{"id":"https://openalex.org/W2969098543","doi":"https://doi.org/10.1109/icicdt.2019.8790947","title":"Low Temperature SmartCut<sup>TM</sup> enables High Density 3D SoC Applications","display_name":"Low Temperature SmartCut<sup>TM</sup> enables High Density 3D SoC Applications","publication_year":2019,"publication_date":"2019-06-01","ids":{"openalex":"https://openalex.org/W2969098543","doi":"https://doi.org/10.1109/icicdt.2019.8790947","mag":"2969098543"},"language":"en","primary_location":{"id":"doi:10.1109/icicdt.2019.8790947","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2019.8790947","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Conference on IC Design and Technology (ICICDT)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5011567907","display_name":"W. Schwarzenbach","orcid":"https://orcid.org/0000-0003-2821-0854"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":true,"raw_author_name":"W. Schwarzenbach","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5065345119","display_name":"Bich-Yen Nguyen","orcid":"https://orcid.org/0000-0003-4347-4583"},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"B.-Y. Nguyen","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5114117593","display_name":"G. Besnard","orcid":null},"institutions":[{"id":"https://openalex.org/I108523894","display_name":"Soitec (France)","ror":"https://ror.org/00s730510","country_code":"FR","type":"company","lineage":["https://openalex.org/I108523894"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"G. Besnard","raw_affiliation_strings":["SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France"],"affiliations":[{"raw_affiliation_string":"SOITEC, Parc Technologique des Fontaines, Bernin, F-38926 Crolles, France","institution_ids":["https://openalex.org/I108523894"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5011567907"],"corresponding_institution_ids":["https://openalex.org/I108523894"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07457536,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"2"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/silicon-on-insulator","display_name":"Silicon on insulator","score":0.7713069915771484},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6518763899803162},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.5918513536453247},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.5192837119102478},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5041214227676392},{"id":"https://openalex.org/keywords/temperature-measurement","display_name":"Temperature measurement","score":0.4583030045032501},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3202563524246216},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.3005489110946655},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.27509361505508423},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.10954481363296509},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.0747179388999939}],"concepts":[{"id":"https://openalex.org/C53143962","wikidata":"https://www.wikidata.org/wiki/Q1478788","display_name":"Silicon on insulator","level":3,"score":0.7713069915771484},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6518763899803162},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.5918513536453247},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.5192837119102478},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5041214227676392},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.4583030045032501},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3202563524246216},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.3005489110946655},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.27509361505508423},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.10954481363296509},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0747179388999939},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icicdt.2019.8790947","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2019.8790947","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 International Conference on IC Design and Technology (ICICDT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":2,"referenced_works":["https://openalex.org/W2049033341","https://openalex.org/W2896419591"],"related_works":["https://openalex.org/W2104300577","https://openalex.org/W4206445530","https://openalex.org/W2771786520","https://openalex.org/W2174354966","https://openalex.org/W2810180604","https://openalex.org/W2325281603","https://openalex.org/W2944964251","https://openalex.org/W2012754971","https://openalex.org/W2034653092","https://openalex.org/W2101030291"],"abstract_inverted_index":{"To":[0],"support":[1],"3D":[2],"Sequential":[3],"integration":[4],"with":[5,27,41],"a":[6],"cost":[7],"effective":[8],"layer":[9,36],"transfer,":[10],"SmartCut":[11],"process":[12],"at":[13],"low":[14],"temperature":[15],"(below":[16],"500\u00b0C)":[17],"is":[18,38],"proposed.":[19],"Excellent":[20],"SOI":[21,31],"&":[22],"BOX":[23],"layers":[24],"thickness":[25],"uniformities":[26],"best":[28],"in":[29],"class":[30],"roughness":[32],"are":[33],"demonstrated,":[34],"while":[35],"integrity":[37],"already":[39],"compliant":[40],"development":[42],"grade":[43],"requirements.":[44]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}