{"id":"https://openalex.org/W4392943410","doi":"https://doi.org/10.1109/icst59744.2023.10460770","title":"Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding","display_name":"Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding","publication_year":2023,"publication_date":"2023-12-17","ids":{"openalex":"https://openalex.org/W4392943410","doi":"https://doi.org/10.1109/icst59744.2023.10460770"},"language":"en","primary_location":{"id":"doi:10.1109/icst59744.2023.10460770","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icst59744.2023.10460770","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 16th International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5094188999","display_name":"Kiran Kumar BV","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":true,"raw_author_name":"Kiran Kumar BV","raw_affiliation_strings":["Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022","institution_ids":["https://openalex.org/I4210133459"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5060479434","display_name":"J. Pradyumna","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Pradyumna J","raw_affiliation_strings":["Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022","institution_ids":["https://openalex.org/I4210133459"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5094189000","display_name":"Abhishek DN","orcid":null},"institutions":[{"id":"https://openalex.org/I4210133459","display_name":"Central Manufacturing Technology Institute","ror":"https://ror.org/03q1jsa36","country_code":"IN","type":"government","lineage":["https://openalex.org/I4210133459"]}],"countries":["IN"],"is_corresponding":false,"raw_author_name":"Abhishek DN","raw_affiliation_strings":["Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022"],"affiliations":[{"raw_affiliation_string":"Central Manufacturing Technology Institute,Centre for Sensors and Vision Technology,Bangalore,India,560022","institution_ids":["https://openalex.org/I4210133459"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5094188999"],"corresponding_institution_ids":["https://openalex.org/I4210133459"],"apc_list":null,"apc_paid":null,"fwci":0.2076,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.63606519,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9653000235557556,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9653000235557556,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9614999890327454,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12427","display_name":"Metal Alloys Wear and Properties","score":0.9505000114440918,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electron-beam-welding","display_name":"Electron beam welding","score":0.6257523894309998},{"id":"https://openalex.org/keywords/welding","display_name":"Welding","score":0.6241660118103027},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6085331439971924},{"id":"https://openalex.org/keywords/cathode-ray","display_name":"Cathode ray","score":0.5648053884506226},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.49922800064086914},{"id":"https://openalex.org/keywords/electronic-packaging","display_name":"Electronic packaging","score":0.4686749577522278},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4069540500640869},{"id":"https://openalex.org/keywords/engineering-physics","display_name":"Engineering physics","score":0.3998212516307831},{"id":"https://openalex.org/keywords/electron","display_name":"Electron","score":0.38922592997550964},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.38681933283805847},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.36906057596206665},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.32815486192703247},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.18650230765342712},{"id":"https://openalex.org/keywords/nuclear-physics","display_name":"Nuclear physics","score":0.07604971528053284}],"concepts":[{"id":"https://openalex.org/C59616599","wikidata":"https://www.wikidata.org/wiki/Q3431241","display_name":"Electron beam welding","level":4,"score":0.6257523894309998},{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.6241660118103027},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6085331439971924},{"id":"https://openalex.org/C95312477","wikidata":"https://www.wikidata.org/wiki/Q207340","display_name":"Cathode ray","level":3,"score":0.5648053884506226},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.49922800064086914},{"id":"https://openalex.org/C69567186","wikidata":"https://www.wikidata.org/wiki/Q5358403","display_name":"Electronic packaging","level":2,"score":0.4686749577522278},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4069540500640869},{"id":"https://openalex.org/C61696701","wikidata":"https://www.wikidata.org/wiki/Q770766","display_name":"Engineering physics","level":1,"score":0.3998212516307831},{"id":"https://openalex.org/C147120987","wikidata":"https://www.wikidata.org/wiki/Q2225","display_name":"Electron","level":2,"score":0.38922592997550964},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.38681933283805847},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.36906057596206665},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.32815486192703247},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.18650230765342712},{"id":"https://openalex.org/C185544564","wikidata":"https://www.wikidata.org/wiki/Q81197","display_name":"Nuclear physics","level":1,"score":0.07604971528053284}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icst59744.2023.10460770","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/icst59744.2023.10460770","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 16th International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1986405774","https://openalex.org/W2020867825","https://openalex.org/W2034658184","https://openalex.org/W2073467925","https://openalex.org/W2084993128","https://openalex.org/W2101145206","https://openalex.org/W2110612860","https://openalex.org/W2182681178","https://openalex.org/W2311143963","https://openalex.org/W2346786923","https://openalex.org/W2519462155","https://openalex.org/W2520494064","https://openalex.org/W2529511416","https://openalex.org/W2558852758","https://openalex.org/W2588276011","https://openalex.org/W2592164749","https://openalex.org/W2592906860","https://openalex.org/W2594289059","https://openalex.org/W2606101096","https://openalex.org/W2611989124","https://openalex.org/W2613900641","https://openalex.org/W6631386587"],"related_works":["https://openalex.org/W2368942964","https://openalex.org/W2010185216","https://openalex.org/W2113674161","https://openalex.org/W3107543022","https://openalex.org/W2397362788","https://openalex.org/W3031393643","https://openalex.org/W4384562450","https://openalex.org/W2390422309","https://openalex.org/W1998620210","https://openalex.org/W3107528539"],"abstract_inverted_index":{"This":[0],"paper":[1],"describes":[2],"a":[3,14,52,130],"process":[4],"which":[5,95,152],"is":[6,25,67,90,96,105,124,168],"used":[7,97],"to":[8,45,51,74,81,98,108,120,136,143,146,171],"hermetically":[9,99,109],"seal":[10,66,82,100,110,123],"electronics":[11,63,84,101,112],"packages":[12],"using":[13,33],"welding":[15,20,24,89],"technique":[16],"called":[17],"electron":[18,87],"beam":[19,88],"(EBW).":[21],"The":[22,65],"E-Beam":[23],"done":[26],"between":[27,55],"dissimilar":[28],"materials":[29],"of":[30,40,61,92,122,140,175],"packaging":[31,141],"without":[32,69],"any":[34],"filler":[35],"material.":[36],"In":[37],"this":[38,104],"type":[39],"welding,":[41],"components":[42],"are":[43,78],"welded":[44],"melt":[46],"and":[47,59,150],"fuse":[48],"together,":[49],"leading":[50],"permanent":[53],"joint":[54],"the":[56,75,93,126,155,164,173,176],"Cover":[57],"(cap)":[58],"Header":[60],"an":[62,83,106,111],"package.":[64,76],"achieved":[68],"causing":[70],"much":[71],"thermal":[72],"damage":[73,154],"There":[77],"many":[79],"ways":[80],"package,":[85],"but":[86],"one":[91],"methods":[94],"packages.":[102],"Consequently,":[103],"attempt":[107],"package":[113],"(TO":[114],"package)":[115],"utilizing":[116],"EBW.The":[117],"importance":[118],"given":[119],"quality":[121,174],"because":[125],"end":[127],"product":[128],"has":[129],"wide":[131],"application":[132],"range":[133],"from":[134],"aerospace":[135],"marine.":[137],"Improper":[138],"sealing":[139],"devices":[142],"get":[144],"exposed":[145],"moisture,":[147],"harmful":[148],"gases":[149],"impurities":[151],"may":[153],"device":[156],"in":[157],"long":[158],"run.":[159],"Hence,":[160],"mechanical":[161],"characterization":[162],"like":[163],"helium":[165],"leak":[166],"test":[167],"carried":[169],"out":[170],"confirm":[172],"weld":[177],"or":[178],"seal.":[179]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2025-12-25T23:11:45.687758","created_date":"2025-10-10T00:00:00"}