{"id":"https://openalex.org/W2099876191","doi":"https://doi.org/10.1109/icsmc.2009.5346751","title":"Automatic die inspection for post-sawing LED wafers","display_name":"Automatic die inspection for post-sawing LED wafers","publication_year":2009,"publication_date":"2009-10-01","ids":{"openalex":"https://openalex.org/W2099876191","doi":"https://doi.org/10.1109/icsmc.2009.5346751","mag":"2099876191"},"language":"en","primary_location":{"id":"doi:10.1109/icsmc.2009.5346751","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsmc.2009.5346751","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on Systems, Man and Cybernetics","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5002609594","display_name":"Chuan\u2010Yu Chang","orcid":"https://orcid.org/0000-0001-9476-8130"},"institutions":[{"id":"https://openalex.org/I75357094","display_name":"National Yunlin University of Science and Technology","ror":"https://ror.org/04qkq2m54","country_code":"TW","type":"education","lineage":["https://openalex.org/I75357094"]}],"countries":["TW"],"is_corresponding":true,"raw_author_name":"Chuan-Yu Chang","raw_affiliation_strings":["Department of Computer Science and Information Engineering, National Yunlin University of Science and Technology, Douliou, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Information Engineering, National Yunlin University of Science and Technology, Douliou, Taiwan","institution_ids":["https://openalex.org/I75357094"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5051510556","display_name":"Chun-Hsi Li","orcid":null},"institutions":[{"id":"https://openalex.org/I153512688","display_name":"National Taiwan Ocean University","ror":"https://ror.org/03bvvnt49","country_code":"TW","type":"education","lineage":["https://openalex.org/I153512688"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Hsi Li","raw_affiliation_strings":["(Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan)"],"affiliations":[{"raw_affiliation_string":"(Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan)","institution_ids":["https://openalex.org/I153512688"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073722954","display_name":"Yung\u2010Chi Chang","orcid":"https://orcid.org/0000-0001-5153-0907"},"institutions":[{"id":"https://openalex.org/I75357094","display_name":"National Yunlin University of Science and Technology","ror":"https://ror.org/04qkq2m54","country_code":"TW","type":"education","lineage":["https://openalex.org/I75357094"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yung-Chi Chang","raw_affiliation_strings":["Department of Computer Science and Information Engineering, National Yunlin University of Science and Technology, Douliou, Taiwan"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Information Engineering, National Yunlin University of Science and Technology, Douliou, Taiwan","institution_ids":["https://openalex.org/I75357094"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5110189764","display_name":"MuDer Jeng","orcid":null},"institutions":[{"id":"https://openalex.org/I153512688","display_name":"National Taiwan Ocean University","ror":"https://ror.org/03bvvnt49","country_code":"TW","type":"education","lineage":["https://openalex.org/I153512688"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"MuDer Jeng","raw_affiliation_strings":["(Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan)"],"affiliations":[{"raw_affiliation_string":"(Department of Electrical Engineering, National Taiwan Ocean University, Keelung, Taiwan)","institution_ids":["https://openalex.org/I153512688"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5002609594"],"corresponding_institution_ids":["https://openalex.org/I75357094"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.18419664,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"4275","issue":null,"first_page":"1615","last_page":"1620"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T13049","display_name":"Surface Roughness and Optical Measurements","score":0.9763000011444092,"subfield":{"id":"https://openalex.org/subfields/2206","display_name":"Computational Mechanics"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12006","display_name":"Ergonomics and Musculoskeletal Disorders","score":0.9646999835968018,"subfield":{"id":"https://openalex.org/subfields/3207","display_name":"Social Psychology"},"field":{"id":"https://openalex.org/fields/32","display_name":"Psychology"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8279516696929932},{"id":"https://openalex.org/keywords/visual-inspection","display_name":"Visual inspection","score":0.7200048565864563},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.7077324390411377},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5927255153656006},{"id":"https://openalex.org/keywords/wafer-testing","display_name":"Wafer testing","score":0.5741590261459351},{"id":"https://openalex.org/keywords/automated-optical-inspection","display_name":"Automated optical inspection","score":0.5692882537841797},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.48134645819664},{"id":"https://openalex.org/keywords/automated-x-ray-inspection","display_name":"Automated X-ray inspection","score":0.4590631127357483},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.45170485973358154},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.43864360451698303},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4227394461631775},{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.42183881998062134},{"id":"https://openalex.org/keywords/manufacturing-engineering","display_name":"Manufacturing engineering","score":0.36260104179382324},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3368683457374573},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.27358123660087585},{"id":"https://openalex.org/keywords/image-processing","display_name":"Image processing","score":0.1628650724887848},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.12030684947967529},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.07491892576217651}],"concepts":[{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8279516696929932},{"id":"https://openalex.org/C168820333","wikidata":"https://www.wikidata.org/wiki/Q448889","display_name":"Visual inspection","level":2,"score":0.7200048565864563},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.7077324390411377},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5927255153656006},{"id":"https://openalex.org/C44445679","wikidata":"https://www.wikidata.org/wiki/Q2538844","display_name":"Wafer testing","level":3,"score":0.5741590261459351},{"id":"https://openalex.org/C164830781","wikidata":"https://www.wikidata.org/wiki/Q787330","display_name":"Automated optical inspection","level":2,"score":0.5692882537841797},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.48134645819664},{"id":"https://openalex.org/C146920229","wikidata":"https://www.wikidata.org/wiki/Q2278114","display_name":"Automated X-ray inspection","level":4,"score":0.4590631127357483},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.45170485973358154},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.43864360451698303},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4227394461631775},{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.42183881998062134},{"id":"https://openalex.org/C117671659","wikidata":"https://www.wikidata.org/wiki/Q11049265","display_name":"Manufacturing engineering","level":1,"score":0.36260104179382324},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3368683457374573},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.27358123660087585},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.1628650724887848},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.12030684947967529},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.07491892576217651},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsmc.2009.5346751","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsmc.2009.5346751","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2009 IEEE International Conference on Systems, Man and Cybernetics","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321040","display_name":"National Science Council","ror":"https://ror.org/02kv4zf79"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W575458157","https://openalex.org/W1538983967","https://openalex.org/W1564419782","https://openalex.org/W1972602875","https://openalex.org/W1994062828","https://openalex.org/W2083394583","https://openalex.org/W2106309274","https://openalex.org/W2122287365","https://openalex.org/W2133059825","https://openalex.org/W2171151720","https://openalex.org/W2240016891","https://openalex.org/W2305637927","https://openalex.org/W2534002169","https://openalex.org/W4404603894","https://openalex.org/W6616454079"],"related_works":["https://openalex.org/W1560398276","https://openalex.org/W1979172994","https://openalex.org/W3149631139","https://openalex.org/W571879","https://openalex.org/W1979253374","https://openalex.org/W1986703546","https://openalex.org/W2154087496","https://openalex.org/W2132335896","https://openalex.org/W2058593100","https://openalex.org/W2150548021"],"abstract_inverted_index":{"Wafer":[0],"defect":[1],"inspection":[2,61],"is":[3,8,73],"an":[4,59],"important":[5],"process":[6],"that":[7,63,96],"performed":[9,18],"before":[10],"die":[11],"packaging.":[12],"Conventional":[13],"wafer":[14],"inspections":[15],"are":[16],"usually":[17],"using":[19,119],"human":[20,48,114],"visual":[21],"judgment.":[22],"A":[23],"large":[24],"number":[25],"of":[26],"people":[27],"visually":[28],"inspect":[29],"wafers":[30],"and":[31,41,110],"hand-mark":[32],"the":[33,76,91,97,102,120],"defective":[34,66,103],"regions.":[35],"This":[36],"requires":[37],"considerable":[38],"personnel":[39],"resources":[40],"misjudgment":[42,111],"may":[43],"be":[44,117],"introduced":[45],"due":[46,112],"to":[47,52,113],"fatigue.":[49],"In":[50],"order":[51],"overcome":[53],"these":[54],"shortcomings,":[55],"this":[56],"study":[57],"develops":[58],"automatic":[60],"system":[62],"can":[64,116],"recognize":[65],"LED":[67,106],"dies.":[68],"An":[69],"artificial":[70],"neural":[71],"network":[72],"adopted":[74],"in":[75,86,90],"inspection.":[77],"Actual":[78],"data":[79],"obtained":[80],"from":[81],"a":[82],"semiconductor":[83],"manufacturing":[84],"company":[85],"Taiwan":[87],"were":[88],"used":[89],"experiments.":[92],"The":[93],"results":[94],"show":[95],"proposed":[98,121],"approach":[99],"successfully":[100],"identified":[101],"dies":[104],"on":[105],"wafers.":[107],"Personnel":[108],"costs":[109],"fatigue":[115],"reduced":[118],"approach.":[122]},"counts_by_year":[{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}