{"id":"https://openalex.org/W2579046785","doi":"https://doi.org/10.1109/icsens.2016.7808403","title":"Temperature and pressure characterization of the quality factor in a CMOS-MEMS resonator","display_name":"Temperature and pressure characterization of the quality factor in a CMOS-MEMS resonator","publication_year":2016,"publication_date":"2016-10-01","ids":{"openalex":"https://openalex.org/W2579046785","doi":"https://doi.org/10.1109/icsens.2016.7808403","mag":"2579046785"},"language":"en","primary_location":{"id":"doi:10.1109/icsens.2016.7808403","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808403","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5079384773","display_name":"Saoni Banerji","orcid":"https://orcid.org/0000-0001-8221-9820"},"institutions":[{"id":"https://openalex.org/I9617848","display_name":"Universitat Polit\u00e8cnica de Catalunya","ror":"https://ror.org/03mb6wj31","country_code":"ES","type":"education","lineage":["https://openalex.org/I9617848"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"Saoni Banerji","raw_affiliation_strings":["Electronics Engineering Department, Universitat Politecnica de Catalunya, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Engineering Department, Universitat Politecnica de Catalunya, Barcelona, Spain","institution_ids":["https://openalex.org/I9617848"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5066417700","display_name":"Jordi Madrenas","orcid":"https://orcid.org/0000-0001-5905-9179"},"institutions":[{"id":"https://openalex.org/I9617848","display_name":"Universitat Polit\u00e8cnica de Catalunya","ror":"https://ror.org/03mb6wj31","country_code":"ES","type":"education","lineage":["https://openalex.org/I9617848"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"Jordi Madrenas","raw_affiliation_strings":["Electronics Engineering Department, Universitat Politecnica de Catalunya, Barcelona, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Electronics Engineering Department, Universitat Politecnica de Catalunya, Barcelona, Spain","institution_ids":["https://openalex.org/I9617848"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055268664","display_name":"Daniel Fern\u00e1ndez","orcid":"https://orcid.org/0000-0002-1076-6697"},"institutions":[{"id":"https://openalex.org/I4210095893","display_name":"Ascamm Technologic Center","ror":"https://ror.org/00r2gde63","country_code":"ES","type":"facility","lineage":["https://openalex.org/I4210095893"]}],"countries":["ES"],"is_corresponding":false,"raw_author_name":"Daniel Fernandez","raw_affiliation_strings":["Nanusens, CENT -Parc Tecnologic del Valles, Cerdanyola Del Valles, Spain"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Nanusens, CENT -Parc Tecnologic del Valles, Cerdanyola Del Valles, Spain","institution_ids":["https://openalex.org/I4210095893"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.372,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.68473797,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":"2016","issue":null,"first_page":"1","last_page":"3"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10369","display_name":"Advanced MEMS and NEMS Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11449","display_name":"Mechanical and Optical Resonators","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11160","display_name":"Acoustic Wave Resonator Technologies","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.8313050866127014},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.7450500130653381},{"id":"https://openalex.org/keywords/capacitance","display_name":"Capacitance","score":0.7081238627433777},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6970643997192383},{"id":"https://openalex.org/keywords/microelectromechanical-systems","display_name":"Microelectromechanical systems","score":0.6665968298912048},{"id":"https://openalex.org/keywords/q-factor","display_name":"Q factor","score":0.6271297931671143},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5280075073242188},{"id":"https://openalex.org/keywords/etching","display_name":"Etching (microfabrication)","score":0.517533004283905},{"id":"https://openalex.org/keywords/atmospheric-pressure","display_name":"Atmospheric pressure","score":0.4760144352912903},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.41651153564453125},{"id":"https://openalex.org/keywords/quality","display_name":"Quality (philosophy)","score":0.4163796901702881},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.22779110074043274},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.16559559106826782},{"id":"https://openalex.org/keywords/electrode","display_name":"Electrode","score":0.081000417470932},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.07687216997146606}],"concepts":[{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.8313050866127014},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.7450500130653381},{"id":"https://openalex.org/C30066665","wikidata":"https://www.wikidata.org/wiki/Q164399","display_name":"Capacitance","level":3,"score":0.7081238627433777},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6970643997192383},{"id":"https://openalex.org/C37977207","wikidata":"https://www.wikidata.org/wiki/Q175561","display_name":"Microelectromechanical systems","level":2,"score":0.6665968298912048},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.6271297931671143},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5280075073242188},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.517533004283905},{"id":"https://openalex.org/C200239111","wikidata":"https://www.wikidata.org/wiki/Q81809","display_name":"Atmospheric pressure","level":2,"score":0.4760144352912903},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.41651153564453125},{"id":"https://openalex.org/C2779530757","wikidata":"https://www.wikidata.org/wiki/Q1207505","display_name":"Quality (philosophy)","level":2,"score":0.4163796901702881},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.22779110074043274},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.16559559106826782},{"id":"https://openalex.org/C17525397","wikidata":"https://www.wikidata.org/wiki/Q176140","display_name":"Electrode","level":2,"score":0.081000417470932},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.07687216997146606},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icsens.2016.7808403","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsens.2016.7808403","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2016 IEEE SENSORS","raw_type":"proceedings-article"},{"id":"mag:2750671013","is_oa":false,"landing_page_url":"http://jglobal.jst.go.jp/en/public/20090422/201702220246830518","pdf_url":null,"source":{"id":"https://openalex.org/S4306512817","display_name":"IEEE Conference Proceedings","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEEE Conference Proceedings","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5799999833106995,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W2041239452","https://openalex.org/W2077988521","https://openalex.org/W2080935127","https://openalex.org/W2127490754","https://openalex.org/W2193353560","https://openalex.org/W2284096473","https://openalex.org/W2290021559"],"related_works":["https://openalex.org/W2272290532","https://openalex.org/W2120483398","https://openalex.org/W1530711136","https://openalex.org/W2319192085","https://openalex.org/W1763916368","https://openalex.org/W2391127530","https://openalex.org/W2045074154","https://openalex.org/W2346208161","https://openalex.org/W1990831804","https://openalex.org/W2161426467"],"abstract_inverted_index":{"In":[0],"this":[1],"paper,":[2],"we":[3],"present":[4],"a":[5,14,50],"study":[6],"of":[7,13,20,57,110],"the":[8,55,66,86,102,111],"quality":[9],"factor":[10],"(Q)":[11],"behavior":[12],"CMOS-MEMS":[15],"resonator":[16,67],"under":[17,101],"different":[18,72],"conditions":[19],"temperature":[21,70,87,104,114],"and":[22,69,95],"pressure.":[23],"The":[24,44,75,106],"device":[25,112],"has":[26,78],"been":[27,117],"manufactured":[28,45],"using":[29],"standard":[30],"250":[31],"nm":[32],"CMOS":[33],"technology":[34],"followed":[35],"by":[36],"an":[37,62],"in-house":[38],"BEOL":[39],"metal-layer":[40],"release":[41],"wet":[42],"etching.":[43],"sensor":[46],"is":[47],"used":[48],"as":[49],"pressure":[51,73,100],"estimator":[52],"based":[53],"on":[54],"variation":[56],"Q.":[58],"Experiments":[59],"have":[60,115],"demonstrated":[61],"inverse":[63],"relationship":[64],"between":[65],"Q":[68,77],"in":[71],"regimes.":[74],"initial":[76],"decreased":[79],"to":[80,92,96],"0.80*Q":[81],"at":[82,98],"100":[83],"Pa":[84],"when":[85],"changed":[88],"from":[89],"300":[90],"K":[91],"360":[93],"K,":[94],"0.65*Q":[97],"atmospheric":[99],"same":[103],"span.":[105],"static":[107],"capacitance":[108],"variations":[109],"with":[113],"also":[116],"measured.":[118]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}