{"id":"https://openalex.org/W2143559292","doi":"https://doi.org/10.1109/icicdt.2014.6838615","title":"Bio-integrated electronics","display_name":"Bio-integrated electronics","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W2143559292","doi":"https://doi.org/10.1109/icicdt.2014.6838615","mag":"2143559292"},"language":"en","primary_location":{"id":"doi:10.1109/icicdt.2014.6838615","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838615","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5039650266","display_name":"Nanshu Lu","orcid":"https://orcid.org/0000-0002-3595-3851"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nanshu Lu","raw_affiliation_strings":["Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX, USA","Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, NASCENT Center, Texas Materials Institute University of Texas Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, NASCENT Center, Texas Materials Institute University of Texas Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5055863791","display_name":"Pulin Wang","orcid":"https://orcid.org/0000-0001-5466-2120"},"institutions":[{"id":"https://openalex.org/I86519309","display_name":"The University of Texas at Austin","ror":"https://ror.org/00hj54h04","country_code":"US","type":"education","lineage":["https://openalex.org/I86519309"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Pulin Wang","raw_affiliation_strings":["Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX, USA","Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, NASCENT Center, Texas Materials Institute University of Texas Austin, TX, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Aerospace Engineering and Engineering Mechanics, University of Texas, Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]},{"raw_affiliation_string":"Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, NASCENT Center, Texas Materials Institute University of Texas Austin, TX, USA","institution_ids":["https://openalex.org/I86519309"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I86519309"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.23181293,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":94,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"5"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10338","display_name":"Advanced Sensor and Energy Harvesting Materials","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11601","display_name":"Neuroscience and Neural Engineering","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2804","display_name":"Cellular and Molecular Neuroscience"},"field":{"id":"https://openalex.org/fields/28","display_name":"Neuroscience"},"domain":{"id":"https://openalex.org/domains/1","display_name":"Life Sciences"}},{"id":"https://openalex.org/T10660","display_name":"Conducting polymers and applications","score":0.9909999966621399,"subfield":{"id":"https://openalex.org/subfields/2507","display_name":"Polymers and Plastics"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electronics","display_name":"Electronics","score":0.6761547923088074},{"id":"https://openalex.org/keywords/curvilinear-coordinates","display_name":"Curvilinear coordinates","score":0.5322482585906982},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.4662927985191345},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.45383384823799133},{"id":"https://openalex.org/keywords/wafer","display_name":"Wafer","score":0.4452899694442749},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.44415411353111267},{"id":"https://openalex.org/keywords/stretchable-electronics","display_name":"Stretchable electronics","score":0.42186230421066284},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41973644495010376},{"id":"https://openalex.org/keywords/flexible-electronics","display_name":"Flexible electronics","score":0.41204211115837097},{"id":"https://openalex.org/keywords/multidisciplinary-approach","display_name":"Multidisciplinary approach","score":0.4112219214439392},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.3248588442802429},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.24956583976745605},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.1324298083782196}],"concepts":[{"id":"https://openalex.org/C138331895","wikidata":"https://www.wikidata.org/wiki/Q11650","display_name":"Electronics","level":2,"score":0.6761547923088074},{"id":"https://openalex.org/C98343798","wikidata":"https://www.wikidata.org/wiki/Q1790208","display_name":"Curvilinear coordinates","level":2,"score":0.5322482585906982},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.4662927985191345},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.45383384823799133},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.4452899694442749},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.44415411353111267},{"id":"https://openalex.org/C2781196758","wikidata":"https://www.wikidata.org/wiki/Q7623486","display_name":"Stretchable electronics","level":3,"score":0.42186230421066284},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41973644495010376},{"id":"https://openalex.org/C84967400","wikidata":"https://www.wikidata.org/wiki/Q1066289","display_name":"Flexible electronics","level":2,"score":0.41204211115837097},{"id":"https://openalex.org/C22467394","wikidata":"https://www.wikidata.org/wiki/Q849359","display_name":"Multidisciplinary approach","level":2,"score":0.4112219214439392},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.3248588442802429},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.24956583976745605},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.1324298083782196},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C144024400","wikidata":"https://www.wikidata.org/wiki/Q21201","display_name":"Sociology","level":0,"score":0.0},{"id":"https://openalex.org/C36289849","wikidata":"https://www.wikidata.org/wiki/Q34749","display_name":"Social science","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icicdt.2014.6838615","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838615","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":44,"referenced_works":["https://openalex.org/W1531077914","https://openalex.org/W1971432607","https://openalex.org/W1979512319","https://openalex.org/W1979632448","https://openalex.org/W1994179563","https://openalex.org/W1998821319","https://openalex.org/W2000024623","https://openalex.org/W2004537406","https://openalex.org/W2015206113","https://openalex.org/W2020944319","https://openalex.org/W2030699080","https://openalex.org/W2042078699","https://openalex.org/W2044815207","https://openalex.org/W2048058267","https://openalex.org/W2053389582","https://openalex.org/W2080617891","https://openalex.org/W2081009679","https://openalex.org/W2082462751","https://openalex.org/W2085834391","https://openalex.org/W2087729698","https://openalex.org/W2105425384","https://openalex.org/W2105993389","https://openalex.org/W2107997727","https://openalex.org/W2108813868","https://openalex.org/W2114721754","https://openalex.org/W2118686809","https://openalex.org/W2127115871","https://openalex.org/W2134627279","https://openalex.org/W2148594799","https://openalex.org/W2148759767","https://openalex.org/W2154293914","https://openalex.org/W2156533489","https://openalex.org/W2157426451","https://openalex.org/W2158417770","https://openalex.org/W2160524585","https://openalex.org/W2163166270","https://openalex.org/W2163911639","https://openalex.org/W2164875840","https://openalex.org/W2167053601","https://openalex.org/W4212842305","https://openalex.org/W4213360791","https://openalex.org/W4249910493","https://openalex.org/W4254531944","https://openalex.org/W6676801660"],"related_works":["https://openalex.org/W2152638621","https://openalex.org/W2068787336","https://openalex.org/W2942737604","https://openalex.org/W4200275978","https://openalex.org/W2972273812","https://openalex.org/W2883714160","https://openalex.org/W3080253788","https://openalex.org/W4225003095","https://openalex.org/W2981157619","https://openalex.org/W2954793044"],"abstract_inverted_index":{"Strategies":[0],"for":[1],"bio-integrated":[2],"electronics":[3,42],"must":[4],"overcome":[5],"challenges":[6],"associated":[7],"with":[8,52],"the":[9,12,21,33,53,80],"mismatch":[10],"between":[11],"hard,":[13],"planar":[14],"surfaces":[15],"of":[16,25,40,82],"brittle":[17],"semiconductor":[18],"wafers":[19],"and":[20,38,50,67,86],"soft,":[22],"curvilinear":[23],"tissues":[24,49,54],"timely":[26],"dynamic":[27],"biological":[28,48],"systems.":[29],"This":[30],"paper":[31],"discusses":[32],"successful":[34],"structural":[35],"design,":[36],"fabrication":[37],"bio-integration":[39],"tissue-like":[41],"that":[43],"can":[44],"intimately":[45],"conform":[46],"to":[47,74],"deform":[51],"in":[55],"a":[56],"mechanically":[57],"invisible":[58],"manner.":[59],"Examples":[60],"including":[61],"epidermal":[62],"electronics,":[63,83],"instrumented":[64],"balloon":[65],"catheters,":[66],"smart":[68],"finger":[69],"tubes":[70],"will":[71],"be":[72],"discussed":[73],"manifest":[75],"our":[76],"multidisciplinary":[77],"research":[78],"at":[79],"boundary":[81],"mechanics,":[84],"materials,":[85],"biomedicine.":[87]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}