{"id":"https://openalex.org/W2907462922","doi":"https://doi.org/10.1109/icsens.2018.8589933","title":"Wireless Piezoresistive Pressure Sensors Used for Quality Control in Glass Fiber Composite Laminates","display_name":"Wireless Piezoresistive Pressure Sensors Used for Quality Control in Glass Fiber Composite Laminates","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2907462922","doi":"https://doi.org/10.1109/icsens.2018.8589933","mag":"2907462922"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2018.8589933","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589933","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019493393","display_name":"Minerva G. Vargas Gleason","orcid":"https://orcid.org/0000-0002-1299-6998"},"institutions":[{"id":"https://openalex.org/I4210104543","display_name":"Friedrich-Wilhelm-Bessel-Institut Forschungsgesellschaft","ror":"https://ror.org/01mjy0s49","country_code":"DE","type":"facility","lineage":["https://openalex.org/I4210104543"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Minerva Gabriela Vargas Gleason","raw_affiliation_strings":["Friedrich-Wilhelm-Bessel-Institut Forschungsgesellschaft mbH (FWBI), Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Friedrich-Wilhelm-Bessel-Institut Forschungsgesellschaft mbH (FWBI), Bremen, Germany","institution_ids":["https://openalex.org/I4210104543"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5087956380","display_name":"Reiner Jedermann","orcid":"https://orcid.org/0000-0002-0390-9143"},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Reiner Jedermann","raw_affiliation_strings":["Actuators and Systems IMSAS, University of Bremen, Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Actuators and Systems IMSAS, University of Bremen, Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112455370","display_name":"Adli Dimassi","orcid":null},"institutions":[{"id":"https://openalex.org/I4387154152","display_name":"Faserinstitut Bremen","ror":"https://ror.org/02g130845","country_code":null,"type":"facility","lineage":["https://openalex.org/I180437899","https://openalex.org/I4387154152"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Adli Dimassi","raw_affiliation_strings":["E.v. FIBRE, Faserinstitut Bremen, Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"E.v. FIBRE, Faserinstitut Bremen, Bremen, Germany","institution_ids":["https://openalex.org/I4387154152"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077352854","display_name":"Walter Lang","orcid":"https://orcid.org/0000-0002-9813-5231"},"institutions":[{"id":"https://openalex.org/I180437899","display_name":"University of Bremen","ror":"https://ror.org/04ers2y35","country_code":"DE","type":"education","lineage":["https://openalex.org/I180437899"]}],"countries":["DE"],"is_corresponding":false,"raw_author_name":"Walter Lang","raw_affiliation_strings":["Actuators and Systems IMSAS, University of Bremen, Bremen, Germany"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Actuators and Systems IMSAS, University of Bremen, Bremen, Germany","institution_ids":["https://openalex.org/I180437899"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.1309,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.52101779,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10205","display_name":"Advanced Fiber Optic Sensors","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10205","display_name":"Advanced Fiber Optic Sensors","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9962000250816345,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.9927999973297119,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6801842451095581},{"id":"https://openalex.org/keywords/pressure-sensor","display_name":"Pressure sensor","score":0.6463559865951538},{"id":"https://openalex.org/keywords/piezoresistive-effect","display_name":"Piezoresistive effect","score":0.5362222790718079},{"id":"https://openalex.org/keywords/embedding","display_name":"Embedding","score":0.5098564028739929},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.4718361496925354},{"id":"https://openalex.org/keywords/wireless-sensor-network","display_name":"Wireless sensor network","score":0.47023436427116394},{"id":"https://openalex.org/keywords/composite-laminates","display_name":"Composite laminates","score":0.44064271450042725},{"id":"https://openalex.org/keywords/glass-fiber","display_name":"Glass fiber","score":0.4207390546798706},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.4109945297241211},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.40574419498443604},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.372624933719635},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.35194551944732666},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.27512818574905396},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16820868849754333},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.11390480399131775}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6801842451095581},{"id":"https://openalex.org/C41325743","wikidata":"https://www.wikidata.org/wiki/Q1261040","display_name":"Pressure sensor","level":2,"score":0.6463559865951538},{"id":"https://openalex.org/C198490522","wikidata":"https://www.wikidata.org/wiki/Q1932915","display_name":"Piezoresistive effect","level":2,"score":0.5362222790718079},{"id":"https://openalex.org/C41608201","wikidata":"https://www.wikidata.org/wiki/Q980509","display_name":"Embedding","level":2,"score":0.5098564028739929},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.4718361496925354},{"id":"https://openalex.org/C24590314","wikidata":"https://www.wikidata.org/wiki/Q336038","display_name":"Wireless sensor network","level":2,"score":0.47023436427116394},{"id":"https://openalex.org/C145922259","wikidata":"https://www.wikidata.org/wiki/Q5156763","display_name":"Composite laminates","level":3,"score":0.44064271450042725},{"id":"https://openalex.org/C177229083","wikidata":"https://www.wikidata.org/wiki/Q5861","display_name":"Glass fiber","level":2,"score":0.4207390546798706},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.4109945297241211},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.40574419498443604},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.372624933719635},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.35194551944732666},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.27512818574905396},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16820868849754333},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.11390480399131775},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2018.8589933","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589933","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":12,"referenced_works":["https://openalex.org/W112038005","https://openalex.org/W1994722684","https://openalex.org/W2056485919","https://openalex.org/W2060250478","https://openalex.org/W2070782340","https://openalex.org/W2073534985","https://openalex.org/W2092609802","https://openalex.org/W2124558103","https://openalex.org/W2134964392","https://openalex.org/W2299930816","https://openalex.org/W2745376846","https://openalex.org/W6664494113"],"related_works":["https://openalex.org/W4231551819","https://openalex.org/W2089076881","https://openalex.org/W2576957273","https://openalex.org/W99992490","https://openalex.org/W2890232104","https://openalex.org/W2378386980","https://openalex.org/W2443919171","https://openalex.org/W4319718036","https://openalex.org/W2904406414","https://openalex.org/W4388609455"],"abstract_inverted_index":{"The":[0],"production":[1,19,68],"of":[2,38,111],"new":[3,64],"glass":[4,75],"fiber":[5,49,76],"composite":[6],"parts":[7],"is,":[8],"to":[9,17,61,119],"some":[10],"extent,":[11],"a":[12,63,120],"trial-and-error":[13],"process,":[14],"which":[15],"leads":[16],"high":[18],"costs":[20],"and":[21,42,57,99,115,126],"material":[22,55],"waste.":[23],"Embedding":[24],"piezoresistive":[25],"pressure":[26,72,94,112],"sensors":[27,73,82,91,95,113],"into":[28],"composites":[29],"during":[30,51,85,133],"the":[31,36,58,78,81,86,90,101,129],"manufacturing":[32],"process":[33],"allows":[34],"for":[35,104],"determination":[37],"resin":[39,130],"front":[40,132],"flow":[41,131],"assists":[43],"in":[44,74],"preventing":[45],"voids,":[46],"ensuring":[47],"complete":[48],"impregnation":[50],"infusion.":[52,134],"This":[53],"reduces":[54],"waste":[56],"time":[59],"required":[60,103],"produce":[62],"part,":[65],"therefore":[66],"reducing":[67],"costs.":[69],"When":[70],"embedding":[71],"laminates,":[77],"wires":[79],"connecting":[80],"often":[83],"break":[84],"infusion":[87],"setup,":[88],"rendering":[89],"useless.":[92],"Wireless":[93],"solve":[96],"this":[97,107],"problem":[98],"simplify":[100],"setup":[102],"embedding.":[105],"In":[106],"work,":[108],"two":[109],"types":[110],"(analog":[114],"digital)":[116],"were":[117],"connected":[118],"radio":[121],"frequency":[122],"identification":[123],"(RFID)":[124],"tag":[125],"successfully":[127],"measured":[128]},"counts_by_year":[{"year":2023,"cited_by_count":2},{"year":2019,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}