{"id":"https://openalex.org/W3009396040","doi":"https://doi.org/10.1109/icsai48974.2019.9010419","title":"Optimal Scheduling of Combined Wafer Fabrication Equipment Taking Mechanical Arms as Buffers","display_name":"Optimal Scheduling of Combined Wafer Fabrication Equipment Taking Mechanical Arms as Buffers","publication_year":2019,"publication_date":"2019-11-01","ids":{"openalex":"https://openalex.org/W3009396040","doi":"https://doi.org/10.1109/icsai48974.2019.9010419","mag":"3009396040"},"language":"en","primary_location":{"id":"doi:10.1109/icsai48974.2019.9010419","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsai48974.2019.9010419","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 6th International Conference on Systems and Informatics (ICSAI)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100663027","display_name":"Junqing Sun","orcid":null},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Junqing Sun","raw_affiliation_strings":["Tianjin University of Technology, Tianjin, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin University of Technology, Tianjin, China","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081307738","display_name":"Yilin Wang","orcid":"https://orcid.org/0000-0002-7513-704X"},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yilin Wang","raw_affiliation_strings":["Tianjin University of Technology, Tianjin, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin University of Technology, Tianjin, China","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102052259","display_name":"Meiling Feng","orcid":null},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Meiling Feng","raw_affiliation_strings":["Tianjin University of Technology, Tianjin, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin University of Technology, Tianjin, China","institution_ids":["https://openalex.org/I136765683"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100551798","display_name":"Bin Sun","orcid":"https://orcid.org/0009-0003-0943-2838"},"institutions":[{"id":"https://openalex.org/I136765683","display_name":"Tianjin University of Technology","ror":"https://ror.org/00zbe0w13","country_code":"CN","type":"education","lineage":["https://openalex.org/I136765683"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Bin Sun","raw_affiliation_strings":["Tianjin University of Technology, Tianjin, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Tianjin University of Technology, Tianjin, China","institution_ids":["https://openalex.org/I136765683"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I136765683"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.30455352,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":"2019","issue":null,"first_page":"23","last_page":"27"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10551","display_name":"Scheduling and Optimization Algorithms","score":0.9975000023841858,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11814","display_name":"Advanced Manufacturing and Logistics Optimization","score":0.9951000213623047,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9900000095367432,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/wafer-fabrication","display_name":"Wafer fabrication","score":0.8866962194442749},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.8226419687271118},{"id":"https://openalex.org/keywords/scheduling","display_name":"Scheduling (production processes)","score":0.6773868799209595},{"id":"https://openalex.org/keywords/fabrication","display_name":"Fabrication","score":0.6258077621459961},{"id":"https://openalex.org/keywords/job-shop-scheduling","display_name":"Job shop scheduling","score":0.5990337133407593},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.584396481513977},{"id":"https://openalex.org/keywords/dual","display_name":"Dual (grammatical number)","score":0.4649333655834198},{"id":"https://openalex.org/keywords/wafer-level-packaging","display_name":"Wafer-level packaging","score":0.45945340394973755},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.43942901492118835},{"id":"https://openalex.org/keywords/heuristic","display_name":"Heuristic","score":0.41761496663093567},{"id":"https://openalex.org/keywords/semiconductor-device-fabrication","display_name":"Semiconductor device fabrication","score":0.4171476662158966},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.33275938034057617},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.32223746180534363},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.3137763738632202},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.10314658284187317},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.08920601010322571},{"id":"https://openalex.org/keywords/operations-management","display_name":"Operations management","score":0.07087147235870361}],"concepts":[{"id":"https://openalex.org/C35750839","wikidata":"https://www.wikidata.org/wiki/Q7959421","display_name":"Wafer fabrication","level":3,"score":0.8866962194442749},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.8226419687271118},{"id":"https://openalex.org/C206729178","wikidata":"https://www.wikidata.org/wiki/Q2271896","display_name":"Scheduling (production processes)","level":2,"score":0.6773868799209595},{"id":"https://openalex.org/C136525101","wikidata":"https://www.wikidata.org/wiki/Q5428139","display_name":"Fabrication","level":3,"score":0.6258077621459961},{"id":"https://openalex.org/C55416958","wikidata":"https://www.wikidata.org/wiki/Q6206757","display_name":"Job shop scheduling","level":3,"score":0.5990337133407593},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.584396481513977},{"id":"https://openalex.org/C2780980858","wikidata":"https://www.wikidata.org/wiki/Q110022","display_name":"Dual (grammatical number)","level":2,"score":0.4649333655834198},{"id":"https://openalex.org/C2780288131","wikidata":"https://www.wikidata.org/wiki/Q4017648","display_name":"Wafer-level packaging","level":3,"score":0.45945340394973755},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.43942901492118835},{"id":"https://openalex.org/C173801870","wikidata":"https://www.wikidata.org/wiki/Q201413","display_name":"Heuristic","level":2,"score":0.41761496663093567},{"id":"https://openalex.org/C66018809","wikidata":"https://www.wikidata.org/wiki/Q1570432","display_name":"Semiconductor device fabrication","level":3,"score":0.4171476662158966},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.33275938034057617},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.32223746180534363},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.3137763738632202},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10314658284187317},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.08920601010322571},{"id":"https://openalex.org/C21547014","wikidata":"https://www.wikidata.org/wiki/Q1423657","display_name":"Operations management","level":1,"score":0.07087147235870361},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C142724271","wikidata":"https://www.wikidata.org/wiki/Q7208","display_name":"Pathology","level":1,"score":0.0},{"id":"https://openalex.org/C142362112","wikidata":"https://www.wikidata.org/wiki/Q735","display_name":"Art","level":0,"score":0.0},{"id":"https://openalex.org/C124952713","wikidata":"https://www.wikidata.org/wiki/Q8242","display_name":"Literature","level":1,"score":0.0},{"id":"https://openalex.org/C71924100","wikidata":"https://www.wikidata.org/wiki/Q11190","display_name":"Medicine","level":0,"score":0.0},{"id":"https://openalex.org/C74172769","wikidata":"https://www.wikidata.org/wiki/Q1446839","display_name":"Routing (electronic design automation)","level":2,"score":0.0},{"id":"https://openalex.org/C204787440","wikidata":"https://www.wikidata.org/wiki/Q188504","display_name":"Alternative medicine","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icsai48974.2019.9010419","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icsai48974.2019.9010419","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 6th International Conference on Systems and Informatics (ICSAI)","raw_type":"proceedings-article"},{"id":"mag:3041614225","is_oa":false,"landing_page_url":"https://jglobal.jst.go.jp/en/detail?JGLOBAL_ID=202002265718119224","pdf_url":null,"source":{"id":"https://openalex.org/S4306512817","display_name":"IEEE Conference Proceedings","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":null,"is_accepted":false,"is_published":null,"raw_source_name":"IEEE Conference Proceedings","raw_type":null}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.5400000214576721,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2110050374","https://openalex.org/W2369301926"],"related_works":["https://openalex.org/W2170726572","https://openalex.org/W2146435486","https://openalex.org/W2006086900","https://openalex.org/W2146366317","https://openalex.org/W2070188681","https://openalex.org/W1483119123","https://openalex.org/W2377558694","https://openalex.org/W2992897358","https://openalex.org/W2394172622","https://openalex.org/W1594978932"],"abstract_inverted_index":{"This":[0],"paper":[1,81],"addresses":[2],"the":[3,28,35,38,42,49,59,77,95,98,101,108,111],"problem":[4,36],"of":[5,8,37,41,48,91,97,110],"optimal":[6,39],"scheduling":[7,40],"combined":[9,50,112],"dual-arm":[10,51],"wafer":[11,52,65,92,113],"fabrication":[12,53],"equipment":[13,115],"which":[14,86],"may":[15],"take":[16],"its":[17,67,122],"two":[18,123],"mechanical":[19,43,124],"arms":[20,44,125],"as":[21,66,126],"temporary":[22,127],"buffers":[23],"during":[24],"manufacturing":[25,114],"process.":[26],"Firstly,":[27],"mathematical":[29],"model":[30,56],"is":[31,73],"proposed":[32],"to":[33,75,93],"describe":[34],"and":[45,100],"processing":[46,61],"cavities":[47],"equipment.":[54],"The":[55,103],"takes":[57],"minimizing":[58],"average":[60],"time":[62],"for":[63],"each":[64],"objective.":[68],"Then,":[69],"a":[70],"heuristic":[71],"algorithm":[72,99],"designed":[74],"solve":[76],"problem.":[78],"Finally,":[79],"this":[80],"employs":[82],"some":[83],"data":[84],"cases":[85],"come":[87],"from":[88],"practical":[89],"production":[90],"verify":[94],"validity":[96],"method.":[102],"experimental":[104],"results":[105],"show":[106],"that":[107],"efficiency":[109],"can":[116],"be":[117],"increased":[118],"greatly":[119],"through":[120],"taking":[121],"buffers.":[128]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}