{"id":"https://openalex.org/W2907970711","doi":"https://doi.org/10.1109/icsens.2018.8589720","title":"3D Printed Phalanx Packaged with Embedded Pressure Sensor","display_name":"3D Printed Phalanx Packaged with Embedded Pressure Sensor","publication_year":2018,"publication_date":"2018-10-01","ids":{"openalex":"https://openalex.org/W2907970711","doi":"https://doi.org/10.1109/icsens.2018.8589720","mag":"2907970711"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2018.8589720","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589720","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5042472675","display_name":"Markellos Ntagios","orcid":"https://orcid.org/0000-0002-1908-2494"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Markellos Ntagios","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075958632","display_name":"William Taube Navaraj","orcid":"https://orcid.org/0000-0003-4753-2015"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"William Taube Navaraj","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K","institution_ids":["https://openalex.org/I7882870"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085150253","display_name":"Ravinder Dahiya","orcid":"https://orcid.org/0000-0002-3858-3841"},"institutions":[{"id":"https://openalex.org/I7882870","display_name":"University of Glasgow","ror":"https://ror.org/00vtgdb53","country_code":"GB","type":"education","lineage":["https://openalex.org/I7882870"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Ravinder Dahiya","raw_affiliation_strings":["Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, U.K","institution_ids":["https://openalex.org/I7882870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I7882870"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":14,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10914","display_name":"Tactile and Sensory Interactions","score":0.9937000274658203,"subfield":{"id":"https://openalex.org/subfields/2805","display_name":"Cognitive Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.992900013923645,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/3d-printing","display_name":"3D printing","score":0.8037197589874268},{"id":"https://openalex.org/keywords/soft-robotics","display_name":"Soft robotics","score":0.6887851357460022},{"id":"https://openalex.org/keywords/3d-printed","display_name":"3d printed","score":0.6438853740692139},{"id":"https://openalex.org/keywords/robustness","display_name":"Robustness (evolution)","score":0.6055740118026733},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.596274733543396},{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.58579021692276},{"id":"https://openalex.org/keywords/robotics","display_name":"Robotics","score":0.4824593663215637},{"id":"https://openalex.org/keywords/embedding","display_name":"Embedding","score":0.4194846749305725},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.3659214675426483},{"id":"https://openalex.org/keywords/robot","display_name":"Robot","score":0.35642194747924805},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.27107980847358704},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2609555721282959},{"id":"https://openalex.org/keywords/biomedical-engineering","display_name":"Biomedical engineering","score":0.10470932722091675}],"concepts":[{"id":"https://openalex.org/C524769229","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3D printing","level":2,"score":0.8037197589874268},{"id":"https://openalex.org/C2776058767","wikidata":"https://www.wikidata.org/wiki/Q24327151","display_name":"Soft robotics","level":3,"score":0.6887851357460022},{"id":"https://openalex.org/C3019308078","wikidata":"https://www.wikidata.org/wiki/Q229367","display_name":"3d printed","level":2,"score":0.6438853740692139},{"id":"https://openalex.org/C63479239","wikidata":"https://www.wikidata.org/wiki/Q7353546","display_name":"Robustness (evolution)","level":3,"score":0.6055740118026733},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.596274733543396},{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.58579021692276},{"id":"https://openalex.org/C34413123","wikidata":"https://www.wikidata.org/wiki/Q170978","display_name":"Robotics","level":3,"score":0.4824593663215637},{"id":"https://openalex.org/C41608201","wikidata":"https://www.wikidata.org/wiki/Q980509","display_name":"Embedding","level":2,"score":0.4194846749305725},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.3659214675426483},{"id":"https://openalex.org/C90509273","wikidata":"https://www.wikidata.org/wiki/Q11012","display_name":"Robot","level":2,"score":0.35642194747924805},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.27107980847358704},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2609555721282959},{"id":"https://openalex.org/C136229726","wikidata":"https://www.wikidata.org/wiki/Q327092","display_name":"Biomedical engineering","level":1,"score":0.10470932722091675},{"id":"https://openalex.org/C55493867","wikidata":"https://www.wikidata.org/wiki/Q7094","display_name":"Biochemistry","level":1,"score":0.0},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C104317684","wikidata":"https://www.wikidata.org/wiki/Q7187","display_name":"Gene","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2018.8589720","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2018.8589720","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.44999998807907104,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":14,"referenced_works":["https://openalex.org/W247229540","https://openalex.org/W1978809079","https://openalex.org/W1995213905","https://openalex.org/W2004835256","https://openalex.org/W2044479329","https://openalex.org/W2045279221","https://openalex.org/W2071443844","https://openalex.org/W2103288831","https://openalex.org/W2127045241","https://openalex.org/W2131496831","https://openalex.org/W2133835651","https://openalex.org/W2171130677","https://openalex.org/W2343044516","https://openalex.org/W2598909259"],"related_works":["https://openalex.org/W4322731033","https://openalex.org/W1955801659","https://openalex.org/W3036311796","https://openalex.org/W4367665844","https://openalex.org/W4283740974","https://openalex.org/W4285543619","https://openalex.org/W4312473168","https://openalex.org/W4319589397","https://openalex.org/W2326585759","https://openalex.org/W2582005554"],"abstract_inverted_index":{"3D":[0,37,45,66,83],"printing":[1,27,38,84,108],"is":[2,124],"widely":[3],"used":[4],"as":[5,61,92,137,139],"the":[6,14,65,109,118,122,134,142],"quickest":[7],"way":[8,41,80],"to":[9,13,42,53,81,86,140],"transform":[10],"design":[11],"concept":[12,101],"physical":[15],"implementation.":[16],"Recent":[17],"advances":[18],"in":[19,58,126],"this":[20],"field":[21],"of":[22,28,31,88,112,128,133,147],"additive":[23],"manufacturing":[24],"have":[25,54],"allowed":[26],"several":[29],"types":[30],"polymers,":[32],"including":[33],"soft":[34,115],"material.":[35,116],"While":[36],"allows":[39],"easy":[40],"develop":[43,87],"complex":[44,89],"shapes,":[46],"it":[47],"does":[48],"not":[49],"allow":[50],"these":[51],"shapes":[52,90],"sensory":[55,70],"capability.":[56],"However,":[57],"applications":[59],"such":[60,91],"robotics":[62],"and":[63,107],"prosthetics,":[64],"printed":[67],"structures":[68],"with":[69,95,114],"capability":[71],"are":[72],"much":[73],"needed.":[74],"This":[75],"paper":[76],"presents":[77],"an":[78],"innovative":[79],"use":[82],"method":[85],"robotic":[93,144],"finger":[94,113],"embedded":[96],"capacitive":[97],"touch":[98,119],"sensors.":[99],"The":[100],"has":[102],"been":[103],"demonstrated":[104],"by":[105],"designing":[106],"distal":[110],"phalanx":[111,123],"Embedding":[117],"sensors":[120],"within":[121],"advantageous":[125],"terms":[127],"robustness,":[129],"aesthetics,":[130],"water/ambient-proofing,":[131],"reliability":[132],"sensing":[135],"layer":[136],"well":[138],"overcome":[141],"traditional":[143],"skin":[145],"issue":[146],"wiring":[148],"complexity.":[149]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":3},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":4},{"year":2019,"cited_by_count":2}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}