{"id":"https://openalex.org/W2575027172","doi":"https://doi.org/10.1109/icsens.2016.7808438","title":"Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive","display_name":"Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2575027172","doi":"https://doi.org/10.1109/icsens.2016.7808438","mag":"2575027172"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2016.7808438","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808438","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101141819","display_name":"Xingjun Xue","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xingjun Xue","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5038189630","display_name":"Shujie Yang","orcid":"https://orcid.org/0000-0003-2626-3397"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shujie Yang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5068101189","display_name":"Dong Wu","orcid":"https://orcid.org/0000-0003-0623-1515"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dong Wu","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102144520","display_name":"Liyang Pan","orcid":null},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Liyang Pan","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029441301","display_name":"Zheyao Wang","orcid":"https://orcid.org/0000-0001-6196-8865"},"institutions":[{"id":"https://openalex.org/I4210119392","display_name":"Institute of Microelectronics","ror":"https://ror.org/02s6gs133","country_code":"CN","type":"facility","lineage":["https://openalex.org/I19820366","https://openalex.org/I4210119392"]},{"id":"https://openalex.org/I99065089","display_name":"Tsinghua University","ror":"https://ror.org/03cve4549","country_code":"CN","type":"education","lineage":["https://openalex.org/I99065089"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zheyao Wang","raw_affiliation_strings":["Institute of Microelectronics, Tsinghua University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Institute of Microelectronics, Tsinghua University, Beijing, China","institution_ids":["https://openalex.org/I4210119392","https://openalex.org/I99065089"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"2016","issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":0.998199999332428,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11272","display_name":"Nanowire Synthesis and Applications","score":0.9797000288963318,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.8853888511657715},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8355395197868347},{"id":"https://openalex.org/keywords/grinding","display_name":"Grinding","score":0.5848138332366943},{"id":"https://openalex.org/keywords/adhesive","display_name":"Adhesive","score":0.5561650991439819},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5272269248962402},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.5175384879112244},{"id":"https://openalex.org/keywords/flexibility","display_name":"Flexibility (engineering)","score":0.4916413426399231},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.425870805978775},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.4141487181186676},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.32117968797683716},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.29524004459381104},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.2547609210014343},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.20276027917861938}],"concepts":[{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.8853888511657715},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8355395197868347},{"id":"https://openalex.org/C2777571299","wikidata":"https://www.wikidata.org/wiki/Q3680646","display_name":"Grinding","level":2,"score":0.5848138332366943},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.5561650991439819},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5272269248962402},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.5175384879112244},{"id":"https://openalex.org/C2780598303","wikidata":"https://www.wikidata.org/wiki/Q65921492","display_name":"Flexibility (engineering)","level":2,"score":0.4916413426399231},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.425870805978775},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.4141487181186676},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.32117968797683716},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.29524004459381104},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.2547609210014343},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.20276027917861938},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C105795698","wikidata":"https://www.wikidata.org/wiki/Q12483","display_name":"Statistics","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icsens.2016.7808438","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808438","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},{"id":"mag:2752659463","is_oa":false,"landing_page_url":"http://jglobal.jst.go.jp/en/public/20090422/201702238400877766","pdf_url":null,"source":{"id":"https://openalex.org/S4306512817","display_name":"IEEE Conference Proceedings","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEEE Conference Proceedings","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":8,"referenced_works":["https://openalex.org/W1971818054","https://openalex.org/W2009138214","https://openalex.org/W2090732831","https://openalex.org/W2124703837","https://openalex.org/W2182139721","https://openalex.org/W2198506317","https://openalex.org/W2237635209","https://openalex.org/W6678407671"],"related_works":["https://openalex.org/W2558687676","https://openalex.org/W2055172913","https://openalex.org/W4310396753","https://openalex.org/W2388159328","https://openalex.org/W2794371967","https://openalex.org/W2891601994","https://openalex.org/W2376458274","https://openalex.org/W2373143343","https://openalex.org/W4249574933","https://openalex.org/W2037747374"],"abstract_inverted_index":{"A":[0],"technical":[1],"challenge":[2],"in":[3,15],"fabrication":[4,119],"of":[5,65,67,72,90,120],"ultra-thin":[6,18],"sensor":[7],"chip":[8,13,57],"(UTSC)":[9],"is":[10,100],"to":[11,86,102],"keep":[12],"integrity":[14,58],"debonding":[16,28],"the":[17,39,56,60,88,97,111],"chips":[19,61],"from":[20],"grinding":[21],"facilities.":[22],"This":[23],"paper":[24],"presents":[25],"a":[26,32,63],"new":[27],"method":[29,53,99,114],"by":[30],"utilizing":[31],"thermally":[33],"decomposable":[34],"polypropylene":[35],"carbonate":[36],"(PPC),":[37],"as":[38],"temporary":[40],"bonding":[41],"adhesive.":[42],"Because":[43],"PPC":[44],"can":[45,54],"readily":[46],"decompose":[47],"at":[48],"relatively":[49],"low":[50],"temperature,":[51],"this":[52,78],"maintain":[55],"even":[59],"have":[62,74,83],"thickness":[64,71],"tens":[66],"microns.":[68],"UTSCs":[69],"with":[70,105],"30\u03bcm":[73],"been":[75,84],"achieved":[76],"using":[77],"method,":[79],"and":[80,108,124],"stress":[81],"sensors":[82,121],"developed":[85],"verify":[87],"performance":[89],"UTSC.":[91],"The":[92],"experimental":[93],"results":[94],"show":[95],"that":[96],"proposed":[98,113],"able":[101],"fabricate":[103],"UTSC":[104],"good":[106],"flexibility":[107],"characterizations,":[109],"demonstrating":[110],"newly":[112],"an":[115],"enabling":[116],"technology":[117],"for":[118,122],"flexible":[123],"wearable":[125],"applications.":[126]},"counts_by_year":[{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-22T07:51:19.307946","created_date":"2025-10-10T00:00:00"}