{"id":"https://openalex.org/W2575045955","doi":"https://doi.org/10.1109/icsens.2016.7808583","title":"Challenges of monolithic integration for SiGe MEMS technology","display_name":"Challenges of monolithic integration for SiGe MEMS technology","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2575045955","doi":"https://doi.org/10.1109/icsens.2016.7808583","mag":"2575045955"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2016.7808583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5000306179","display_name":"A. Chaudhuri","orcid":"https://orcid.org/0009-0001-8502-003X"},"institutions":[{"id":"https://openalex.org/I95674353","display_name":"UCLouvain","ror":"https://ror.org/02495e989","country_code":"BE","type":"education","lineage":["https://openalex.org/I95674353"]}],"countries":["BE"],"is_corresponding":true,"raw_author_name":"A. Ray Chaudhuri","raw_affiliation_strings":["imec, BELGIUM, Universit\u00e9 Catholique de Louvain, BELGIUM, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, BELGIUM, Universit\u00e9 Catholique de Louvain, BELGIUM, Leuven, Belgium","institution_ids":["https://openalex.org/I95674353"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5106035657","display_name":"S. Severi","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"S. Severi","raw_affiliation_strings":["imec, BELGIUM, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, BELGIUM, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5112216068","display_name":"Philippe H\u00e9lin","orcid":null},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"P. Helin","raw_affiliation_strings":["imec, BELGIUM, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, BELGIUM, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5111556790","display_name":"Laurent Francis","orcid":null},"institutions":[{"id":"https://openalex.org/I95674353","display_name":"UCLouvain","ror":"https://ror.org/02495e989","country_code":"BE","type":"education","lineage":["https://openalex.org/I95674353"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"L. A. Francis","raw_affiliation_strings":["Universit\u00e9 Catholique de Louvain, BELGIUM, Belgium"],"affiliations":[{"raw_affiliation_string":"Universit\u00e9 Catholique de Louvain, BELGIUM, Belgium","institution_ids":["https://openalex.org/I95674353"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5108371019","display_name":"H.A.C. Tilmans","orcid":"https://orcid.org/0000-0003-4240-4962"},"institutions":[{"id":"https://openalex.org/I4210114974","display_name":"IMEC","ror":"https://ror.org/02kcbn207","country_code":"BE","type":"nonprofit","lineage":["https://openalex.org/I4210114974"]}],"countries":["BE"],"is_corresponding":false,"raw_author_name":"H. A. C. Tilmans","raw_affiliation_strings":["imec, BELGIUM, Leuven, Belgium"],"affiliations":[{"raw_affiliation_string":"imec, BELGIUM, Leuven, Belgium","institution_ids":["https://openalex.org/I4210114974"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5000306179"],"corresponding_institution_ids":["https://openalex.org/I95674353"],"apc_list":null,"apc_paid":null,"fwci":0.1838,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.60856984,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10299","display_name":"Photonic and Optical Devices","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.8952882289886475},{"id":"https://openalex.org/keywords/accelerometer","display_name":"Accelerometer","score":0.8856475353240967},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7296958565711975},{"id":"https://openalex.org/keywords/surface-micromachining","display_name":"Surface micromachining","score":0.42856642603874207},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.41400110721588135},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.41149812936782837},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.39387738704681396},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.3741545081138611},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3177212178707123},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2564648389816284},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.14284169673919678}],"concepts":[{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.8952882289886475},{"id":"https://openalex.org/C89805583","wikidata":"https://www.wikidata.org/wiki/Q192940","display_name":"Accelerometer","level":2,"score":0.8856475353240967},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7296958565711975},{"id":"https://openalex.org/C145667562","wikidata":"https://www.wikidata.org/wiki/Q7646003","display_name":"Surface micromachining","level":4,"score":0.42856642603874207},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.41400110721588135},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.41149812936782837},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.39387738704681396},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.3741545081138611},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3177212178707123},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2564648389816284},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.14284169673919678},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icsens.2016.7808583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.4399999976158142,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W1494772871","https://openalex.org/W1968438324","https://openalex.org/W2107367107","https://openalex.org/W2117860575"],"related_works":["https://openalex.org/W3161496874","https://openalex.org/W2026330382","https://openalex.org/W2915680872","https://openalex.org/W2287189152","https://openalex.org/W2114051864","https://openalex.org/W1563566515","https://openalex.org/W1571766405","https://openalex.org/W1014036322","https://openalex.org/W2463122996","https://openalex.org/W2689688556"],"abstract_inverted_index":{"The":[0,23,57],"paper":[1],"describes":[2],"the":[3,42,49,53,61,64],"key":[4],"challenges":[5],"of":[6,55,60],"CMOS":[7,21,68],"integrated":[8],"monolithic":[9],"MEMS":[10,14,26,65],"Accelerometer":[11,62],"with":[12,17],"SiGe":[13,25],"technology":[15,27],"combined":[16],"TSMC":[18],"0.18":[19],"\u03bcm":[20],"technology.":[22],"developed":[24],"shows":[28],"ability":[29],"to":[30,40],"integrate":[31],"above":[32],"any":[33],"standard":[34],"foundry":[35],"process.":[36],"This":[37],"allows":[38],"us":[39],"build":[41],"smallest":[43],"form-factor":[44],"surface":[45],"micromachined":[46],"accelerometer":[47],"for":[48],"consumer":[50],"application":[51],"in":[52],"range":[54],"\u00b12G.":[56],"total":[58],"area":[59],"including":[63],"structure":[66],"and":[67],"is":[69],"1.35":[70,73],"mm":[71],"\u00d7":[72],"mm.":[74]},"counts_by_year":[{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}