{"id":"https://openalex.org/W2221089672","doi":"https://doi.org/10.1109/iceee.2015.7357902","title":"The physical properties of nanomaterials: A challenge in materials science","display_name":"The physical properties of nanomaterials: A challenge in materials science","publication_year":2015,"publication_date":"2015-10-01","ids":{"openalex":"https://openalex.org/W2221089672","doi":"https://doi.org/10.1109/iceee.2015.7357902","mag":"2221089672"},"language":"en","primary_location":{"id":"doi:10.1109/iceee.2015.7357902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceee.2015.7357902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 12th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5003217300","display_name":"A.I. Oliva","orcid":"https://orcid.org/0000-0003-1854-7074"},"institutions":[{"id":"https://openalex.org/I68368234","display_name":"Center for Research and Advanced Studies of the National Polytechnic Institute","ror":"https://ror.org/009eqmr18","country_code":"MX","type":"facility","lineage":["https://openalex.org/I59361560","https://openalex.org/I68368234"]},{"id":"https://openalex.org/I59361560","display_name":"Instituto Polit\u00e9cnico Nacional","ror":"https://ror.org/059sp8j34","country_code":"MX","type":"education","lineage":["https://openalex.org/I59361560"]}],"countries":["MX"],"is_corresponding":true,"raw_author_name":"A. I. Oliva","raw_affiliation_strings":["Departamento de F\u00edsica Aplicada, Centro de Investigaci\u00f3n y de Estudios Avanzados del IPN Unidad, M\u00e9rida Yucat\u00e1n, M\u00e9xico"],"affiliations":[{"raw_affiliation_string":"Departamento de F\u00edsica Aplicada, Centro de Investigaci\u00f3n y de Estudios Avanzados del IPN Unidad, M\u00e9rida Yucat\u00e1n, M\u00e9xico","institution_ids":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5030006333","display_name":"J. M. Lugo","orcid":"https://orcid.org/0000-0002-3267-8268"},"institutions":[{"id":"https://openalex.org/I59361560","display_name":"Instituto Polit\u00e9cnico Nacional","ror":"https://ror.org/059sp8j34","country_code":"MX","type":"education","lineage":["https://openalex.org/I59361560"]},{"id":"https://openalex.org/I68368234","display_name":"Center for Research and Advanced Studies of the National Polytechnic Institute","ror":"https://ror.org/009eqmr18","country_code":"MX","type":"facility","lineage":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"J. M. Lugo","raw_affiliation_strings":["Departamento de F\u00edsica Aplicada, Centro de Investigaci\u00f3n y de Estudios Avanzados del IPN Unidad, M\u00e9rida Yucat\u00e1n, M\u00e9xico"],"affiliations":[{"raw_affiliation_string":"Departamento de F\u00edsica Aplicada, Centro de Investigaci\u00f3n y de Estudios Avanzados del IPN Unidad, M\u00e9rida Yucat\u00e1n, M\u00e9xico","institution_ids":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5003217300"],"corresponding_institution_ids":["https://openalex.org/I59361560","https://openalex.org/I68368234"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.09763506,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8804126977920532},{"id":"https://openalex.org/keywords/thermal-diffusivity","display_name":"Thermal diffusivity","score":0.7377870678901672},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.6536430716514587},{"id":"https://openalex.org/keywords/nanomaterials","display_name":"Nanomaterials","score":0.6419464349746704},{"id":"https://openalex.org/keywords/thermal-conductivity","display_name":"Thermal conductivity","score":0.6386911273002625},{"id":"https://openalex.org/keywords/elastic-modulus","display_name":"Elastic modulus","score":0.630530059337616},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5105386972427368},{"id":"https://openalex.org/keywords/metal","display_name":"Metal","score":0.5023691654205322},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.49868249893188477},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.47180333733558655},{"id":"https://openalex.org/keywords/thin-film","display_name":"Thin film","score":0.41602838039398193},{"id":"https://openalex.org/keywords/thermal-conductivity-measurement","display_name":"Thermal conductivity measurement","score":0.4131501615047455},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.23418423533439636},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.18583503365516663},{"id":"https://openalex.org/keywords/metallurgy","display_name":"Metallurgy","score":0.13912564516067505}],"concepts":[{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8804126977920532},{"id":"https://openalex.org/C37668627","wikidata":"https://www.wikidata.org/wiki/Q3381809","display_name":"Thermal diffusivity","level":2,"score":0.7377870678901672},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.6536430716514587},{"id":"https://openalex.org/C138631740","wikidata":"https://www.wikidata.org/wiki/Q967847","display_name":"Nanomaterials","level":2,"score":0.6419464349746704},{"id":"https://openalex.org/C97346530","wikidata":"https://www.wikidata.org/wiki/Q487005","display_name":"Thermal conductivity","level":2,"score":0.6386911273002625},{"id":"https://openalex.org/C43486711","wikidata":"https://www.wikidata.org/wiki/Q192005","display_name":"Elastic modulus","level":2,"score":0.630530059337616},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5105386972427368},{"id":"https://openalex.org/C544153396","wikidata":"https://www.wikidata.org/wiki/Q11426","display_name":"Metal","level":2,"score":0.5023691654205322},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.49868249893188477},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.47180333733558655},{"id":"https://openalex.org/C19067145","wikidata":"https://www.wikidata.org/wiki/Q1137203","display_name":"Thin film","level":2,"score":0.41602838039398193},{"id":"https://openalex.org/C102232406","wikidata":"https://www.wikidata.org/wiki/Q7783035","display_name":"Thermal conductivity measurement","level":3,"score":0.4131501615047455},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.23418423533439636},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.18583503365516663},{"id":"https://openalex.org/C191897082","wikidata":"https://www.wikidata.org/wiki/Q11467","display_name":"Metallurgy","level":1,"score":0.13912564516067505},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iceee.2015.7357902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceee.2015.7357902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 12th International Conference on Electrical Engineering, Computing Science and Automatic Control (CCE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W1987053090","https://openalex.org/W1990989521","https://openalex.org/W1991911633","https://openalex.org/W1998489626","https://openalex.org/W2013125835","https://openalex.org/W2024877067","https://openalex.org/W2037254523","https://openalex.org/W2067115238","https://openalex.org/W2069377610","https://openalex.org/W2073972696","https://openalex.org/W2085244905","https://openalex.org/W2093065511","https://openalex.org/W2093397260","https://openalex.org/W2104797335","https://openalex.org/W2105568581","https://openalex.org/W2118534298","https://openalex.org/W2135154168","https://openalex.org/W2141905618","https://openalex.org/W6648127262"],"related_works":["https://openalex.org/W2007907614","https://openalex.org/W2049308136","https://openalex.org/W2085734573","https://openalex.org/W2078190644","https://openalex.org/W1990690388","https://openalex.org/W2742817081","https://openalex.org/W2088886526","https://openalex.org/W4390545878","https://openalex.org/W1819148338","https://openalex.org/W2052119328"],"abstract_inverted_index":{"In":[0],"this":[1,91],"work,":[2],"some":[3,83],"initial":[4],"efforts":[5],"to":[6,25,69,95],"determine":[7],"the":[8,27,32,49,63,97,102,108,111,114,124,127,135,141,153],"physical":[9],"properties":[10,59,99,145],"of":[11,30,40,52,87,100,107,117,126],"metallic":[12,53,64,103,118],"films":[13,45,65],"with":[14,78,152],"thickness":[15,154],"values":[16,39,139],"below":[17],"200":[18,70],"nm":[19],"are":[20,55,76],"described.":[21],"The":[22,57,85],"proposed":[23],"methodologies":[24],"measure":[26],"temperature":[28],"coefficient":[29],"resistance,":[31],"specific":[33],"heat,":[34],"thermal":[35,37,58,98,142],"diffusivity,":[36],"conductivity":[38],"Au,":[41],"Al,":[42],"and":[43,143],"Cu":[44],"as":[46,48],"such":[47],"elastic":[50,115],"modulus":[51],"nano-alloys":[54],"discussed.":[56],"were":[60],"obtained":[61,133],"from":[62,67,134],"deposited":[66],"20":[68],"nm-thickness":[71],"on":[72],"glass":[73],"substrates,":[74,131],"which":[75],"heated":[77],"an":[79],"electrical":[80],"pulse":[81],"during":[82,90],"microseconds.":[84],"rate":[86],"heating":[88],"captured":[89],"short":[92],"time":[93],"permits":[94],"estimate":[96],"exclusively":[101],"film":[104],"without":[105],"affectation":[106],"substrate.":[109],"On":[110],"other":[112],"hand,":[113],"module":[116],"thin":[119],"films,":[120],"estimated":[121],"by":[122],"subtracting":[123],"effect":[125],"previously":[128],"characterized":[129],"polymeric":[130],"was":[132],"stress-strain":[136],"curves.":[137],"Obtained":[138],"for":[140,159],"mechanical":[144],"show":[146],"a":[147],"decrease":[148],"or":[149],"increase":[150],"behavior":[151],"value,":[155],"very":[156],"different":[157],"than":[158],"their":[160],"corresponding":[161],"bulk":[162],"values.":[163]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}