{"id":"https://openalex.org/W1997813167","doi":"https://doi.org/10.1109/icicdt.2014.6838583","title":"3D serial TSV link for low-power chip-to-chip communication","display_name":"3D serial TSV link for low-power chip-to-chip communication","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W1997813167","doi":"https://doi.org/10.1109/icicdt.2014.6838583","mag":"1997813167"},"language":"en","primary_location":{"id":"doi:10.1109/icicdt.2014.6838583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":true,"oa_status":"green","oa_url":"http://infoscience.epfl.ch/record/198188","any_repository_has_fulltext":true},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5054025554","display_name":"Giulia Beanato","orcid":null},"institutions":[{"id":"https://openalex.org/I5124864","display_name":"\u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne","ror":"https://ror.org/02s376052","country_code":"CH","type":"education","lineage":["https://openalex.org/I2799323385","https://openalex.org/I5124864"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Giulia Beanato","raw_affiliation_strings":["EPFL Lausanne, Switzerland","EPFL. Lausanne,Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EPFL Lausanne, Switzerland","institution_ids":["https://openalex.org/I5124864"]},{"raw_affiliation_string":"EPFL. Lausanne,Switzerland","institution_ids":["https://openalex.org/I5124864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5013635152","display_name":"Alessandro Cevrero","orcid":null},"institutions":[{"id":"https://openalex.org/I5124864","display_name":"\u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne","ror":"https://ror.org/02s376052","country_code":"CH","type":"education","lineage":["https://openalex.org/I2799323385","https://openalex.org/I5124864"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Alessandro Cevrero","raw_affiliation_strings":["EPFL Lausanne, Switzerland","EPFL. Lausanne,Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EPFL Lausanne, Switzerland","institution_ids":["https://openalex.org/I5124864"]},{"raw_affiliation_string":"EPFL. Lausanne,Switzerland","institution_ids":["https://openalex.org/I5124864"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5036616868","display_name":"Giovanni De Michel","orcid":null},"institutions":[{"id":"https://openalex.org/I5124864","display_name":"\u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne","ror":"https://ror.org/02s376052","country_code":"CH","type":"education","lineage":["https://openalex.org/I2799323385","https://openalex.org/I5124864"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Giovanni De Michel","raw_affiliation_strings":["Ecole Polytechnique Federale de Lausanne, Lausanne, VD, CH","EPFL. Lausanne,Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Ecole Polytechnique Federale de Lausanne, Lausanne, VD, CH","institution_ids":["https://openalex.org/I5124864"]},{"raw_affiliation_string":"EPFL. Lausanne,Switzerland","institution_ids":["https://openalex.org/I5124864"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072423303","display_name":"Yusuf Leblebici","orcid":null},"institutions":[{"id":"https://openalex.org/I5124864","display_name":"\u00c9cole Polytechnique F\u00e9d\u00e9rale de Lausanne","ror":"https://ror.org/02s376052","country_code":"CH","type":"education","lineage":["https://openalex.org/I2799323385","https://openalex.org/I5124864"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Yusuf Leblebici","raw_affiliation_strings":["EPFL Lausanne, Switzerland","EPFL. Lausanne,Switzerland"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"EPFL Lausanne, Switzerland","institution_ids":["https://openalex.org/I5124864"]},{"raw_affiliation_string":"EPFL. Lausanne,Switzerland","institution_ids":["https://openalex.org/I5124864"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I5124864"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9855999946594238,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/serialization","display_name":"Serialization","score":0.7952927350997925},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5964691638946533},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.583987832069397},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5707561373710632},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.5607316493988037},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5335066318511963},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.4920022189617157},{"id":"https://openalex.org/keywords/serial-communication","display_name":"Serial communication","score":0.464944988489151},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.4450918734073639},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.43728041648864746},{"id":"https://openalex.org/keywords/power-consumption","display_name":"Power consumption","score":0.41610509157180786},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.4158729314804077},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.38869190216064453},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.3785129487514496},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.3477702736854553},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.28360581398010254},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25909435749053955},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.15447425842285156}],"concepts":[{"id":"https://openalex.org/C52723943","wikidata":"https://www.wikidata.org/wiki/Q1127410","display_name":"Serialization","level":2,"score":0.7952927350997925},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5964691638946533},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.583987832069397},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5707561373710632},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.5607316493988037},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5335066318511963},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.4920022189617157},{"id":"https://openalex.org/C51707140","wikidata":"https://www.wikidata.org/wiki/Q518280","display_name":"Serial communication","level":2,"score":0.464944988489151},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.4450918734073639},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.43728041648864746},{"id":"https://openalex.org/C2984118289","wikidata":"https://www.wikidata.org/wiki/Q29954","display_name":"Power consumption","level":3,"score":0.41610509157180786},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.4158729314804077},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.38869190216064453},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.3785129487514496},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.3477702736854553},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.28360581398010254},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25909435749053955},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.15447425842285156},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icicdt.2014.6838583","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838583","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"},{"id":"pmh:oai:infoscience.epfl.ch:198188","is_oa":true,"landing_page_url":"http://infoscience.epfl.ch/record/198188","pdf_url":null,"source":{"id":"https://openalex.org/S4306400487","display_name":"Infoscience (Ecole Polytechnique F\u00e9d\u00e9rale de Lausanne)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"}],"best_oa_location":{"id":"pmh:oai:infoscience.epfl.ch:198188","is_oa":true,"landing_page_url":"http://infoscience.epfl.ch/record/198188","pdf_url":null,"source":{"id":"https://openalex.org/S4306400487","display_name":"Infoscience (Ecole Polytechnique F\u00e9d\u00e9rale de Lausanne)","issn_l":null,"issn":null,"is_oa":true,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Text"},"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.8899999856948853,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":10,"referenced_works":["https://openalex.org/W1551193487","https://openalex.org/W1973702728","https://openalex.org/W2020873383","https://openalex.org/W2086481541","https://openalex.org/W2121289955","https://openalex.org/W2127945400","https://openalex.org/W2155707315","https://openalex.org/W2170509098","https://openalex.org/W2481508967","https://openalex.org/W4230375614"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2360313402","https://openalex.org/W2046139226","https://openalex.org/W2513353273","https://openalex.org/W2549021975","https://openalex.org/W2333804548","https://openalex.org/W1968957853","https://openalex.org/W2170509098"],"abstract_inverted_index":{"3D-ICs":[0],"based":[1],"on":[2],"TSV":[3,41,81],"technology":[4],"provide":[5],"high":[6],"bandwidth":[7],"inter-chip":[8],"connections.":[9],"The":[10],"drawback":[11],"is":[12,47],"that":[13,69],"most":[14],"of":[15,23,33,53,62],"the":[16],"existing":[17],"TSVs":[18],"consume":[19],"a":[20],"large":[21],"amount":[22],"silicon":[24],"real":[25],"estate.":[26],"We":[27],"present":[28],"circuit-level":[29],"design":[30,44],"and":[31,49,56,76],"analysis":[32],"area":[34,74,92],"efficient,":[35],"low":[36],"power,":[37],"high-data-rate":[38],"3D":[39],"serial":[40,85],"links.":[42],"A":[43],"space":[45],"exploration":[46],"performed":[48],"trade-offs":[50],"in":[51,65],"terms":[52],"area,":[54],"power":[55],"performance":[57],"are":[58],"presented.":[59],"Circuit":[60],"simulations":[61],"RC-extracted":[63],"layouts":[64],"40nm":[66],"CMOS-technology":[67],"reveals":[68],"8:1":[70],"serialization":[71],"efficiently":[72],"balances":[73],"consumption":[75],"energy":[77],"efficiency.":[78],"Using":[79],"10\u03bcm-diameter":[80],"technology,":[82],"an":[83],"8Gb/s":[84],"link":[86],"consumes":[87],"only":[88],"84fJ/bit":[89],"with":[90],"10X":[91],"reduction":[93],"over":[94],"8b":[95],"parallel":[96],"bus.":[97]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}