{"id":"https://openalex.org/W2576302841","doi":"https://doi.org/10.1109/icsens.2016.7808649","title":"A novel packaging stress isolation structure for SOI based MEMS gyroscopes","display_name":"A novel packaging stress isolation structure for SOI based MEMS gyroscopes","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2576302841","doi":"https://doi.org/10.1109/icsens.2016.7808649","mag":"2576302841"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2016.7808649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5091525557","display_name":"Yongcun Hao","orcid":"https://orcid.org/0000-0003-4853-5808"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Yongcun Hao","raw_affiliation_strings":["Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071859531","display_name":"Weizheng Yuan","orcid":"https://orcid.org/0000-0001-9490-7188"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Weizheng Yuan","raw_affiliation_strings":["Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054840923","display_name":"Jianbing Xie","orcid":"https://orcid.org/0000-0002-2289-2076"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianbing Xie","raw_affiliation_strings":["Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China","institution_ids":["https://openalex.org/I17145004"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5077311643","display_name":"Honglong Chang","orcid":"https://orcid.org/0000-0003-0400-3658"},"institutions":[{"id":"https://openalex.org/I17145004","display_name":"Northwestern Polytechnical University","ror":"https://ror.org/01y0j0j86","country_code":"CN","type":"education","lineage":["https://openalex.org/I17145004"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Honglong Chang","raw_affiliation_strings":["Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China"],"affiliations":[{"raw_affiliation_string":"Ministry of Education Key Laboratory of Micro & Nano Systems for Aerospace, Northwestern Polytechnical University, Xi'an, China","institution_ids":["https://openalex.org/I17145004"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5091525557"],"corresponding_institution_ids":["https://openalex.org/I17145004"],"apc_list":null,"apc_paid":null,"fwci":0.1838,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.60896144,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/gyroscope","display_name":"Gyroscope","score":0.8767763376235962},{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.8272685408592224},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.7833482027053833},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.58690345287323},{"id":"https://openalex.org/keywords/frame","display_name":"Frame (networking)","score":0.5695679187774658},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5683091282844543},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.4642335772514343},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.4111217260360718},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4100757837295532},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.34730058908462524},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2661767601966858},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.24172794818878174},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.1622944176197052},{"id":"https://openalex.org/keywords/aerospace-engineering","display_name":"Aerospace engineering","score":0.08321398496627808}],"concepts":[{"id":"https://openalex.org/C158488048","wikidata":"https://www.wikidata.org/wiki/Q483400","display_name":"Gyroscope","level":2,"score":0.8767763376235962},{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.8272685408592224},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.7833482027053833},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.58690345287323},{"id":"https://openalex.org/C126042441","wikidata":"https://www.wikidata.org/wiki/Q1324888","display_name":"Frame (networking)","level":2,"score":0.5695679187774658},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5683091282844543},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.4642335772514343},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.4111217260360718},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4100757837295532},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.34730058908462524},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2661767601966858},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.24172794818878174},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.1622944176197052},{"id":"https://openalex.org/C146978453","wikidata":"https://www.wikidata.org/wiki/Q3798668","display_name":"Aerospace engineering","level":1,"score":0.08321398496627808},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2016.7808649","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808649","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":11,"referenced_works":["https://openalex.org/W1583724401","https://openalex.org/W1789682388","https://openalex.org/W1969967856","https://openalex.org/W2036055180","https://openalex.org/W2048616414","https://openalex.org/W2105873508","https://openalex.org/W2242649539","https://openalex.org/W2319570990","https://openalex.org/W2413497123","https://openalex.org/W2516869960","https://openalex.org/W2556809493"],"related_works":["https://openalex.org/W1889129279","https://openalex.org/W4387451989","https://openalex.org/W2272290532","https://openalex.org/W2532412374","https://openalex.org/W2063137106","https://openalex.org/W23275807","https://openalex.org/W2104300577","https://openalex.org/W2358715846","https://openalex.org/W2761234876","https://openalex.org/W1559034281"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"propose":[4],"a":[5,30,38],"packaging":[6,67,105],"stress":[7,68,73,98,106],"isolation":[8],"structure":[9,20],"for":[10],"the":[11,24,46,49,58,66,71,82,88,91,104,109],"silicon-on-insulator":[12],"(SOI)":[13],"based":[14],"microelectromechanical":[15],"systems":[16],"(MEMS)":[17],"gyroscopes.":[18],"The":[19,41,75,100],"is":[21,43,111],"designed":[22],"on":[23,45],"handle":[25,60],"layer":[26,61],"and":[27,37,51,69,84],"consists":[28],"of":[29,48,57,116],"circular":[31],"disk,":[32],"eight":[33],"\u201cL-shape\u201d":[34],"elastic":[35,76],"beams,":[36],"support":[39,92],"frame.":[40],"disk":[42,89],"located":[44],"center":[47],"die":[50],"occupies":[52],"less":[53],"than":[54],"5":[55],"percent":[56],"whole":[59],"area":[62],"which":[63,94],"can":[64,95],"reduce":[65],"avoid":[70],"uneven":[72],"distribution.":[74],"beams":[77],"are":[78],"orthogonally":[79],"distributed":[80],"along":[81],"x":[83],"y":[85],"axis":[86],"connecting":[87],"with":[90],"frame,":[93],"further":[96],"suppress":[97],"evenly.":[99],"results":[101],"reveal":[102],"that":[103],"transferred":[107],"to":[108],"gyroscope":[110],"reduced":[112],"by":[113],"two":[114],"orders":[115],"magnitude.":[117]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2016,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}