{"id":"https://openalex.org/W4205153866","doi":"https://doi.org/10.1109/icecs53924.2021.9665484","title":"A Simple, Versatile Integration Platform based on a Printed Circuit Board for Lab-on-a-Chip Systems","display_name":"A Simple, Versatile Integration Platform based on a Printed Circuit Board for Lab-on-a-Chip Systems","publication_year":2021,"publication_date":"2021-11-28","ids":{"openalex":"https://openalex.org/W4205153866","doi":"https://doi.org/10.1109/icecs53924.2021.9665484"},"language":"en","primary_location":{"id":"doi:10.1109/icecs53924.2021.9665484","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs53924.2021.9665484","pdf_url":null,"source":{"id":"https://openalex.org/S4363608220","display_name":"2021 28th IEEE International Conference on Electronics, Circuits, and Systems (ICECS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 28th IEEE International Conference on Electronics, Circuits, and Systems (ICECS)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5019191376","display_name":"Simon Dallaire","orcid":null},"institutions":[{"id":"https://openalex.org/I159129438","display_name":"Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al","ror":"https://ror.org/002rjbv21","country_code":"CA","type":"education","lineage":["https://openalex.org/I159129438","https://openalex.org/I49663120"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Simon Dallaire","raw_affiliation_strings":["Department of Computer Sciences, Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al, Montr\u00e9al, Qu\u00e9bec, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Sciences, Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al, Montr\u00e9al, Qu\u00e9bec, Canada","institution_ids":["https://openalex.org/I159129438"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5086765627","display_name":"Paul-Vah\u00e9 Cicek","orcid":"https://orcid.org/0000-0002-3665-0721"},"institutions":[{"id":"https://openalex.org/I159129438","display_name":"Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al","ror":"https://ror.org/002rjbv21","country_code":"CA","type":"education","lineage":["https://openalex.org/I159129438","https://openalex.org/I49663120"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Paul-Vahe Cicek","raw_affiliation_strings":["Department of Computer Sciences, Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al, Montr\u00e9al, Qu\u00e9bec, Canada"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Sciences, Universit\u00e9 du Qu\u00e9bec \u00e0 Montr\u00e9al, Montr\u00e9al, Qu\u00e9bec, Canada","institution_ids":["https://openalex.org/I159129438"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I159129438"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.24473412,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"4"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12452","display_name":"Electrowetting and Microfluidic Technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10412","display_name":"Microfluidic and Capillary Electrophoresis Applications","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11255","display_name":"Microfluidic and Bio-sensing Technologies","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/microfluidics","display_name":"Microfluidics","score":0.6257050037384033},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.6037157773971558},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.5727978944778442},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.5473952889442444},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.54142165184021},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5408011674880981},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5276578664779663},{"id":"https://openalex.org/keywords/lab-on-a-chip","display_name":"Lab-on-a-chip","score":0.5119898915290833},{"id":"https://openalex.org/keywords/process-integration","display_name":"Process integration","score":0.46668586134910583},{"id":"https://openalex.org/keywords/simple","display_name":"Simple (philosophy)","score":0.45573362708091736},{"id":"https://openalex.org/keywords/system-integration","display_name":"System integration","score":0.44877612590789795},{"id":"https://openalex.org/keywords/rapid-prototyping","display_name":"Rapid prototyping","score":0.44386690855026245},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.32163602113723755},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.31425851583480835},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.19991591572761536},{"id":"https://openalex.org/keywords/process-engineering","display_name":"Process engineering","score":0.19506466388702393},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.1339643895626068},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.11320528388023376},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.09774988889694214},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.06627172231674194}],"concepts":[{"id":"https://openalex.org/C8673954","wikidata":"https://www.wikidata.org/wiki/Q138845","display_name":"Microfluidics","level":2,"score":0.6257050037384033},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.6037157773971558},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.5727978944778442},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.5473952889442444},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.54142165184021},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5408011674880981},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5276578664779663},{"id":"https://openalex.org/C138942068","wikidata":"https://www.wikidata.org/wiki/Q633261","display_name":"Lab-on-a-chip","level":3,"score":0.5119898915290833},{"id":"https://openalex.org/C54725748","wikidata":"https://www.wikidata.org/wiki/Q7247277","display_name":"Process integration","level":2,"score":0.46668586134910583},{"id":"https://openalex.org/C2780586882","wikidata":"https://www.wikidata.org/wiki/Q7520643","display_name":"Simple (philosophy)","level":2,"score":0.45573362708091736},{"id":"https://openalex.org/C19527686","wikidata":"https://www.wikidata.org/wiki/Q1665453","display_name":"System integration","level":2,"score":0.44877612590789795},{"id":"https://openalex.org/C2780395129","wikidata":"https://www.wikidata.org/wiki/Q1128971","display_name":"Rapid prototyping","level":2,"score":0.44386690855026245},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.32163602113723755},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.31425851583480835},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.19991591572761536},{"id":"https://openalex.org/C21880701","wikidata":"https://www.wikidata.org/wiki/Q2144042","display_name":"Process engineering","level":1,"score":0.19506466388702393},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.1339643895626068},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.11320528388023376},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.09774988889694214},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.06627172231674194},{"id":"https://openalex.org/C111472728","wikidata":"https://www.wikidata.org/wiki/Q9471","display_name":"Epistemology","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icecs53924.2021.9665484","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs53924.2021.9665484","pdf_url":null,"source":{"id":"https://openalex.org/S4363608220","display_name":"2021 28th IEEE International Conference on Electronics, Circuits, and Systems (ICECS)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 28th IEEE International Conference on Electronics, Circuits, and Systems (ICECS)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5099999904632568,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":18,"referenced_works":["https://openalex.org/W1449895005","https://openalex.org/W1968144557","https://openalex.org/W1970228221","https://openalex.org/W2010564598","https://openalex.org/W2078235745","https://openalex.org/W2084778748","https://openalex.org/W2095363155","https://openalex.org/W2151353945","https://openalex.org/W2219522269","https://openalex.org/W2292686776","https://openalex.org/W2527698513","https://openalex.org/W2548392038","https://openalex.org/W2551801313","https://openalex.org/W2592298146","https://openalex.org/W2756193405","https://openalex.org/W2796867306","https://openalex.org/W2995133716","https://openalex.org/W3002683399"],"related_works":["https://openalex.org/W2378988447","https://openalex.org/W2744482820","https://openalex.org/W2029991833","https://openalex.org/W1966775758","https://openalex.org/W2030307799","https://openalex.org/W2101762475","https://openalex.org/W2136854845","https://openalex.org/W853650844","https://openalex.org/W2350336798","https://openalex.org/W2383861569"],"abstract_inverted_index":{"This":[0,82],"work":[1],"presents":[2],"a":[3,13,88],"novel":[4],"process":[5,21],"to":[6,65,85],"embed":[7],"an":[8,78],"active":[9],"silicon":[10],"chip":[11],"into":[12],"PCB":[14],"for":[15,36,45],"integrated":[16],"microfluidic":[17],"applications.":[18],"The":[19],"integration":[20],"is":[22,34,50,62],"fast,":[23],"affordable,":[24],"and":[25,31],"makes":[26],"use":[27],"of":[28,58],"standard":[29],"equipment":[30],"materials.":[32],"It":[33],"ideal":[35],"quick":[37],"prototyping":[38],"but":[39],"could":[40],"also":[41],"eventually":[42],"be":[43,72],"adapted":[44],"mass":[46],"production":[47],"since":[48],"it":[49],"compatible":[51],"with":[52],"industrial":[53],"technologies.":[54],"A":[55],"significant":[56],"benefit":[57],"the":[59,63],"proposed":[60],"method":[61],"ability":[64],"directly":[66],"combine":[67],"heterogeneous":[68],"components,":[69],"whether":[70],"they":[71],"microfluidic,":[73],"microelectromechanical,":[74],"or":[75],"electronic,":[76],"within":[77],"integrated,":[79],"compact":[80],"system.":[81],"platform":[83],"aims":[84],"serve":[86],"as":[87],"further":[89],"step":[90],"towards":[91],"realizing":[92],"intelligent":[93],"lab-on-a-chip":[94],"systems.":[95]},"counts_by_year":[{"year":2025,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}