{"id":"https://openalex.org/W2039268713","doi":"https://doi.org/10.1109/icra.2014.6907184","title":"Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography","display_name":"Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W2039268713","doi":"https://doi.org/10.1109/icra.2014.6907184","mag":"2039268713"},"language":"en","primary_location":{"id":"doi:10.1109/icra.2014.6907184","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icra.2014.6907184","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on Robotics and Automation (ICRA)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100681992","display_name":"Xiantao Sun","orcid":"https://orcid.org/0000-0002-1941-3089"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiantao Sun","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]},{"raw_affiliation_string":"[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026365889","display_name":"Weihai Chen","orcid":"https://orcid.org/0000-0001-7912-4505"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]},{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN","SG"],"is_corresponding":false,"raw_author_name":"Weihai Chen","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","Singapore Institute of Manufacturing Technology, Singapore","[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]},{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology, Singapore","institution_ids":["https://openalex.org/I4210091207"]},{"raw_affiliation_string":"[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5101510785","display_name":"Rui Zhou","orcid":"https://orcid.org/0000-0003-2476-1130"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Rui Zhou","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]},{"raw_affiliation_string":"[School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China]","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5047216687","display_name":"Wenjie Chen","orcid":"https://orcid.org/0000-0002-1751-6826"},"institutions":[{"id":"https://openalex.org/I4210091207","display_name":"Singapore Institute of Manufacturing Technology","ror":"https://ror.org/00f44np30","country_code":"SG","type":"facility","lineage":["https://openalex.org/I115228651","https://openalex.org/I4210091207","https://openalex.org/I91275662"]},{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN","SG"],"is_corresponding":false,"raw_author_name":"Wenjie Chen","raw_affiliation_strings":["School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","Singapore Institute of Manufacturing Technology, Singapore","Singapore Institute of Manufacturing Technology, 638075, Singapore"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Automation Science and Electrical Engineering, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]},{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology, Singapore","institution_ids":["https://openalex.org/I4210091207"]},{"raw_affiliation_string":"Singapore Institute of Manufacturing Technology, 638075, Singapore","institution_ids":["https://openalex.org/I4210091207"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100616599","display_name":"Jianbin Zhang","orcid":"https://orcid.org/0000-0003-4318-7330"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Jianbin Zhang","raw_affiliation_strings":["School of Mechanical Engineering and Automation, Beihang University, Beijing, China","School of mechanical engineering and automation,Beihang University,Beijing,100191,China)"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"School of Mechanical Engineering and Automation, Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]},{"raw_affiliation_string":"School of mechanical engineering and automation,Beihang University,Beijing,100191,China)","institution_ids":["https://openalex.org/I82880672"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"83","issue":null,"first_page":"2345","last_page":"2350"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10923","display_name":"Force Microscopy Techniques and Applications","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/3107","display_name":"Atomic and Molecular Physics, and Optics"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11301","display_name":"Advanced Surface Polishing Techniques","score":0.9973000288009644,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.7490461468696594},{"id":"https://openalex.org/keywords/embossing","display_name":"Embossing","score":0.6939047574996948},{"id":"https://openalex.org/keywords/grating","display_name":"Grating","score":0.6240693926811218},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5755512118339539},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5547899007797241},{"id":"https://openalex.org/keywords/laser-linewidth","display_name":"Laser linewidth","score":0.5111001133918762},{"id":"https://openalex.org/keywords/stiffness","display_name":"Stiffness","score":0.49962711334228516},{"id":"https://openalex.org/keywords/decoupling","display_name":"Decoupling (probability)","score":0.4226030707359314},{"id":"https://openalex.org/keywords/photolithography","display_name":"Photolithography","score":0.4193499982357025},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.33782899379730225},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.27685660123825073},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.22511634230613708},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.18172773718833923},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.12812525033950806},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.12200164794921875},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08527657389640808}],"concepts":[{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.7490461468696594},{"id":"https://openalex.org/C2776392700","wikidata":"https://www.wikidata.org/wiki/Q1335051","display_name":"Embossing","level":2,"score":0.6939047574996948},{"id":"https://openalex.org/C2777813233","wikidata":"https://www.wikidata.org/wiki/Q1527816","display_name":"Grating","level":2,"score":0.6240693926811218},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5755512118339539},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5547899007797241},{"id":"https://openalex.org/C142181693","wikidata":"https://www.wikidata.org/wiki/Q6493080","display_name":"Laser linewidth","level":3,"score":0.5111001133918762},{"id":"https://openalex.org/C2779372316","wikidata":"https://www.wikidata.org/wiki/Q569057","display_name":"Stiffness","level":2,"score":0.49962711334228516},{"id":"https://openalex.org/C205606062","wikidata":"https://www.wikidata.org/wiki/Q5249645","display_name":"Decoupling (probability)","level":2,"score":0.4226030707359314},{"id":"https://openalex.org/C105487726","wikidata":"https://www.wikidata.org/wiki/Q622938","display_name":"Photolithography","level":2,"score":0.4193499982357025},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.33782899379730225},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.27685660123825073},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.22511634230613708},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.18172773718833923},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.12812525033950806},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.12200164794921875},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08527657389640808},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.0},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icra.2014.6907184","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icra.2014.6907184","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on Robotics and Automation (ICRA)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W1970234403","https://openalex.org/W1973312921","https://openalex.org/W1975504444","https://openalex.org/W1986249182","https://openalex.org/W1994199501","https://openalex.org/W1994835874","https://openalex.org/W1997182030","https://openalex.org/W2001556200","https://openalex.org/W2007420829","https://openalex.org/W2034935888","https://openalex.org/W2052886083","https://openalex.org/W2054460607","https://openalex.org/W2055931169","https://openalex.org/W2061749107","https://openalex.org/W2066844661","https://openalex.org/W2073307089","https://openalex.org/W2080963553","https://openalex.org/W2088000317","https://openalex.org/W2137144825","https://openalex.org/W2143287675","https://openalex.org/W2153681676","https://openalex.org/W2543290891","https://openalex.org/W4234109392","https://openalex.org/W6664692955","https://openalex.org/W6680600112","https://openalex.org/W7015057954"],"related_works":["https://openalex.org/W3190396005","https://openalex.org/W2184315901","https://openalex.org/W2149415078","https://openalex.org/W2625379356","https://openalex.org/W2020522377","https://openalex.org/W1977680521","https://openalex.org/W2532313240","https://openalex.org/W2013138940","https://openalex.org/W2805151322","https://openalex.org/W2050729681"],"abstract_inverted_index":{"Parallel":[0],"surface":[1],"contact":[2],"between":[3],"the":[4,7,51,58,61,64,86,98,106,112,121,126,131,143,147,156,163],"template":[5,145],"and":[6,41,53,101,130],"substrate":[8],"is":[9,25,90,108],"very":[10],"important":[11],"in":[12,162],"imprint":[13,29],"lithography.":[14,30],"In":[15],"this":[16],"paper,":[17],"a":[18,35,42,70],"novel":[19],"force-decoupled":[20,95],"compound":[21],"parallel":[22,62,122],"alignment":[23,123,170],"stage":[24,66,124,158],"proposed":[26,65,157],"for":[27,49,125],"high-resolution":[28],"It":[31],"mainly":[32,91],"consists":[33],"of":[34,60,74,136],"high-stiffness":[36],"spherical":[37],"air":[38],"bearing":[39],"(SAB)":[40],"multi-degree-of-freedom":[43],"(multi-DOF)":[44],"flexure-based":[45],"mechanism":[46],"that":[47,155],"functions":[48],"both":[50],"active":[52],"passive":[54],"alignments.":[55],"Apart":[56],"from":[57,142],"function":[59],"alignment,":[63],"can":[67,159],"also":[68],"endure":[69],"large":[71],"imprinting":[72],"force":[73],"more":[75],"than":[76],"1000":[77],"N":[78],"but":[79],"does":[80],"not":[81],"cause":[82],"any":[83],"damage":[84],"to":[85,93,110,146],"delicate":[87],"components,":[88],"which":[89],"attributed":[92],"its":[94,169],"characteristic.":[96],"Through":[97],"stiffness":[99],"modeling":[100],"finite":[102],"element":[103],"analysis":[104],"(FEA),":[105],"performance":[107],"evaluated":[109],"satisfy":[111],"design":[113],"requirement.":[114],"Finally,":[115],"experimental":[116],"tests":[117],"are":[118,139],"conducted":[119],"on":[120],"hot":[127,164],"embossing":[128,165],"process,":[129],"grating":[132],"patterns":[133],"with":[134],"linewidth":[135],"2.5":[137],"\u03bcm":[138],"successfully":[140],"transferred":[141],"silicon":[144],"polymethy":[148],"methacrylate":[149],"(PMMA)":[150],"substrate.":[151],"This":[152],"result":[153],"demonstrates":[154],"be":[160],"used":[161],"process":[166],"without":[167],"degrading":[168],"accuracy.":[171]},"counts_by_year":[],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}