[11],"key":[14],"factors.":[15],"In":[16],"this":[17],"paper,":[18],"a":[22],"X-band":[23],"2\u00d72":[24],"tile-type":[25],"module":[26,49],"with":[27],"ball":[28],"grid":[29],"array":[30],"(BGA)":[31],"and":[32,44,63,72],"redistribution":[33],"lines":[34],"(RDL)":[35],"process":[36],"is":[37,50,88],"discussed.":[38],"The":[39],"impact":[40],"thermal":[42],"shock":[43],"random":[45],"vibration":[46],"on":[47,69],"analyzed":[51],"by":[52],"finite":[53],"element":[54],"analysis":[55],"(FEA).":[56],"And":[57],"Darveaux":[59],"life":[60,80],"prediction":[61],"model":[62],"Steinberg's":[65],"three-interval":[66],"method":[67],"based":[68],"Gauss":[70],"distribution":[71],"Miner's":[73],"law":[74],"are":[75],"used":[76],"to":[77,90],"predict":[78],"BGA.":[83],"Finally,":[84],"an":[85],"improved":[86],"design":[87],"proposed":[89],"enhance":[91],"module.":[96]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}