{"id":"https://openalex.org/W4392943359","doi":"https://doi.org/10.1109/icst59744.2023.10460856","title":"Enhancement of Glass micromachining using selective copper electroplating","display_name":"Enhancement of Glass micromachining using selective copper electroplating","publication_year":2023,"publication_date":"2023-12-17","ids":{"openalex":"https://openalex.org/W4392943359","doi":"https://doi.org/10.1109/icst59744.2023.10460856"},"language":"en","primary_location":{"id":"doi:10.1109/icst59744.2023.10460856","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icst59744.2023.10460856","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 16th International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5094188983","display_name":"Anila Puthoor","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Anila Puthoor","raw_affiliation_strings":["Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","institution_ids":["https://openalex.org/I4210133459"]},{"raw_affiliation_string":"Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India","institution_ids":["https://openalex.org/I4210133459"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5001197652","display_name":"Megha Agrawal","orcid":"https://orcid.org/0000-0001-6386-0161"},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Megha Agrawal","raw_affiliation_strings":["Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","institution_ids":["https://openalex.org/I4210133459"]},{"raw_affiliation_string":"Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India","institution_ids":["https://openalex.org/I4210133459"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102632141","display_name":"K. M. Varshini","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Varshini K M","raw_affiliation_strings":["Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","institution_ids":["https://openalex.org/I4210133459"]},{"raw_affiliation_string":"Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India","institution_ids":["https://openalex.org/I4210133459"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5102632142","display_name":"Koushik K Rao","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Koushik K Rao","raw_affiliation_strings":["Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Center-Sensor and Vision Technology,Bengaluru,India","institution_ids":["https://openalex.org/I4210133459"]},{"raw_affiliation_string":"Center-Sensor and Vision Technology, Central Manufacturing Technology Institute, Bengaluru, India","institution_ids":["https://openalex.org/I4210133459"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5094188983"],"corresponding_institution_ids":["https://openalex.org/I4210133459"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.23176064,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":"18","issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9162999987602234,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9162999987602234,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11200","display_name":"Electrodeposition and Electroless Coatings","score":0.9035000205039978,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.8339166641235352},{"id":"https://openalex.org/keywords/electroplating","display_name":"Electroplating","score":0.814733624458313},{"id":"https://openalex.org/keywords/copper","display_name":"Copper","score":0.7639355659484863},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6286935210227966},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.4693300127983093},{"id":"https://openalex.org/keywords/copper-plating","display_name":"Copper plating","score":0.4142942726612091},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3515912592411041},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.19440409541130066},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.1676262617111206}],"concepts":[{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.8339166641235352},{"id":"https://openalex.org/C51807945","wikidata":"https://www.wikidata.org/wiki/Q3503392","display_name":"Electroplating","level":3,"score":0.814733624458313},{"id":"https://openalex.org/C544778455","wikidata":"https://www.wikidata.org/wiki/Q753","display_name":"Copper","level":2,"score":0.7639355659484863},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6286935210227966},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.4693300127983093},{"id":"https://openalex.org/C29216876","wikidata":"https://www.wikidata.org/wiki/Q1769505","display_name":"Copper plating","level":4,"score":0.4142942726612091},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3515912592411041},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.19440409541130066},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.1676262617111206},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icst59744.2023.10460856","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icst59744.2023.10460856","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 16th International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320337495","display_name":"Technology Development","ror":null}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W1967739170","https://openalex.org/W1974633493","https://openalex.org/W2005920153","https://openalex.org/W2007771245","https://openalex.org/W2030401044","https://openalex.org/W2044619291","https://openalex.org/W2045500205","https://openalex.org/W2061273695","https://openalex.org/W2082123518","https://openalex.org/W2306007182","https://openalex.org/W2541201818","https://openalex.org/W2800889217","https://openalex.org/W2996552740","https://openalex.org/W4200421756","https://openalex.org/W4230871066","https://openalex.org/W4367677141"],"related_works":["https://openalex.org/W2359213162","https://openalex.org/W2896201594","https://openalex.org/W2244473467","https://openalex.org/W2743149884","https://openalex.org/W2025180343","https://openalex.org/W2133832016","https://openalex.org/W2105153546","https://openalex.org/W2051116798","https://openalex.org/W2026988100","https://openalex.org/W1645394328"],"abstract_inverted_index":{"The":[0,66,125],"wet":[1],"etching":[2,29,44,123],"technique":[3],"for":[4,78,98],"glass":[5,28,85,111,127],"micromachining":[6],"is":[7,31,89],"widely":[8],"used":[9,108],"in":[10],"MEMS":[11],"(Microelectromechanical":[12],"System)":[13],"to":[14,58,113,117,139,145],"create":[15],"complex":[16],"structures":[17],"and":[18,53,73,116,135,144],"features":[19],"at":[20],"the":[21,27,32,43,48,60,63,84,110,119,122,141,147],"micro-scale.":[22],"One":[23],"critical":[24],"aspect":[25],"of":[26,34,50,62,104],"process":[30],"application":[33],"effective":[35],"masking":[36,64,75],"layers,":[37],"which":[38],"protect":[39],"specific":[40],"areas":[41],"from":[42],"process.":[45,124],"Thispaper":[46],"discusses":[47],"combination":[49],"Chromium,":[51],"Gold,":[52],"selective":[54],"electroplated":[55,67],"Copper":[56],"layers":[57],"improve":[59],"efficiency":[61],"layer.":[65],"copper":[68],"layer":[69],"provides":[70],"a":[71,90,136],"uniform":[72],"well-defined":[74],"surface,":[76],"allowing":[77],"more":[79],"accurate":[80],"pattern":[81],"transfer":[82],"onto":[83],"substrate.":[86],"Additionally,":[87],"it":[88,94],"cost-effective":[91],"solution,":[92],"making":[93],"an":[95,132],"attractive":[96],"option":[97],"various":[99],"applications.":[100],"A":[101],"low":[102],"concentration":[103],"Hydrofluoric":[105],"acid":[106],"was":[107,129],"as":[109],"etchant":[112],"minimize":[114],"undercutting":[115],"enhance":[118],"control":[120],"over":[121],"etched":[126],"substrate":[128],"characterized":[130],"using":[131],"optical":[133],"microscope":[134,138],"confocal":[137],"determine":[140],"etch":[142],"depth":[143],"analyze":[146],"surface":[148],"morphology.":[149]},"counts_by_year":[],"updated_date":"2025-12-21T01:58:51.020947","created_date":"2025-10-10T00:00:00"}