{"id":"https://openalex.org/W2907907212","doi":"https://doi.org/10.1109/icsens.2018.8589847","title":"A Hybrid Three-Way Valve for Gas Chromatography Systems","display_name":"A Hybrid Three-Way Valve for Gas Chromatography Systems","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2907907212","doi":"https://doi.org/10.1109/icsens.2018.8589847","mag":"2907907212"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2018.8589847","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589847","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5037037333","display_name":"Hsueh-Tsung Lu","orcid":"https://orcid.org/0000-0001-6145-6771"},"institutions":[{"id":"https://openalex.org/I4210153300","display_name":"Shanghai Research Center for Wireless Communications","ror":"https://ror.org/04xfd0826","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210153300"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hsueh-Tsung Lu","raw_affiliation_strings":["Center for Wireless Integrated MicroSensing and System (WIMS), Ann Arbor, USA","Department of Mechanical Engineering, Ann Arbor, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Wireless Integrated MicroSensing and System (WIMS), Ann Arbor, USA","institution_ids":["https://openalex.org/I4210153300"]},{"raw_affiliation_string":"Department of Mechanical Engineering, Ann Arbor, USA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5084912799","display_name":"Yutao Qin","orcid":"https://orcid.org/0000-0003-4589-4485"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yutao Qin","raw_affiliation_strings":["Department of Mechanical Engineering, Ann Arbor, USA","Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, Ann Arbor, USA","institution_ids":[]},{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA","institution_ids":["https://openalex.org/I27837315"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5016991190","display_name":"Yogesh B. Gianchandani","orcid":"https://orcid.org/0000-0003-2281-3937"},"institutions":[{"id":"https://openalex.org/I27837315","display_name":"University of Michigan","ror":"https://ror.org/00jmfr291","country_code":"US","type":"education","lineage":["https://openalex.org/I27837315"]},{"id":"https://openalex.org/I4210153300","display_name":"Shanghai Research Center for Wireless Communications","ror":"https://ror.org/04xfd0826","country_code":"CN","type":"facility","lineage":["https://openalex.org/I4210153300"]}],"countries":["CN","US"],"is_corresponding":false,"raw_author_name":"Yogesh B. Gianchandani","raw_affiliation_strings":["Department of Electrical Engineering and Computer Science, Center for Wireless Integrated MicroSensing and System (WIMS), Ann Arbor, USA","Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, Center for Wireless Integrated MicroSensing and System (WIMS), Ann Arbor, USA","institution_ids":["https://openalex.org/I4210153300"]},{"raw_affiliation_string":"Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, USA","institution_ids":["https://openalex.org/I27837315"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2164,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.53627379,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11407","display_name":"Innovative Microfluidic and Catalytic Techniques Innovation","score":0.9904999732971191,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9901000261306763,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/membrane","display_name":"Membrane","score":0.6172654628753662},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.5975546836853027},{"id":"https://openalex.org/keywords/conductance","display_name":"Conductance","score":0.489319771528244},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41252994537353516},{"id":"https://openalex.org/keywords/path","display_name":"Path (computing)","score":0.4114105999469757},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39886346459388733},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.32779186964035034},{"id":"https://openalex.org/keywords/chemistry","display_name":"Chemistry","score":0.32551050186157227},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3239360451698303},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2867811918258667},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28088444471359253},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.2754310965538025}],"concepts":[{"id":"https://openalex.org/C41625074","wikidata":"https://www.wikidata.org/wiki/Q176088","display_name":"Membrane","level":2,"score":0.6172654628753662},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.5975546836853027},{"id":"https://openalex.org/C121932024","wikidata":"https://www.wikidata.org/wiki/Q5159376","display_name":"Conductance","level":2,"score":0.489319771528244},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41252994537353516},{"id":"https://openalex.org/C2777735758","wikidata":"https://www.wikidata.org/wiki/Q817765","display_name":"Path (computing)","level":2,"score":0.4114105999469757},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39886346459388733},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.32779186964035034},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.32551050186157227},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3239360451698303},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2867811918258667},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28088444471359253},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2754310965538025},{"id":"https://openalex.org/C26873012","wikidata":"https://www.wikidata.org/wiki/Q214781","display_name":"Condensed matter physics","level":1,"score":0.0},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2018.8589847","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589847","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6100000143051147}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W1963622178","https://openalex.org/W2015075262","https://openalex.org/W2052945395","https://openalex.org/W2085817796","https://openalex.org/W2108943437","https://openalex.org/W2118529203","https://openalex.org/W2122282498","https://openalex.org/W2129445978","https://openalex.org/W2133749315","https://openalex.org/W2139712155","https://openalex.org/W2149182757","https://openalex.org/W2163781922","https://openalex.org/W2166519670","https://openalex.org/W2170454608","https://openalex.org/W2234054835"],"related_works":["https://openalex.org/W2150391754","https://openalex.org/W2064710306","https://openalex.org/W1979156653","https://openalex.org/W1997484252","https://openalex.org/W2249456921","https://openalex.org/W2184834470","https://openalex.org/W2334502792","https://openalex.org/W2035271760","https://openalex.org/W2133255487","https://openalex.org/W4244927301"],"abstract_inverted_index":{"This":[0],"paper":[1],"reports":[2],"a":[3,8,125],"three-way":[4,67,95,115],"valve":[5,14,22,50,68,116,147],"that":[6,47],"combines":[7],"lithographically":[9],"microfabricated":[10,49],"silicon":[11],"substrate":[12],"and":[13,20,32,60,132],"seats":[15],"with":[16,45],"prefabricated":[17,55],"piezoelectric":[18],"actuators":[19],"polyimide":[21],"membranes.":[23],"The":[24,97],"microvalve":[25],"is":[26,90,103],"designed":[27],"for":[28,39,73,93],"low":[29],"dead":[30],"volume":[31],"flow":[33,75,82,111,120,127],"channel":[34],"chemical":[35],"resistance,":[36],"as":[37],"needed":[38],"gas":[40],"chromatography":[41],"systems.":[42],"In":[43,143],"contrast":[44],"valves":[46],"use":[48],"membranes,":[51],"the":[52,62,81,87,91,101,114,146],"incorporation":[53],"of":[54,100,113,122,129,137],"membranes":[56],"significantly":[57],"simplifies":[58],"manufacturing":[59],"improves":[61],"structural":[63],"robustness.":[64],"Further,":[65],"this":[66],"provides":[69,117],"independent":[70],"open-close":[71,135],"control":[72],"each":[74],"path,":[76],"rather":[77],"than":[78],"simply":[79],"switching":[80],"from":[83],"one":[84],"path":[85,112],"to":[86],"other,":[88],"which":[89],"case":[92],"most":[94],"valves.":[96],"overall":[98,134],"footprint":[99],"device":[102],"3\u00d73\u00d71.S":[104],"cm":[105],"<sup":[106,139],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[107,140],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">3</sup>":[108,141],",":[109],"Each":[110],"an":[118,133],"open-state":[119],"conductance":[121,128],"4.42":[123],"sccmlkPa,":[124,131],"leakage":[126],"0.0012":[130],"ratio":[136],"3.68\u00d710":[138],".":[142],"preliminary":[144],"tests,":[145],"had":[148],"been":[149],"switched":[150],"1900":[151],"times":[152],"over":[153],"24":[154],"hours":[155],"without":[156],"showing":[157],"any":[158],"performance":[159],"variation.":[160]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2019,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}