{"id":"https://openalex.org/W2809745329","doi":"https://doi.org/10.1109/icicdt.2018.8399790","title":"Time-resolved single-photon detectors: Integration challenges in CMOS technologies","display_name":"Time-resolved single-photon detectors: Integration challenges in CMOS technologies","publication_year":2018,"publication_date":"2018-06-01","ids":{"openalex":"https://openalex.org/W2809745329","doi":"https://doi.org/10.1109/icicdt.2018.8399790","mag":"2809745329"},"language":"en","primary_location":{"id":"doi:10.1109/icicdt.2018.8399790","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2018.8399790","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 International Conference on IC Design & Technology (ICICDT)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088173332","display_name":"Matteo Perenzoni","orcid":"https://orcid.org/0000-0001-8777-1593"},"institutions":[{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Matteo Perenzoni","raw_affiliation_strings":["Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5081824853","display_name":"Manuel Moreno-Garc\u00eda","orcid":"https://orcid.org/0000-0002-9121-3196"},"institutions":[{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Manuel Moreno-Garcia","raw_affiliation_strings":["Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5018998302","display_name":"Leonardo Gasparini","orcid":"https://orcid.org/0000-0003-2622-1488"},"institutions":[{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Leonardo Gasparini","raw_affiliation_strings":["Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5076468405","display_name":"Nicola Massari","orcid":"https://orcid.org/0000-0002-1863-4859"},"institutions":[{"id":"https://openalex.org/I2277624104","display_name":"Fondazione Bruno Kessler","ror":"https://ror.org/01j33xk10","country_code":"IT","type":"facility","lineage":["https://openalex.org/I2277624104"]}],"countries":["IT"],"is_corresponding":false,"raw_author_name":"Nicola Massari","raw_affiliation_strings":["Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Center for Materials & Microsystems Fondazione Bruno Kessler Trento, Italy","institution_ids":["https://openalex.org/I2277624104"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I2277624104"],"apc_list":null,"apc_paid":null,"fwci":0.5258,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.62583333,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"51","issue":null,"first_page":"197","last_page":"200"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12153","display_name":"Advanced Optical Sensing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12153","display_name":"Advanced Optical Sensing Technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/3105","display_name":"Instrumentation"},"field":{"id":"https://openalex.org/fields/31","display_name":"Physics and Astronomy"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10540","display_name":"Advanced Fluorescence Microscopy Techniques","score":0.9853000044822693,"subfield":{"id":"https://openalex.org/subfields/1304","display_name":"Biophysics"},"field":{"id":"https://openalex.org/fields/13","display_name":"Biochemistry, Genetics and Molecular Biology"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9811999797821045,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.7765383720397949},{"id":"https://openalex.org/keywords/abstraction","display_name":"Abstraction","score":0.5953765511512756},{"id":"https://openalex.org/keywords/detector","display_name":"Detector","score":0.5763533711433411},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.576284646987915},{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.48257413506507874},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4475098252296448},{"id":"https://openalex.org/keywords/stacking","display_name":"Stacking","score":0.4404072165489197},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4316096901893616},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2780965268611908},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2736722230911255},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1826535165309906},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15802645683288574}],"concepts":[{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.7765383720397949},{"id":"https://openalex.org/C124304363","wikidata":"https://www.wikidata.org/wiki/Q673661","display_name":"Abstraction","level":2,"score":0.5953765511512756},{"id":"https://openalex.org/C94915269","wikidata":"https://www.wikidata.org/wiki/Q1834857","display_name":"Detector","level":2,"score":0.5763533711433411},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.576284646987915},{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.48257413506507874},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4475098252296448},{"id":"https://openalex.org/C33347731","wikidata":"https://www.wikidata.org/wiki/Q285210","display_name":"Stacking","level":2,"score":0.4404072165489197},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4316096901893616},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2780965268611908},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2736722230911255},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1826535165309906},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15802645683288574},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C46141821","wikidata":"https://www.wikidata.org/wiki/Q209402","display_name":"Nuclear magnetic resonance","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icicdt.2018.8399790","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2018.8399790","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2018 International Conference on IC Design & Technology (ICICDT)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5299999713897705,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W165072113","https://openalex.org/W1969701110","https://openalex.org/W2004482449","https://openalex.org/W2019230763","https://openalex.org/W2029106456","https://openalex.org/W2044222703","https://openalex.org/W2053286848","https://openalex.org/W2107641824","https://openalex.org/W2117506486","https://openalex.org/W2135448171","https://openalex.org/W2136682398","https://openalex.org/W2161478116","https://openalex.org/W2218437761","https://openalex.org/W2289837945","https://openalex.org/W2520821946","https://openalex.org/W2558344443","https://openalex.org/W2583154691","https://openalex.org/W2620252899","https://openalex.org/W2735028934","https://openalex.org/W2743201213","https://openalex.org/W2793076039","https://openalex.org/W2793543504","https://openalex.org/W2887359459","https://openalex.org/W3106063046","https://openalex.org/W6661543039"],"related_works":["https://openalex.org/W2035329725","https://openalex.org/W4376641153","https://openalex.org/W2070875936","https://openalex.org/W4250391473","https://openalex.org/W3045075405","https://openalex.org/W4302292679","https://openalex.org/W4241625287","https://openalex.org/W2050788868","https://openalex.org/W4295885776","https://openalex.org/W2027634686"],"abstract_inverted_index":{"Single-photon":[0],"avalanche":[1],"diodes":[2],"(SPAD)":[3],"are":[4],"increasingly":[5],"being":[6],"used":[7],"in":[8,36,58],"a":[9,43],"number":[10],"of":[11,52,64,80],"applications":[12],"where":[13],"the":[14,19,55,62,69],"timing":[15],"information":[16],"carried":[17],"by":[18],"captured":[20],"light":[21],"is":[22,87],"crucial.":[23],"In":[24],"this":[25],"paper":[26],"we":[27],"will":[28,48],"analyze":[29],"which":[30],"challenges":[31],"need":[32],"to":[33,38,61,68],"be":[34],"addressed":[35],"order":[37],"integrate":[39],"SPAD":[40],"devices":[41],"into":[42],"CMOS":[44,59],"system-on-chip.":[45],"The":[46],"analysis":[47],"span":[49],"three":[50],"levels":[51],"abstraction,":[53],"from":[54],"device":[56],"integration":[57],"technology,":[60],"implementation":[63],"time-resolved":[65],"arrayed":[66],"electronics,":[67],"architectural":[70],"level":[71],"design.":[72],"A":[73],"perspective":[74],"on":[75],"future":[76],"developments,":[77],"involving":[78],"use":[79],"advanced":[81],"technologies":[82],"such":[83],"as":[84],"3D":[85],"stacking,":[86],"given.":[88]},"counts_by_year":[{"year":2022,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}