{"id":"https://openalex.org/W2117136736","doi":"https://doi.org/10.1109/icppw.2002.1039741","title":"A composite manufacturing process simulation environment (COMPOSE) utilizing parallel processing and object-oriented techniques","display_name":"A composite manufacturing process simulation environment (COMPOSE) utilizing parallel processing and object-oriented techniques","publication_year":2003,"publication_date":"2003-06-25","ids":{"openalex":"https://openalex.org/W2117136736","doi":"https://doi.org/10.1109/icppw.2002.1039741","mag":"2117136736"},"language":"en","primary_location":{"id":"doi:10.1109/icppw.2002.1039741","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icppw.2002.1039741","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Conference on Parallel Processing Workshop","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5026875183","display_name":"Brian J. Henz","orcid":null},"institutions":[{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"B.J. Henz","raw_affiliation_strings":["U.S. Army Research Laboratory, MD, USA"],"affiliations":[{"raw_affiliation_string":"U.S. Army Research Laboratory, MD, USA","institution_ids":["https://openalex.org/I166416128"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053719539","display_name":"Dale R. Shires","orcid":null},"institutions":[{"id":"https://openalex.org/I166416128","display_name":"DEVCOM Army Research Laboratory","ror":"https://ror.org/011hc8f90","country_code":"US","type":"government","lineage":["https://openalex.org/I1304082316","https://openalex.org/I1330347796","https://openalex.org/I166416128","https://openalex.org/I2802705668","https://openalex.org/I4210154437"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"D.R. Shires","raw_affiliation_strings":["U.S. Army Research Laboratory, MD, USA"],"affiliations":[{"raw_affiliation_string":"U.S. Army Research Laboratory, MD, USA","institution_ids":["https://openalex.org/I166416128"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5001018465","display_name":"Ram Mohan","orcid":"https://orcid.org/0000-0002-5820-7288"},"institutions":[{"id":"https://openalex.org/I192396691","display_name":"University of New Orleans","ror":"https://ror.org/034mtvk83","country_code":"US","type":"education","lineage":["https://openalex.org/I192396691","https://openalex.org/I2799628689"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"R.V. Mohan","raw_affiliation_strings":["Department of Mechanical Engineering, University of New Orleans, New Orleans, LA, USA"],"affiliations":[{"raw_affiliation_string":"Department of Mechanical Engineering, University of New Orleans, New Orleans, LA, USA","institution_ids":["https://openalex.org/I192396691"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5026875183"],"corresponding_institution_ids":["https://openalex.org/I166416128"],"apc_list":null,"apc_paid":null,"fwci":3.5161,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.91970453,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":null,"biblio":{"volume":"35","issue":null,"first_page":"274","last_page":"281"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11145","display_name":"Epoxy Resin Curing Processes","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11664","display_name":"Fiber-reinforced polymer composites","score":0.9891999959945679,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9879000186920166,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/transfer-molding","display_name":"Transfer molding","score":0.8041176795959473},{"id":"https://openalex.org/keywords/molding","display_name":"Molding (decorative)","score":0.6744765043258667},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.6593126058578491},{"id":"https://openalex.org/keywords/reuse","display_name":"Reuse","score":0.6426591873168945},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.6349300146102905},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.5016541481018066},{"id":"https://openalex.org/keywords/composite-number","display_name":"Composite number","score":0.49603208899497986},{"id":"https://openalex.org/keywords/massively-parallel","display_name":"Massively parallel","score":0.4647120237350464},{"id":"https://openalex.org/keywords/object-oriented-programming","display_name":"Object-oriented programming","score":0.442848265171051},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.3262448310852051},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2964674234390259},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.22747373580932617},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21100327372550964},{"id":"https://openalex.org/keywords/parallel-computing","display_name":"Parallel computing","score":0.12134841084480286}],"concepts":[{"id":"https://openalex.org/C37696544","wikidata":"https://www.wikidata.org/wiki/Q382824","display_name":"Transfer molding","level":3,"score":0.8041176795959473},{"id":"https://openalex.org/C67558686","wikidata":"https://www.wikidata.org/wiki/Q1770806","display_name":"Molding (decorative)","level":2,"score":0.6744765043258667},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.6593126058578491},{"id":"https://openalex.org/C206588197","wikidata":"https://www.wikidata.org/wiki/Q846574","display_name":"Reuse","level":2,"score":0.6426591873168945},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6349300146102905},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.5016541481018066},{"id":"https://openalex.org/C104779481","wikidata":"https://www.wikidata.org/wiki/Q50707","display_name":"Composite number","level":2,"score":0.49603208899497986},{"id":"https://openalex.org/C190475519","wikidata":"https://www.wikidata.org/wiki/Q544384","display_name":"Massively parallel","level":2,"score":0.4647120237350464},{"id":"https://openalex.org/C73752529","wikidata":"https://www.wikidata.org/wiki/Q79872","display_name":"Object-oriented programming","level":2,"score":0.442848265171051},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.3262448310852051},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2964674234390259},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22747373580932617},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21100327372550964},{"id":"https://openalex.org/C173608175","wikidata":"https://www.wikidata.org/wiki/Q232661","display_name":"Parallel computing","level":1,"score":0.12134841084480286},{"id":"https://openalex.org/C2780566776","wikidata":"https://www.wikidata.org/wiki/Q159341","display_name":"Mold","level":2,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C548081761","wikidata":"https://www.wikidata.org/wiki/Q180388","display_name":"Waste management","level":1,"score":0.0},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icppw.2002.1039741","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icppw.2002.1039741","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings. International Conference on Parallel Processing Workshop","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4099999964237213,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W90568776","https://openalex.org/W128220130","https://openalex.org/W133347211","https://openalex.org/W144696928","https://openalex.org/W148823471","https://openalex.org/W1480188394","https://openalex.org/W1593897711","https://openalex.org/W1910010274","https://openalex.org/W1977361859","https://openalex.org/W1996905476","https://openalex.org/W2022370341","https://openalex.org/W2029934442","https://openalex.org/W2050171648","https://openalex.org/W2095420020","https://openalex.org/W2124527958","https://openalex.org/W2150637273","https://openalex.org/W2764568110","https://openalex.org/W3104001151","https://openalex.org/W6600252484","https://openalex.org/W6605165326","https://openalex.org/W6605288105","https://openalex.org/W6605891591","https://openalex.org/W6628796657","https://openalex.org/W6639766606","https://openalex.org/W6786068067"],"related_works":["https://openalex.org/W2009206460","https://openalex.org/W2080979385","https://openalex.org/W2100017023","https://openalex.org/W1599327342","https://openalex.org/W2883324043","https://openalex.org/W4256361922","https://openalex.org/W3130189623","https://openalex.org/W2531780059","https://openalex.org/W2491060300","https://openalex.org/W566188680"],"abstract_inverted_index":{"Liquid":[0],"composite":[1,22,72],"molding,":[2,12],"based":[3],"on":[4,45,98],"resin":[5,10],"transfer":[6,11],"molding":[7],"(RTM),":[8],"vacuum-assisted":[9],"and":[13,28,42,58,74,107,122],"its":[14],"variants,":[15],"have":[16,35,53],"been":[17],"increasingly":[18],"used":[19,116],"in":[20,38,117],"new":[21],"material":[23],"developments":[24],"for":[25,76],"both":[26],"land":[27],"air":[29],"military":[30],"vehicle":[31],"applications.":[32],"New":[33],"processes":[34],"high":[36],"risks":[37],"cost,":[39],"time,":[40],"quality,":[41],"reproducibility":[43],"depending":[44],"their":[46],"stage":[47],"of":[48],"maturity.":[49],"Various":[50],"defense":[51],"initiatives":[52],"identified":[54],"physical":[55],"process":[56,77],"modeling":[57],"simulations":[59],"as":[60],"a":[61],"viable":[62],"technology":[63],"to":[64,70,88],"provide":[65,75],"the":[66,90],"required":[67],"technical":[68],"base":[69],"promote":[71],"affordability":[73],"maturation.":[78],"The":[79,112],"Composite":[80],"Manufacturing":[81],"Process":[82],"Simulation":[83],"Environment":[84],"(COMPOSE)":[85],"was":[86],"developed":[87],"model":[89],"RTM":[91],"process.":[92],"COMPOSE":[93,118],"utilizes":[94],"parallel":[95,100],"processing":[96],"methods":[97,115],"massively":[99],"machines":[101],"so":[102],"that":[103],"large":[104],"complicated":[105],"geometries":[106],"models":[108],"can":[109],"be":[110],"analyzed.":[111],"object-oriented":[113],"design":[114],"allow":[119],"code":[120],"reuse":[121],"faster":[123],"software":[124],"development":[125],"cycles.":[126]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}