{"id":"https://openalex.org/W2573309236","doi":"https://doi.org/10.1109/icsens.2016.7808446","title":"A 48-well transparent microelectrode array fabricated utilizing a flexible, \u201cwrapped around\u201d interconnect technology","display_name":"A 48-well transparent microelectrode array fabricated utilizing a flexible, \u201cwrapped around\u201d interconnect technology","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2573309236","doi":"https://doi.org/10.1109/icsens.2016.7808446","mag":"2573309236"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2016.7808446","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808446","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"https://stars.library.ucf.edu/scopus2015/6916","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5007089903","display_name":"Phillip Tyler","orcid":null},"institutions":[{"id":"https://openalex.org/I4210167161","display_name":"Axion Biosystems (United States)","ror":"https://ror.org/05w8qnb04","country_code":"US","type":"company","lineage":["https://openalex.org/I4210167161"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Phillip E. Tyler","raw_affiliation_strings":["Senior MEMS Development Engineer, Axion BioSystems Inc., Atlanta, GA, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Senior MEMS Development Engineer, Axion BioSystems Inc., Atlanta, GA, USA","institution_ids":["https://openalex.org/I4210167161"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001459584","display_name":"Swaminathan Rajaraman","orcid":"https://orcid.org/0000-0003-2279-2013"},"institutions":[{"id":"https://openalex.org/I106165777","display_name":"University of Central Florida","ror":"https://ror.org/036nfer12","country_code":"US","type":"education","lineage":["https://openalex.org/I106165777"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Swaminathan Rajaraman","raw_affiliation_strings":["NSTC, University of Central Florida, Orlando, FL, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"NSTC, University of Central Florida, Orlando, FL, USA","institution_ids":["https://openalex.org/I106165777"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.13375821,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},"topics":[{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9947999715805054,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microelectrode","display_name":"Microelectrode","score":0.7605552673339844},{"id":"https://openalex.org/keywords/microfabrication","display_name":"Microfabrication","score":0.7393518686294556},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6314553618431091},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6248154640197754},{"id":"https://openalex.org/keywords/multielectrode-array","display_name":"Multielectrode array","score":0.5831036567687988},{"id":"https://openalex.org/keywords/throughput","display_name":"Throughput","score":0.5759339332580566},{"id":"https://openalex.org/keywords/interconnectivity","display_name":"Interconnectivity","score":0.5575888752937317},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.4669882655143738},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.44689589738845825},{"id":"https://openalex.org/keywords/integrated-circuit-packaging","display_name":"Integrated circuit packaging","score":0.42940789461135864},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.42750710248947144},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.4026021957397461},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3870749771595001},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.37768077850341797},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.36655718088150024},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.3657134771347046},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.22347068786621094},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.12019431591033936},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.11497828364372253},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.08193641901016235},{"id":"https://openalex.org/keywords/wireless","display_name":"Wireless","score":0.07685527205467224}],"concepts":[{"id":"https://openalex.org/C111670793","wikidata":"https://www.wikidata.org/wiki/Q16979465","display_name":"Microelectrode","level":3,"score":0.7605552673339844},{"id":"https://openalex.org/C527607","wikidata":"https://www.wikidata.org/wiki/Q175538","display_name":"Microfabrication","level":4,"score":0.7393518686294556},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6314553618431091},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6248154640197754},{"id":"https://openalex.org/C95967509","wikidata":"https://www.wikidata.org/wiki/Q1952355","display_name":"Multielectrode array","level":4,"score":0.5831036567687988},{"id":"https://openalex.org/C157764524","wikidata":"https://www.wikidata.org/wiki/Q1383412","display_name":"Throughput","level":3,"score":0.5759339332580566},{"id":"https://openalex.org/C25516864","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnectivity","level":2,"score":0.5575888752937317},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.4669882655143738},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.44689589738845825},{"id":"https://openalex.org/C186260285","wikidata":"https://www.wikidata.org/wiki/Q759494","display_name":"Integrated circuit packaging","level":3,"score":0.42940789461135864},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.42750710248947144},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.4026021957397461},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3870749771595001},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.37768077850341797},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.36655718088150024},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3657134771347046},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.22347068786621094},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.12019431591033936},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.11497828364372253},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.08193641901016235},{"id":"https://openalex.org/C555944384","wikidata":"https://www.wikidata.org/wiki/Q249","display_name":"Wireless","level":2,"score":0.07685527205467224},{"id":"https://openalex.org/C185592680","wikidata":"https://www.wikidata.org/wiki/Q2329","display_name":"Chemistry","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C147789679","wikidata":"https://www.wikidata.org/wiki/Q11372","display_name":"Physical chemistry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icsens.2016.7808446","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808446","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},{"id":"pmh:oai:stars.library.ucf.edu:scopus2015-7915","is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/scopus2015/6916","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Scopus Export 2015-2019","raw_type":"text"}],"best_oa_location":{"id":"pmh:oai:stars.library.ucf.edu:scopus2015-7915","is_oa":true,"landing_page_url":"https://stars.library.ucf.edu/scopus2015/6916","pdf_url":null,"source":{"id":"https://openalex.org/S4210172555","display_name":"Journal of International Crisis and Risk Communication Research","issn_l":"2576-0017","issn":["2576-0017","2576-0025"],"is_oa":true,"is_in_doaj":false,"is_core":true,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"journal"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"Scopus Export 2015-2019","raw_type":"text"},"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320332161","display_name":"National Institutes of Health","ror":"https://ror.org/01cwqze88"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W45913439","https://openalex.org/W2153619864"],"related_works":["https://openalex.org/W2364669607","https://openalex.org/W1974387788","https://openalex.org/W2061877343","https://openalex.org/W2028205923","https://openalex.org/W2092214915","https://openalex.org/W2381760774","https://openalex.org/W2037345099","https://openalex.org/W4386697944","https://openalex.org/W2768056422","https://openalex.org/W1988115803"],"abstract_inverted_index":{"This":[0,124],"paper":[1],"describes":[2],"the":[3,55,75,84,95,110,119],"microfabrication,":[4],"assembly":[5],"and":[6,38,50,87,108,117,130],"preliminary":[7],"characterization":[8],"of":[9,121],"a":[10,16,21,46,62,71,101],"flexible":[11,31],"multi-layer":[12],"circuit":[13,32,96],"wrapped":[14,99],"around":[15,100],"base":[17],"plate":[18],"utilized":[19],"as":[20],"high-throughput":[22,63,85],"48-well":[23],"Microelectrode":[24],"Array":[25],"(MEA)":[26],"device.":[27],"Roll":[28],"to":[29,42,58,69,77,83,97],"roll":[30],"technology":[33,68],"allows":[34,93],"for":[35,54,94,112],"fine":[36],"lines":[37],"spaces":[39],"(<;25":[40],"\u03bcm)":[41],"be":[43,98],"fabricated":[44],"in":[45],"large":[47],"area":[48],"fashion":[49],"has":[51,74,126],"been":[52,127],"exploited":[53],"first":[56],"time":[57],"our":[59],"knowledge":[60],"toward":[61],"MEA":[64],"application.":[65],"Utilizing":[66],"this":[67],"develop":[70],"microelectrode":[72],"array":[73],"opportunity":[76],"provide":[78],"cost-effective,":[79],"disposable":[80],"consumable":[81],"devices":[82],"biotechnology":[86],"biosensor":[88],"screening":[89],"markets.":[90],"The":[91],"flexibility":[92],"rigid":[102],"substrate,":[103],"thereby":[104],"allowing":[105],"backside":[106],"interconnectivity":[107],"eliminating":[109],"need":[111],"expensive":[113],"conductive":[114],"through":[115],"vias":[116],"lowering":[118],"number":[120],"processing":[122],"steps.":[123],"device":[125],"further":[128],"assembled":[129],"characterized.":[131]},"counts_by_year":[],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}