{"id":"https://openalex.org/W2024091510","doi":"https://doi.org/10.1109/icsenst.2013.6727702","title":"Multi-sensor information processing and fusion module","display_name":"Multi-sensor information processing and fusion module","publication_year":2013,"publication_date":"2013-12-01","ids":{"openalex":"https://openalex.org/W2024091510","doi":"https://doi.org/10.1109/icsenst.2013.6727702","mag":"2024091510"},"language":"en","primary_location":{"id":"doi:10.1109/icsenst.2013.6727702","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsenst.2013.6727702","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 Seventh International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020057042","display_name":"Jiebing Yan","orcid":null},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Jiebing Yan","raw_affiliation_strings":["Xi'an Jiaotong University, Xi'an, Shaanxi, CN","State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an Jiaotong University, Xi'an, Shaanxi, CN","institution_ids":["https://openalex.org/I87445476"]},{"raw_affiliation_string":"State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100696219","display_name":"Xiaoxin Wang","orcid":"https://orcid.org/0000-0003-1282-8481"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaoxin Wang","raw_affiliation_strings":["Xi'an Jiaotong University, Xi'an, Shaanxi, CN","State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an Jiaotong University, Xi'an, Shaanxi, CN","institution_ids":["https://openalex.org/I87445476"]},{"raw_affiliation_string":"State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102726458","display_name":"Hongli Hu","orcid":"https://orcid.org/0000-0003-1390-1265"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongli Hu","raw_affiliation_strings":["Xi'an Jiaotong University, Xi'an, Shaanxi, CN","State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an Jiaotong University, Xi'an, Shaanxi, CN","institution_ids":["https://openalex.org/I87445476"]},{"raw_affiliation_string":"State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China","institution_ids":["https://openalex.org/I87445476"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101587004","display_name":"Wang Hong-mei","orcid":"https://orcid.org/0000-0002-3156-0241"},"institutions":[{"id":"https://openalex.org/I87445476","display_name":"Xi'an Jiaotong University","ror":"https://ror.org/017zhmm22","country_code":"CN","type":"education","lineage":["https://openalex.org/I87445476"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hongmei Wang","raw_affiliation_strings":["Xi'an Jiaotong University, Xi'an, Shaanxi, CN","State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Xi'an Jiaotong University, Xi'an, Shaanxi, CN","institution_ids":["https://openalex.org/I87445476"]},{"raw_affiliation_string":"State Key Lab. of Electr. Insulation & Power Equip., Xi'an JiaoTong Univ., Xi'an, China","institution_ids":["https://openalex.org/I87445476"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5020057042"],"corresponding_institution_ids":["https://openalex.org/I87445476"],"apc_list":null,"apc_paid":null,"fwci":0.2364,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.59646366,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"47","issue":null,"first_page":"495","last_page":"500"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11778","display_name":"Electrical and Bioimpedance Tomography","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11778","display_name":"Electrical and Bioimpedance Tomography","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12537","display_name":"Flow Measurement and Analysis","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10876","display_name":"Fault Detection and Control Systems","score":0.9930999875068665,"subfield":{"id":"https://openalex.org/subfields/2207","display_name":"Control and Systems Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/digital-signal-processing","display_name":"Digital signal processing","score":0.8505382537841797},{"id":"https://openalex.org/keywords/field-programmable-gate-array","display_name":"Field-programmable gate array","score":0.7740252017974854},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7344391942024231},{"id":"https://openalex.org/keywords/modular-design","display_name":"Modular design","score":0.6498672962188721},{"id":"https://openalex.org/keywords/interface","display_name":"Interface (matter)","score":0.6383188962936401},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6093782186508179},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.5959252715110779},{"id":"https://openalex.org/keywords/data-flow-diagram","display_name":"Data flow diagram","score":0.47059357166290283},{"id":"https://openalex.org/keywords/texas-instruments-davinci","display_name":"Texas Instruments DaVinci","score":0.4607383608818054},{"id":"https://openalex.org/keywords/signal-processing","display_name":"Signal processing","score":0.4383479654788971},{"id":"https://openalex.org/keywords/data-processing","display_name":"Data processing","score":0.43520939350128174},{"id":"https://openalex.org/keywords/sensor-fusion","display_name":"Sensor fusion","score":0.43059414625167847},{"id":"https://openalex.org/keywords/digital-signal-processor","display_name":"Digital signal processor","score":0.3565932512283325},{"id":"https://openalex.org/keywords/real-time-computing","display_name":"Real-time computing","score":0.35131192207336426},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.1059916615486145}],"concepts":[{"id":"https://openalex.org/C84462506","wikidata":"https://www.wikidata.org/wiki/Q173142","display_name":"Digital signal processing","level":2,"score":0.8505382537841797},{"id":"https://openalex.org/C42935608","wikidata":"https://www.wikidata.org/wiki/Q190411","display_name":"Field-programmable gate array","level":2,"score":0.7740252017974854},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7344391942024231},{"id":"https://openalex.org/C101468663","wikidata":"https://www.wikidata.org/wiki/Q1620158","display_name":"Modular design","level":2,"score":0.6498672962188721},{"id":"https://openalex.org/C113843644","wikidata":"https://www.wikidata.org/wiki/Q901882","display_name":"Interface (matter)","level":4,"score":0.6383188962936401},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6093782186508179},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.5959252715110779},{"id":"https://openalex.org/C489000","wikidata":"https://www.wikidata.org/wiki/Q747385","display_name":"Data flow diagram","level":2,"score":0.47059357166290283},{"id":"https://openalex.org/C45549533","wikidata":"https://www.wikidata.org/wiki/Q7707766","display_name":"Texas Instruments DaVinci","level":4,"score":0.4607383608818054},{"id":"https://openalex.org/C104267543","wikidata":"https://www.wikidata.org/wiki/Q208163","display_name":"Signal processing","level":3,"score":0.4383479654788971},{"id":"https://openalex.org/C138827492","wikidata":"https://www.wikidata.org/wiki/Q6661985","display_name":"Data processing","level":2,"score":0.43520939350128174},{"id":"https://openalex.org/C33954974","wikidata":"https://www.wikidata.org/wiki/Q486494","display_name":"Sensor fusion","level":2,"score":0.43059414625167847},{"id":"https://openalex.org/C161611012","wikidata":"https://www.wikidata.org/wiki/Q106370","display_name":"Digital signal processor","level":3,"score":0.3565932512283325},{"id":"https://openalex.org/C79403827","wikidata":"https://www.wikidata.org/wiki/Q3988","display_name":"Real-time computing","level":1,"score":0.35131192207336426},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.1059916615486145},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0},{"id":"https://openalex.org/C129307140","wikidata":"https://www.wikidata.org/wiki/Q6795880","display_name":"Maximum bubble pressure method","level":3,"score":0.0},{"id":"https://openalex.org/C157915830","wikidata":"https://www.wikidata.org/wiki/Q2928001","display_name":"Bubble","level":2,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsenst.2013.6727702","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsenst.2013.6727702","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 Seventh International Conference on Sensing Technology (ICST)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W1971281444","https://openalex.org/W2026945543","https://openalex.org/W2035655810","https://openalex.org/W2042998857","https://openalex.org/W2098739261","https://openalex.org/W2111967441"],"related_works":["https://openalex.org/W2390600871","https://openalex.org/W2041296419","https://openalex.org/W2379610108","https://openalex.org/W2319687164","https://openalex.org/W2072806596","https://openalex.org/W2348897940","https://openalex.org/W2372514056","https://openalex.org/W2373806376","https://openalex.org/W2388897766","https://openalex.org/W2077289773"],"abstract_inverted_index":{"In":[0],"order":[1],"to":[2,75,107,145],"satisfy":[3],"the":[4,65,73,82,87,91,109,115,121,141,151,159],"character":[5],"of":[6,14,19,64,90,124,150],"multi-sensor":[7,33],"system":[8,110,119,142],"which":[9,79],"has":[10,43,53,137,161],"a":[11,23],"large":[12],"amount":[13],"data":[15,56,70,74],"and":[16,36,49,62,71,85,99,112,126,128,136,170],"strict":[17],"requirement":[18],"real":[20],"time":[21],"response,":[22],"module":[24],"based":[25],"on":[26],"FPGA":[27,41,59,125],"&":[28],"DSP":[29,51,76,100],"is":[30,95,101,131,143],"designed":[31],"for":[32,133],"information":[34],"processing":[35,57,94],"fusion":[37],"after":[38],"considering":[39],"that":[40,158],"(EP2C8T144C8N)":[42],"high-speed,":[44,54],"complex":[45,55],"logic":[46],"control":[47,105],"ability":[48],"floating-point":[50],"(TMS320C6713B)":[52],"capability.":[58],"controls":[60],"interface":[61],"timing":[63],"sensor":[66],"signal":[67],"acquisition,":[68],"pre-processes":[69],"transfers":[72],"in":[77,97,167],"parallel,":[78],"can":[80],"simplify":[81],"peripheral":[83],"circuit":[84],"ensure":[86],"real-time":[88],"performance":[89],"system;":[92],"Data":[93],"realized":[96],"DSP,":[98,127],"used":[102],"as":[103],"main":[104],"chip":[106],"manage":[108],"operation":[111],"communicate":[113],"with":[114],"host":[116],"computer.":[117],"The":[118,154],"combines":[120],"best":[122],"advantages":[123,163],"its":[129],"structure":[130],"suitable":[132],"modular":[134],"design":[135],"strong":[138],"versatility.":[139],"Finally":[140],"applied":[144],"solid":[146],"phase":[147],"concentration":[148],"measurement":[149],"multiphase":[152],"flow.":[153],"experimental":[155],"results":[156],"show":[157],"method":[160],"great":[162],"over":[164],"traditional":[165],"methods":[166],"computing":[168],"precision":[169],"speed.":[171]},"counts_by_year":[{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}