{"id":"https://openalex.org/W4410771254","doi":"https://doi.org/10.1109/icrca64997.2025.11011258","title":"Electrothermal and Electromagnetic Analysis and Thermal Management Design of Core-replaceable Film Capacitors","display_name":"Electrothermal and Electromagnetic Analysis and Thermal Management Design of Core-replaceable Film Capacitors","publication_year":2025,"publication_date":"2025-03-07","ids":{"openalex":"https://openalex.org/W4410771254","doi":"https://doi.org/10.1109/icrca64997.2025.11011258"},"language":"en","primary_location":{"id":"doi:10.1109/icrca64997.2025.11011258","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icrca64997.2025.11011258","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 9th International Conference on Robotics, Control and Automation (ICRCA)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100439684","display_name":"Cheng Zhang","orcid":"https://orcid.org/0000-0003-0719-6280"},"institutions":[{"id":"https://openalex.org/I141962983","display_name":"Shanghai University of Engineering Science","ror":"https://ror.org/0557b9y08","country_code":"CN","type":"education","lineage":["https://openalex.org/I141962983"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Cheng Zhang","raw_affiliation_strings":["Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China","institution_ids":["https://openalex.org/I141962983"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100700120","display_name":"Yansong Wang","orcid":"https://orcid.org/0000-0002-2429-781X"},"institutions":[{"id":"https://openalex.org/I141962983","display_name":"Shanghai University of Engineering Science","ror":"https://ror.org/0557b9y08","country_code":"CN","type":"education","lineage":["https://openalex.org/I141962983"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yansong Wang","raw_affiliation_strings":["Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China","institution_ids":["https://openalex.org/I141962983"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101752005","display_name":"Tao Yuan","orcid":"https://orcid.org/0000-0002-5418-9094"},"institutions":[{"id":"https://openalex.org/I141962983","display_name":"Shanghai University of Engineering Science","ror":"https://ror.org/0557b9y08","country_code":"CN","type":"education","lineage":["https://openalex.org/I141962983"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Tao Yuan","raw_affiliation_strings":["Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China","institution_ids":["https://openalex.org/I141962983"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023177983","display_name":"Hui Guo","orcid":"https://orcid.org/0000-0002-7874-7273"},"institutions":[{"id":"https://openalex.org/I141962983","display_name":"Shanghai University of Engineering Science","ror":"https://ror.org/0557b9y08","country_code":"CN","type":"education","lineage":["https://openalex.org/I141962983"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Hui Guo","raw_affiliation_strings":["Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China","institution_ids":["https://openalex.org/I141962983"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100642124","display_name":"Linhao Huang","orcid":"https://orcid.org/0009-0009-9556-8494"},"institutions":[{"id":"https://openalex.org/I141962983","display_name":"Shanghai University of Engineering Science","ror":"https://ror.org/0557b9y08","country_code":"CN","type":"education","lineage":["https://openalex.org/I141962983"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Linhao Huang","raw_affiliation_strings":["Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Shanghai University of Engineering Science,School of Mechanical and Automotive Engineering,Shanghai,China","institution_ids":["https://openalex.org/I141962983"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I141962983"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"297","last_page":"303"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9828000068664551,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9828000068664551,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11277","display_name":"Thermal properties of materials","score":0.9592000246047974,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9448999762535095,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitor","display_name":"Capacitor","score":0.8367691040039062},{"id":"https://openalex.org/keywords/core","display_name":"Core (optical fiber)","score":0.6625099182128906},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5640053749084473},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5461491346359253},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.4880906343460083},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.4418696165084839},{"id":"https://openalex.org/keywords/electromagnetic-heating","display_name":"Electromagnetic heating","score":0.42966657876968384},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.4272107183933258},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.34425482153892517},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2627437114715576},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.2034207284450531},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.18176007270812988},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.15000692009925842},{"id":"https://openalex.org/keywords/electromagnetic-coil","display_name":"Electromagnetic coil","score":0.13464540243148804},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.08160620927810669}],"concepts":[{"id":"https://openalex.org/C52192207","wikidata":"https://www.wikidata.org/wiki/Q5322","display_name":"Capacitor","level":3,"score":0.8367691040039062},{"id":"https://openalex.org/C2164484","wikidata":"https://www.wikidata.org/wiki/Q5170150","display_name":"Core (optical fiber)","level":2,"score":0.6625099182128906},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5640053749084473},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5461491346359253},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.4880906343460083},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.4418696165084839},{"id":"https://openalex.org/C2983309280","wikidata":"https://www.wikidata.org/wiki/Q751960","display_name":"Electromagnetic heating","level":3,"score":0.42966657876968384},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.4272107183933258},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.34425482153892517},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2627437114715576},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.2034207284450531},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.18176007270812988},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.15000692009925842},{"id":"https://openalex.org/C30403606","wikidata":"https://www.wikidata.org/wiki/Q2981904","display_name":"Electromagnetic coil","level":2,"score":0.13464540243148804},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.08160620927810669}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icrca64997.2025.11011258","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icrca64997.2025.11011258","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 9th International Conference on Robotics, Control and Automation (ICRCA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6600000262260437,"display_name":"Affordable and clean energy","id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321885","display_name":"Science and Technology Commission of Shanghai Municipality","ror":"https://ror.org/03kt66j61"},{"id":"https://openalex.org/F4320325553","display_name":"Shanghai University","ror":"https://ror.org/006teas31"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W2005150633","https://openalex.org/W2130152888","https://openalex.org/W2265093069","https://openalex.org/W2727407306","https://openalex.org/W3097761710","https://openalex.org/W3171187741","https://openalex.org/W4303645123","https://openalex.org/W4312056522","https://openalex.org/W4390880432","https://openalex.org/W4398187761"],"related_works":["https://openalex.org/W4398198689","https://openalex.org/W2354365353","https://openalex.org/W1988437325","https://openalex.org/W2811287415","https://openalex.org/W2354835317","https://openalex.org/W2371237473","https://openalex.org/W2130152888","https://openalex.org/W2003918017","https://openalex.org/W2171140818","https://openalex.org/W2330536198"],"abstract_inverted_index":{"The":[0,88,144],"development":[1],"of":[2,23,55,85,95,112,120,130,175,182,208,225,239,245],"lightweight":[3],"and":[4,42,63,70,73,100,124,140,154,166,204,218,221,242],"high":[5,20],"power":[6],"density":[7,123],"motor":[8,27],"controllers":[9],"for":[10,82,236],"new":[11,16,240],"energy":[12],"vehicles":[13],"has":[14,147],"brought":[15],"challenges":[17],"to":[18],"the":[19,37,53,86,92,109,113,118,127,131,137,141,160,163,173,179,183,189,197,202,205,209,216,226,237,243],"temperature":[21,111,181,207],"resistance":[22],"film":[24,34,228],"capacitors":[25,241],"inside":[26],"controllers.":[28],"This":[29],"paper":[30],"takes":[31],"a":[32,75,105,148,230],"core-replaceable":[33,227],"capacitor":[35,114,121,132,184,210,246],"as":[36],"research":[38],"object,":[39],"conducts":[40],"electrothermal":[41,217],"electromagnetic":[43,219],"simulation":[44,50,220],"analysis":[45,224],"on":[46,67,108,151],"it":[47],"through":[48],"ANSYS":[49],"software,":[51],"explores":[52],"influence":[54,150],"input":[56],"ripple":[57,96],"current":[58,122],"effective":[59,93],"value,":[60],"busbar":[61,98,142,145,161],"thickness":[62,99,146],"coolant":[64,101,176],"flow":[65,102,177,190],"rate":[66,103,191],"electrical,":[68],"magnetic":[69],"thermal":[71,83,128],"parameters,":[72],"designs":[74],"water":[76],"drop-shaped":[77],"cross-section":[78],"cooling":[79],"channel":[80],"plate":[81],"management":[84],"capacitor.":[87],"results":[89],"show":[90],"that":[91],"value":[94],"current,":[97],"have":[104],"direct":[106],"impact":[107],"maximum":[110,180,206],"core.":[115],"By":[116,157],"analyzing":[117],"distribution":[119],"Joule":[125],"heat,":[126],"stress":[129],"is":[133,192,201],"mainly":[134],"concentrated":[135],"at":[136],"terminal":[138],"connection":[139],"bend.":[143],"certain":[149,231],"stray":[152,164],"inductance":[153,165],"surface":[155,167],"loss.":[156],"reasonably":[158],"selecting":[159],"thickness,":[162],"loss":[168],"can":[169,233],"be":[170,234],"reduced.":[171],"With":[172],"increase":[174],"rate,":[178],"core":[185,211],"decreases":[186,212],"significantly.":[187],"When":[188],"0.05":[193],"m\u00b7s<sup":[194],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[195],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">\u22121</sup>,":[196],"heat":[198],"dissipation":[199],"efficiency":[200],"highest,":[203],"by":[213],"53.9\u00b0C.":[214],"Through":[215],"influencing":[222],"factor":[223],"capacitor,":[229],"reference":[232],"provided":[235],"design":[238],"improvement":[244],"performance.":[247]},"counts_by_year":[],"updated_date":"2026-07-15T18:14:33.161393","created_date":"2025-10-10T00:00:00"}