{"id":"https://openalex.org/W2005243784","doi":"https://doi.org/10.1109/iceee.2011.6106686","title":"Mechanical properties of AlCu film alloys prepared by thermal diffusion","display_name":"Mechanical properties of AlCu film alloys prepared by thermal diffusion","publication_year":2011,"publication_date":"2011-10-01","ids":{"openalex":"https://openalex.org/W2005243784","doi":"https://doi.org/10.1109/iceee.2011.6106686","mag":"2005243784"},"language":"en","primary_location":{"id":"doi:10.1109/iceee.2011.6106686","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceee.2011.6106686","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 8th International Conference on Electrical Engineering, Computing Science and Automatic Control","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5006510666","display_name":"Enrique Otero Huerta","orcid":null},"institutions":[{"id":"https://openalex.org/I4210138439","display_name":"Centro de Investigaci\u00f3n en Materiales Avanzados","ror":"https://ror.org/03h954e30","country_code":"MX","type":"facility","lineage":["https://openalex.org/I4210138439"]},{"id":"https://openalex.org/I68368234","display_name":"Center for Research and Advanced Studies of the National Polytechnic Institute","ror":"https://ror.org/009eqmr18","country_code":"MX","type":"facility","lineage":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}],"countries":["MX"],"is_corresponding":true,"raw_author_name":"E. Huerta","raw_affiliation_strings":["Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico","Departamento de Recubrimientos Nanoestructurados, CIMAV, Chihuahua, Chih, Mexico"],"affiliations":[{"raw_affiliation_string":"Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico","institution_ids":["https://openalex.org/I68368234"]},{"raw_affiliation_string":"Departamento de Recubrimientos Nanoestructurados, CIMAV, Chihuahua, Chih, Mexico","institution_ids":["https://openalex.org/I4210138439"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5003217300","display_name":"A.I. Oliva","orcid":"https://orcid.org/0000-0003-1854-7074"},"institutions":[{"id":"https://openalex.org/I68368234","display_name":"Center for Research and Advanced Studies of the National Polytechnic Institute","ror":"https://ror.org/009eqmr18","country_code":"MX","type":"facility","lineage":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"A. I. Oliva","raw_affiliation_strings":["Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico"],"affiliations":[{"raw_affiliation_string":"Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico","institution_ids":["https://openalex.org/I68368234"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5071551482","display_name":"J.E. Corona","orcid":"https://orcid.org/0000-0001-5225-5644"},"institutions":[{"id":"https://openalex.org/I68368234","display_name":"Center for Research and Advanced Studies of the National Polytechnic Institute","ror":"https://ror.org/009eqmr18","country_code":"MX","type":"facility","lineage":["https://openalex.org/I59361560","https://openalex.org/I68368234"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"J.E. Corona","raw_affiliation_strings":["Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico"],"affiliations":[{"raw_affiliation_string":"Departamento de F\u00edsica Aplicada, CINVESTAV-IPN Unidad-M\u00e9rida, Merida, Yucatan, Mexico","institution_ids":["https://openalex.org/I68368234"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5103127033","display_name":"J. Gonz\u00e1lez\u2010Hern\u00e1ndez","orcid":"https://orcid.org/0000-0002-3724-1583"},"institutions":[{"id":"https://openalex.org/I4210138439","display_name":"Centro de Investigaci\u00f3n en Materiales Avanzados","ror":"https://ror.org/03h954e30","country_code":"MX","type":"facility","lineage":["https://openalex.org/I4210138439"]}],"countries":["MX"],"is_corresponding":false,"raw_author_name":"J. Gonzalez-Hernandez","raw_affiliation_strings":["Departamento de Recubrimientos Nanoestructurados, CIMAV, Chihuahua, Chih, Mexico"],"affiliations":[{"raw_affiliation_string":"Departamento de Recubrimientos Nanoestructurados, CIMAV, Chihuahua, Chih, Mexico","institution_ids":["https://openalex.org/I4210138439"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5006510666"],"corresponding_institution_ids":["https://openalex.org/I4210138439","https://openalex.org/I68368234"],"apc_list":null,"apc_paid":null,"fwci":0.12611362,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.40926831,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10717","display_name":"Aluminum Alloys Composites Properties","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10377","display_name":"Metal and Thin Film Mechanics","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2211","display_name":"Mechanics of Materials"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/kapton","display_name":"Kapton","score":0.9579455852508545},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.8812006115913391},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.5952292680740356},{"id":"https://openalex.org/keywords/elastic-modulus","display_name":"Elastic modulus","score":0.5808111429214478},{"id":"https://openalex.org/keywords/surface-roughness","display_name":"Surface roughness","score":0.577690601348877},{"id":"https://openalex.org/keywords/ductility","display_name":"Ductility (Earth science)","score":0.5392277836799622},{"id":"https://openalex.org/keywords/ultimate-tensile-strength","display_name":"Ultimate tensile strength","score":0.4741891324520111},{"id":"https://openalex.org/keywords/diffusion","display_name":"Diffusion","score":0.46106797456741333},{"id":"https://openalex.org/keywords/tensile-testing","display_name":"Tensile testing","score":0.415606290102005},{"id":"https://openalex.org/keywords/creep","display_name":"Creep","score":0.16378998756408691},{"id":"https://openalex.org/keywords/polyimide","display_name":"Polyimide","score":0.151204913854599},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.09509938955307007}],"concepts":[{"id":"https://openalex.org/C45889518","wikidata":"https://www.wikidata.org/wiki/Q3192874","display_name":"Kapton","level":4,"score":0.9579455852508545},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.8812006115913391},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.5952292680740356},{"id":"https://openalex.org/C43486711","wikidata":"https://www.wikidata.org/wiki/Q192005","display_name":"Elastic modulus","level":2,"score":0.5808111429214478},{"id":"https://openalex.org/C107365816","wikidata":"https://www.wikidata.org/wiki/Q114817","display_name":"Surface roughness","level":2,"score":0.577690601348877},{"id":"https://openalex.org/C2776512210","wikidata":"https://www.wikidata.org/wiki/Q5311608","display_name":"Ductility (Earth science)","level":3,"score":0.5392277836799622},{"id":"https://openalex.org/C112950240","wikidata":"https://www.wikidata.org/wiki/Q76005","display_name":"Ultimate tensile strength","level":2,"score":0.4741891324520111},{"id":"https://openalex.org/C69357855","wikidata":"https://www.wikidata.org/wiki/Q163214","display_name":"Diffusion","level":2,"score":0.46106797456741333},{"id":"https://openalex.org/C182508753","wikidata":"https://www.wikidata.org/wiki/Q115605","display_name":"Tensile testing","level":3,"score":0.415606290102005},{"id":"https://openalex.org/C149912024","wikidata":"https://www.wikidata.org/wiki/Q462188","display_name":"Creep","level":2,"score":0.16378998756408691},{"id":"https://openalex.org/C2780965675","wikidata":"https://www.wikidata.org/wiki/Q145958","display_name":"Polyimide","level":3,"score":0.151204913854599},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.09509938955307007},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iceee.2011.6106686","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceee.2011.6106686","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 8th International Conference on Electrical Engineering, Computing Science and Automatic Control","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":17,"referenced_works":["https://openalex.org/W1611467432","https://openalex.org/W1965115145","https://openalex.org/W2014185775","https://openalex.org/W2022690165","https://openalex.org/W2026839480","https://openalex.org/W2041915086","https://openalex.org/W2067115238","https://openalex.org/W2072050059","https://openalex.org/W2080103400","https://openalex.org/W2097707330","https://openalex.org/W2135154168","https://openalex.org/W2147356974","https://openalex.org/W2156289209","https://openalex.org/W3143598967","https://openalex.org/W3161981401","https://openalex.org/W6670597316","https://openalex.org/W6921778734"],"related_works":["https://openalex.org/W1542594412","https://openalex.org/W2011965374","https://openalex.org/W2213983204","https://openalex.org/W264262877","https://openalex.org/W2807179668","https://openalex.org/W1997384903","https://openalex.org/W2050782889","https://openalex.org/W2012957474","https://openalex.org/W3005134112","https://openalex.org/W2552652012"],"abstract_inverted_index":{"Mechanical":[0],"properties":[1],"of":[2,20,49,59,65,70,77,83,96],"AlCu":[3,79],"alloys":[4,80],"deposited":[5],"by":[6,14,30,37,55],"thermal":[7,15],"evaporation":[8],"on":[9],"Kapton":[10,61],"substrates":[11],"and":[12,39,42,74,93],"formed":[13],"diffusion":[16],"were":[17,53,85,103],"investigated.":[18],"Formation":[19],"an":[21,94],"Al":[22],"<sub":[23],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[24],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sub>":[25],"Cu":[26],"phase":[27],"was":[28,35],"confirmed":[29],"XPS":[31],"technique.":[32],"Surface":[33],"morphology":[34],"examined":[36],"AFM":[38],"SEM":[40],"before":[41],"after":[43,100],"tension":[44],"mechanical":[45],"testing.":[46],"Stress-strain":[47],"curves":[48],"the":[50,57,60,66,71,78,90,97],"alloy":[51],"film":[52],"obtained":[54],"subtracting":[56],"effect":[58],"substrate":[62],"from":[63],"that":[64],"film-Kapton":[67],"system.":[68],"Reduction":[69],"elastic":[72],"modulus":[73],"improved":[75],"ductility":[76],"with":[81],"increasing":[82],"thickness":[84],"found.":[86,104],"A":[87],"decrement":[88],"in":[89],"surface":[91],"rms-roughness":[92],"increment":[95],"grain":[98],"size":[99],"tensile":[101],"testing":[102]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}