{"id":"https://openalex.org/W2028082191","doi":"https://doi.org/10.1109/icicdt.2014.6838582","title":"Thermal-driven 3D floorplanning using localized TSV placement","display_name":"Thermal-driven 3D floorplanning using localized TSV placement","publication_year":2014,"publication_date":"2014-05-01","ids":{"openalex":"https://openalex.org/W2028082191","doi":"https://doi.org/10.1109/icicdt.2014.6838582","mag":"2028082191"},"language":"en","primary_location":{"id":"doi:10.1109/icicdt.2014.6838582","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838582","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5009441633","display_name":"Puskar Budhathoki","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087059","display_name":"Technology Innovation Institute","ror":"https://ror.org/001kv2y39","country_code":"AE","type":"facility","lineage":["https://openalex.org/I4210087059"]}],"countries":["AE"],"is_corresponding":true,"raw_author_name":"Puskar Budhathoki","raw_affiliation_strings":["Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE","[Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE]"],"affiliations":[{"raw_affiliation_string":"Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE","institution_ids":["https://openalex.org/I4210087059"]},{"raw_affiliation_string":"[Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE]","institution_ids":["https://openalex.org/I4210087059"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075543445","display_name":"Andreas Henschel","orcid":"https://orcid.org/0000-0003-1386-5372"},"institutions":[{"id":"https://openalex.org/I4210087059","display_name":"Technology Innovation Institute","ror":"https://ror.org/001kv2y39","country_code":"AE","type":"facility","lineage":["https://openalex.org/I4210087059"]}],"countries":["AE"],"is_corresponding":false,"raw_author_name":"Andreas Henschel","raw_affiliation_strings":["Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE","[Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE]"],"affiliations":[{"raw_affiliation_string":"Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE","institution_ids":["https://openalex.org/I4210087059"]},{"raw_affiliation_string":"[Institute Center for Smart Infrastructure (iSmart), Masdar Institute of Science and Technology, Abu Dhabi, UAE]","institution_ids":["https://openalex.org/I4210087059"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048725993","display_name":"Ibrahim M. Elfadel","orcid":"https://orcid.org/0000-0003-3220-9987"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Ibrahim Abe M. Elfadel","raw_affiliation_strings":["Institute Center for Microsystems (iMicro), Masdar Institute of Science and Technology, Abu Dhabi, UAE","Institute Center for Microsystems (iMicro), Masdar Institute of Science and Technology, Abu Dhabi, UAE#TAB#"],"affiliations":[{"raw_affiliation_string":"Institute Center for Microsystems (iMicro), Masdar Institute of Science and Technology, Abu Dhabi, UAE","institution_ids":[]},{"raw_affiliation_string":"Institute Center for Microsystems (iMicro), Masdar Institute of Science and Technology, Abu Dhabi, UAE#TAB#","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5009441633"],"corresponding_institution_ids":["https://openalex.org/I4210087059"],"apc_list":null,"apc_paid":null,"fwci":0.628,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.72937832,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":99},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9976000189781189,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10783","display_name":"Additive Manufacturing and 3D Printing Technologies","score":0.9945999979972839,"subfield":{"id":"https://openalex.org/subfields/2203","display_name":"Automotive Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/floorplan","display_name":"Floorplan","score":0.955361008644104},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.7727509140968323},{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5922806859016418},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.589709460735321},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5810627937316895},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5532981157302856},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5364129543304443},{"id":"https://openalex.org/keywords/design-flow","display_name":"Design flow","score":0.5281170606613159},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5202327966690063},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.507628321647644},{"id":"https://openalex.org/keywords/dissipation","display_name":"Dissipation","score":0.48366913199424744},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.44139859080314636},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4272601902484894},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2953639030456543},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.2645384669303894},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.2276115119457245},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.2248687744140625},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.2240816354751587},{"id":"https://openalex.org/keywords/silicon","display_name":"Silicon","score":0.20035669207572937}],"concepts":[{"id":"https://openalex.org/C130145326","wikidata":"https://www.wikidata.org/wiki/Q1553985","display_name":"Floorplan","level":2,"score":0.955361008644104},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.7727509140968323},{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5922806859016418},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.589709460735321},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5810627937316895},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5532981157302856},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5364129543304443},{"id":"https://openalex.org/C37135326","wikidata":"https://www.wikidata.org/wiki/Q931942","display_name":"Design flow","level":2,"score":0.5281170606613159},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5202327966690063},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.507628321647644},{"id":"https://openalex.org/C135402231","wikidata":"https://www.wikidata.org/wiki/Q898440","display_name":"Dissipation","level":2,"score":0.48366913199424744},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.44139859080314636},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4272601902484894},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2953639030456543},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.2645384669303894},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.2276115119457245},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.2248687744140625},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.2240816354751587},{"id":"https://openalex.org/C544956773","wikidata":"https://www.wikidata.org/wiki/Q670","display_name":"Silicon","level":2,"score":0.20035669207572937},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icicdt.2014.6838582","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icicdt.2014.6838582","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE International Conference on IC Design & Technology","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.8999999761581421}],"awards":[],"funders":[{"id":"https://openalex.org/F4320313837","display_name":"Advanced Technology Investment Company","ror":null},{"id":"https://openalex.org/F4320322420","display_name":"Masdar Institute of Science and Technology","ror":"https://ror.org/05hffr360"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1965050610","https://openalex.org/W1987293146","https://openalex.org/W1990789187","https://openalex.org/W1993700253","https://openalex.org/W2017615957","https://openalex.org/W2023264348","https://openalex.org/W2103714239","https://openalex.org/W2114910421","https://openalex.org/W2126157369","https://openalex.org/W2126339718","https://openalex.org/W2133965199","https://openalex.org/W2142760988","https://openalex.org/W2152290565","https://openalex.org/W2158969233","https://openalex.org/W3142845206","https://openalex.org/W3143608171","https://openalex.org/W6641457050","https://openalex.org/W6682899748"],"related_works":["https://openalex.org/W2027159884","https://openalex.org/W1990828594","https://openalex.org/W2089377260","https://openalex.org/W2076263604","https://openalex.org/W2028082191","https://openalex.org/W2886805502","https://openalex.org/W2046139226","https://openalex.org/W2809933636","https://openalex.org/W4399621287","https://openalex.org/W4239706042"],"abstract_inverted_index":{"While":[0],"3D-ICs":[1],"help":[2],"to":[3,35,46,105],"improve":[4,47],"circuit":[5],"performance":[6,67],"and":[7,16,56,68,115,154],"energy":[8],"efficiency":[9],"through":[10],"the":[11,17,31,48,53,59,102,107,112,122,155,159,186,189,192],"reduction":[12,179],"of":[13,22,30,39,62,101,111,161,195],"average":[14],"wirelength":[15],"increase":[18],"in":[19,52],"communication":[20],"bandwidth":[21],"on-chip":[23,124],"wiring,":[24],"their":[25,36],"thermal":[26,40,90,109,118,175,196],"management":[27],"remains":[28],"one":[29],"most":[32],"challenging":[33],"obstacles":[34],"productization.":[37],"Placement":[38],"through-silicon-vias":[41],"(TSVs)":[42],"has":[43],"been":[44],"proposed":[45],"vertical":[49],"heat":[50,63],"flow":[51,79,138],"chip":[54,66,113,168],"stack":[55,114],"this":[57,71],"alleviate":[58],"negative":[60],"impact":[61],"dissipation":[64],"on":[65],"reliability.":[69],"In":[70],"paper,":[72],"we":[73,94],"present":[74],"a":[75,86,128,136],"novel":[76,87],"physical":[77,152],"design":[78],"that":[80,93],"integrates":[81],"thermal-driven":[82,140],"3D":[83,141],"floorplanning":[84],"with":[85],"algorithm":[88,103,132,163],"for":[89,139,151,164,174],"TSVs":[91,119,176],"placement":[92,194],"call":[95],"localized":[96,193],"TSV":[97,182],"placement.":[98],"The":[99,131,143,184],"essence":[100],"is":[104,126,133,145],"analyze":[106],"layered":[108],"map":[110],"then":[116],"insert":[117],"iteratively":[120],"until":[121],"maximal":[123],"temperature":[125,169],"below":[127],"pre-selected":[129],"target.":[130],"implemented":[134],"within":[135],"full":[137],"floorplanning.":[142],"implementation":[144],"tested":[146],"using":[147],"several":[148],"standard":[149],"benchmarks":[150],"design,":[153],"experimental":[156],"results":[157],"show":[158],"suitability":[160],"our":[162],"significantly":[165],"reducing":[166],"maximum":[167],"at":[170,180],"reasonable":[171],"density":[172],"levels":[173],"(100\u00b0":[177],"Kelvin":[178],"0.5%":[181],"density).":[183],"larger":[185],"die":[187],"size,":[188],"more":[190],"beneficial":[191],"TSV's.":[197]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":1},{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}