{"id":"https://openalex.org/W4392943841","doi":"https://doi.org/10.1109/iceic61013.2024.10457196","title":"A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages","display_name":"A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages","publication_year":2024,"publication_date":"2024-01-28","ids":{"openalex":"https://openalex.org/W4392943841","doi":"https://doi.org/10.1109/iceic61013.2024.10457196"},"language":"en","primary_location":{"id":"doi:10.1109/iceic61013.2024.10457196","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/iceic61013.2024.10457196","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International Conference on Electronics, Information, and Communication (ICEIC)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111149824","display_name":"Seung-Mo Noh","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Seung-Mo Noh","raw_affiliation_strings":["College of Information and Communication Engineering, Sungkyunkwan University,Korea","Memory Division, Samsung Electronics Co., LTD., Korea","College of Information and Communication Engineering, Sungkyunkwan University, Korea"],"affiliations":[{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University,Korea","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"Memory Division, Samsung Electronics Co., LTD., Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University, Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5049559771","display_name":"Seung\u2010Kyu Kim","orcid":"https://orcid.org/0000-0002-1602-3288"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]},{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seungkyu Kim","raw_affiliation_strings":["College of Information and Communication Engineering, Sungkyunkwan University,Korea","Memory Division, Samsung Electronics Co., LTD., Korea","College of Information and Communication Engineering, Sungkyunkwan University, Korea"],"affiliations":[{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University,Korea","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"Memory Division, Samsung Electronics Co., LTD., Korea","institution_ids":["https://openalex.org/I2250650973"]},{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University, Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5023231184","display_name":"Seo-Yoon Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Seo-Yoon Lee","raw_affiliation_strings":["College of Information and Communication Engineering, Sungkyunkwan University,Korea","College of Information and Communication Engineering, Sungkyunkwan University, Korea"],"affiliations":[{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University,Korea","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University, Korea","institution_ids":["https://openalex.org/I848706"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5052707197","display_name":"Kee-Won Kwon","orcid":"https://orcid.org/0000-0003-4513-8532"},"institutions":[{"id":"https://openalex.org/I848706","display_name":"Sungkyunkwan University","ror":"https://ror.org/04q78tk20","country_code":"KR","type":"education","lineage":["https://openalex.org/I848706"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Kee-Won Kwon","raw_affiliation_strings":["College of Information and Communication Engineering, Sungkyunkwan University,Korea","College of Information and Communication Engineering, Sungkyunkwan University, Korea"],"affiliations":[{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University,Korea","institution_ids":["https://openalex.org/I848706"]},{"raw_affiliation_string":"College of Information and Communication Engineering, Sungkyunkwan University, Korea","institution_ids":["https://openalex.org/I848706"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5111149824"],"corresponding_institution_ids":["https://openalex.org/I2250650973","https://openalex.org/I848706"],"apc_list":null,"apc_paid":null,"fwci":0.5186,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.56572231,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9865999817848206,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9865999817848206,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.9833999872207642,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9801999926567078,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6711675524711609},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5141394734382629},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5043188333511353},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.417012482881546},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35583657026290894},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3283689320087433},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2737698554992676},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.21667802333831787},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.17307820916175842}],"concepts":[{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6711675524711609},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5141394734382629},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5043188333511353},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.417012482881546},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35583657026290894},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3283689320087433},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2737698554992676},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.21667802333831787},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.17307820916175842}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iceic61013.2024.10457196","is_oa":false,"landing_page_url":"http://dx.doi.org/10.1109/iceic61013.2024.10457196","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2024 International Conference on Electronics, Information, and Communication (ICEIC)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","score":0.5400000214576721,"display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1575729896","https://openalex.org/W2012602696","https://openalex.org/W2119142269","https://openalex.org/W2136571517","https://openalex.org/W2138782711","https://openalex.org/W4285227071","https://openalex.org/W4322731443"],"related_works":["https://openalex.org/W2748952813","https://openalex.org/W4252608911","https://openalex.org/W2184913151","https://openalex.org/W2389426768","https://openalex.org/W3147987719","https://openalex.org/W2599361292","https://openalex.org/W2698654916","https://openalex.org/W2907188494","https://openalex.org/W3163908127","https://openalex.org/W2155019192"],"abstract_inverted_index":{"In":[0],"this":[1,87],"paper,":[2],"we":[3],"propose":[4],"a":[5,16,19,26,57],"new":[6],"test":[7,13],"circuit":[8,88],"which":[9,37],"connects":[10],"the":[11,31,34,48,53,65],"interconnect":[12,72,96],"element":[14],"and":[15,62,74,80],"variable-resistor":[17],"in":[18,60,92],"voltage-divider":[20],"structure,":[21],"using":[22],"an":[23],"inverted-inverter":[24],"as":[25,100],"delay":[27],"element,":[28],"to":[29,52,95],"overcome":[30],"limitations":[32],"of":[33],"conventional":[35,54],"ring-oscillator,":[36],"is":[38],"commonly":[39],"used":[40],"for":[41,67],"process":[42],"monitoring.":[43],"Simulation":[44],"results":[45],"demonstrate":[46],"that":[47,86],"proposed":[49],"circuit,":[50],"compared":[51],"one,":[55],"achieves":[56],"six-fold":[58],"reduction":[59],"area":[61],"significantly":[63],"enhances":[64],"sensitivity":[66],"detecting":[68],"delays":[69],"caused":[70],"by":[71,78],"resistance":[73],"capacitance,":[75],"improving":[76],"them":[77],"12":[79],"3.6":[81],"times,":[82],"respectively.":[83],"We":[84],"anticipate":[85],"will":[89],"find":[90],"applications":[91],"areas":[93],"vulnerable":[94],"RC":[97],"delay,":[98],"such":[99],"3-dimensional":[101],"system":[102],"packages.":[103]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2025-12-25T23:11:45.687758","created_date":"2025-10-10T00:00:00"}