{"id":"https://openalex.org/W2782538250","doi":"https://doi.org/10.1109/icsens.2017.8233902","title":"Semi-numeric model of capacitive touch sensors integrated into coatings of metallic substrates","display_name":"Semi-numeric model of capacitive touch sensors integrated into coatings of metallic substrates","publication_year":2017,"publication_date":"2017-10-01","ids":{"openalex":"https://openalex.org/W2782538250","doi":"https://doi.org/10.1109/icsens.2017.8233902","mag":"2782538250"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2017.8233902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2017.8233902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026712389","display_name":"Thomas Voglhuber\u2013Brunnmaier","orcid":"https://orcid.org/0000-0002-4678-4862"},"institutions":[{"id":"https://openalex.org/I121883995","display_name":"Johannes Kepler University of Linz","ror":"https://ror.org/052r2xn60","country_code":"AT","type":"education","lineage":["https://openalex.org/I121883995"]}],"countries":["AT"],"is_corresponding":true,"raw_author_name":"Thomas Voglhuber-Brunnmaier","raw_affiliation_strings":["Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria","institution_ids":["https://openalex.org/I121883995"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5046396356","display_name":"Johannes K. Sell","orcid":null},"institutions":[{"id":"https://openalex.org/I121883995","display_name":"Johannes Kepler University of Linz","ror":"https://ror.org/052r2xn60","country_code":"AT","type":"education","lineage":["https://openalex.org/I121883995"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Johannes K. Sell","raw_affiliation_strings":["Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria","institution_ids":["https://openalex.org/I121883995"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5085874325","display_name":"Bernhard Jakoby","orcid":"https://orcid.org/0000-0002-2918-7150"},"institutions":[{"id":"https://openalex.org/I121883995","display_name":"Johannes Kepler University of Linz","ror":"https://ror.org/052r2xn60","country_code":"AT","type":"education","lineage":["https://openalex.org/I121883995"]}],"countries":["AT"],"is_corresponding":false,"raw_author_name":"Bernhard Jakoby","raw_affiliation_strings":["Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria"],"affiliations":[{"raw_affiliation_string":"Institute for Microelectronics and Microsensors, Johannes Kepler University, Linz, Austria","institution_ids":["https://openalex.org/I121883995"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5026712389"],"corresponding_institution_ids":["https://openalex.org/I121883995"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.19040457,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11799","display_name":"Adhesion, Friction, and Surface Interactions","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.859724760055542},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.8078488111495972},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7519519329071045},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6307393312454224},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.6097245216369629},{"id":"https://openalex.org/keywords/conductivity","display_name":"Conductivity","score":0.5139605402946472},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.48750922083854675},{"id":"https://openalex.org/keywords/coupling","display_name":"Coupling (piping)","score":0.4759804308414459},{"id":"https://openalex.org/keywords/acoustics","display_name":"Acoustics","score":0.4284426271915436},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.4245203137397766},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3748769760131836},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2596893906593323},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2280668318271637},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.1617988646030426},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.14855346083641052},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10575240850448608},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.10354447364807129},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.09547621011734009}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.859724760055542},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.8078488111495972},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7519519329071045},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6307393312454224},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.6097245216369629},{"id":"https://openalex.org/C131540310","wikidata":"https://www.wikidata.org/wiki/Q907564","display_name":"Conductivity","level":2,"score":0.5139605402946472},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.48750922083854675},{"id":"https://openalex.org/C131584629","wikidata":"https://www.wikidata.org/wiki/Q4308705","display_name":"Coupling (piping)","level":2,"score":0.4759804308414459},{"id":"https://openalex.org/C24890656","wikidata":"https://www.wikidata.org/wiki/Q82811","display_name":"Acoustics","level":1,"score":0.4284426271915436},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.4245203137397766},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3748769760131836},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2596893906593323},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2280668318271637},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.1617988646030426},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.14855346083641052},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10575240850448608},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.10354447364807129},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.09547621011734009},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2017.8233902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2017.8233902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":9,"referenced_works":["https://openalex.org/W1977539090","https://openalex.org/W2025495130","https://openalex.org/W2045149250","https://openalex.org/W2076755832","https://openalex.org/W2085889410","https://openalex.org/W2135994920","https://openalex.org/W2329472752","https://openalex.org/W2490906765","https://openalex.org/W2574647322"],"related_works":["https://openalex.org/W2348740411","https://openalex.org/W1966596465","https://openalex.org/W2051563071","https://openalex.org/W4386858602","https://openalex.org/W2337947459","https://openalex.org/W2118205267","https://openalex.org/W2126912594","https://openalex.org/W1988444705","https://openalex.org/W2768092448","https://openalex.org/W2895758062"],"abstract_inverted_index":{"An":[0],"efficient":[1],"semi-numeric":[2],"boundary":[3],"element":[4],"method":[5,37,60],"for":[6,55],"the":[7,10,36,74,78,85],"calculation":[8],"of":[9,12,24,35,48],"response":[11],"interdigitated":[13,79],"touch":[14,28],"sensors":[15,29],"is":[16,38,61,84],"introduced":[17],"and":[18,45],"used":[19,62],"to":[20,63],"demonstrate":[21],"interesting":[22],"properties":[23],"embedded":[25],"printed":[26],"capacitive":[27],"on":[30],"steel":[31],"substrates.":[32],"The":[33,59],"strength":[34],"that":[39,72],"layer":[40,49],"compositions":[41],"with":[42],"finite":[43],"conductivity":[44],"arbitrary":[46],"sequence":[47],"permittivities":[50],"can":[51],"be":[52],"calculated":[53],"efficiently":[54],"all":[56],"aspect":[57],"ratios.":[58],"further":[64],"investigate":[65],"previous":[66],"findings,":[67],"where":[68],"we":[69],"have":[70],"shown,":[71],"measuring":[73],"coupling":[75],"capacitance":[76],"between":[77],"fingers":[80],"at":[81],"low":[82],"frequencies":[83],"most":[86],"sensitive":[87],"approach.":[88]},"counts_by_year":[{"year":2023,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}