{"id":"https://openalex.org/W1995742769","doi":"https://doi.org/10.1109/icecs.2013.6815494","title":"Studies on die-to-substrate interconnects for High-Q PCB inductors","display_name":"Studies on die-to-substrate interconnects for High-Q PCB inductors","publication_year":2013,"publication_date":"2013-12-01","ids":{"openalex":"https://openalex.org/W1995742769","doi":"https://doi.org/10.1109/icecs.2013.6815494","mag":"1995742769"},"language":"en","primary_location":{"id":"doi:10.1109/icecs.2013.6815494","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2013.6815494","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS)","raw_type":"proceedings-article"},"type":"preprint","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5048752742","display_name":"Mohammadreza Pourakbar","orcid":"https://orcid.org/0000-0002-4302-4323"},"institutions":[{"id":"https://openalex.org/I71270174","display_name":"Victoria University","ror":"https://ror.org/04j757h98","country_code":"AU","type":"education","lineage":["https://openalex.org/I71270174"]}],"countries":["AU"],"is_corresponding":true,"raw_author_name":"Mohammadreza Pourakbar","raw_affiliation_strings":["College of Engineering and Science, Victoria University, Melbourne, Australia","College of Engineering and Science,Victoria University, Melbourne, Australia"],"affiliations":[{"raw_affiliation_string":"College of Engineering and Science, Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]},{"raw_affiliation_string":"College of Engineering and Science,Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5104440506","display_name":"Lance Linton","orcid":null},"institutions":[{"id":"https://openalex.org/I71270174","display_name":"Victoria University","ror":"https://ror.org/04j757h98","country_code":"AU","type":"education","lineage":["https://openalex.org/I71270174"]}],"countries":["AU"],"is_corresponding":false,"raw_author_name":"Lance Linton","raw_affiliation_strings":["College of Engineering and Science, Victoria University, Melbourne, Australia","College of Engineering and Science,Victoria University, Melbourne, Australia"],"affiliations":[{"raw_affiliation_string":"College of Engineering and Science, Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]},{"raw_affiliation_string":"College of Engineering and Science,Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5090763602","display_name":"Fran\u00e7ois Rivet","orcid":"https://orcid.org/0000-0002-6003-4208"},"institutions":[{"id":"https://openalex.org/I15057530","display_name":"Universit\u00e9 de Bordeaux","ror":"https://ror.org/057qpr032","country_code":"FR","type":"education","lineage":["https://openalex.org/I15057530"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"Francois Rivet","raw_affiliation_strings":["University of Bordeaux, Talence, France","University of Bordeaux, 351 Cours de la Lib\u00e9ration, 33405 Talence, France"],"affiliations":[{"raw_affiliation_string":"University of Bordeaux, Talence, France","institution_ids":["https://openalex.org/I15057530"]},{"raw_affiliation_string":"University of Bordeaux, 351 Cours de la Lib\u00e9ration, 33405 Talence, France","institution_ids":["https://openalex.org/I15057530"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5029078662","display_name":"M. Faulkner","orcid":"https://orcid.org/0000-0001-6777-1481"},"institutions":[{"id":"https://openalex.org/I71270174","display_name":"Victoria University","ror":"https://ror.org/04j757h98","country_code":"AU","type":"education","lineage":["https://openalex.org/I71270174"]}],"countries":["AU"],"is_corresponding":false,"raw_author_name":"Michael Faulkner","raw_affiliation_strings":["College of Engineering and Science, Victoria University, Melbourne, Australia","College of Engineering and Science,Victoria University, Melbourne, Australia"],"affiliations":[{"raw_affiliation_string":"College of Engineering and Science, Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]},{"raw_affiliation_string":"College of Engineering and Science,Victoria University, Melbourne, Australia","institution_ids":["https://openalex.org/I71270174"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5048752742"],"corresponding_institution_ids":["https://openalex.org/I71270174"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.07041213,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"633","last_page":"636"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.821884036064148},{"id":"https://openalex.org/keywords/flip-chip","display_name":"Flip chip","score":0.8110775947570801},{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.7352313995361328},{"id":"https://openalex.org/keywords/q-factor","display_name":"Q factor","score":0.645961344242096},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.6217943429946899},{"id":"https://openalex.org/keywords/soldering","display_name":"Soldering","score":0.6087791919708252},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.4999666213989258},{"id":"https://openalex.org/keywords/substrate","display_name":"Substrate (aquarium)","score":0.48268723487854004},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.45525938272476196},{"id":"https://openalex.org/keywords/wire-bonding","display_name":"Wire bonding","score":0.43458032608032227},{"id":"https://openalex.org/keywords/planar","display_name":"Planar","score":0.41733479499816895},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4056777358055115},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3436204791069031},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3099557161331177},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.2591261863708496},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.25435972213745117},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.2406604290008545},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11922040581703186},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.10229769349098206},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.06653138995170593}],"concepts":[{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.821884036064148},{"id":"https://openalex.org/C79072407","wikidata":"https://www.wikidata.org/wiki/Q432439","display_name":"Flip chip","level":4,"score":0.8110775947570801},{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.7352313995361328},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.645961344242096},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.6217943429946899},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.6087791919708252},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.4999666213989258},{"id":"https://openalex.org/C2777289219","wikidata":"https://www.wikidata.org/wiki/Q7632154","display_name":"Substrate (aquarium)","level":2,"score":0.48268723487854004},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.45525938272476196},{"id":"https://openalex.org/C140269135","wikidata":"https://www.wikidata.org/wiki/Q750783","display_name":"Wire bonding","level":3,"score":0.43458032608032227},{"id":"https://openalex.org/C134786449","wikidata":"https://www.wikidata.org/wiki/Q3391255","display_name":"Planar","level":2,"score":0.41733479499816895},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4056777358055115},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3436204791069031},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3099557161331177},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.2591261863708496},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.25435972213745117},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.2406604290008545},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11922040581703186},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.10229769349098206},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.06653138995170593},{"id":"https://openalex.org/C121684516","wikidata":"https://www.wikidata.org/wiki/Q7600677","display_name":"Computer graphics (images)","level":1,"score":0.0},{"id":"https://openalex.org/C68928338","wikidata":"https://www.wikidata.org/wiki/Q131790","display_name":"Adhesive","level":3,"score":0.0},{"id":"https://openalex.org/C111368507","wikidata":"https://www.wikidata.org/wiki/Q43518","display_name":"Oceanography","level":1,"score":0.0},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icecs.2013.6815494","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2013.6815494","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE 20th International Conference on Electronics, Circuits, and Systems (ICECS)","raw_type":"proceedings-article"},{"id":"pmh:oai:eprints.vu.edu.au:31186","is_oa":false,"landing_page_url":"https://vuir.vu.edu.au/31186/","pdf_url":null,"source":{"id":"https://openalex.org/S4306400215","display_name":"Victoria University Research Repository (Victoria University)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I41156924","host_organization_name":"Victoria University of Wellington","host_organization_lineage":["https://openalex.org/I41156924"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"NonPeerReviewed"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W2054704813","https://openalex.org/W2097941400","https://openalex.org/W2106736446","https://openalex.org/W2117325391","https://openalex.org/W2159258996","https://openalex.org/W3158761656"],"related_works":["https://openalex.org/W2350159546","https://openalex.org/W2915158639","https://openalex.org/W1530391261","https://openalex.org/W4211121654","https://openalex.org/W2532422067","https://openalex.org/W2115932404","https://openalex.org/W4232272518","https://openalex.org/W2086209657","https://openalex.org/W1900362976","https://openalex.org/W2584920463"],"abstract_inverted_index":{"Wire-bond,":[0],"solder":[1,110],"ball,":[2],"and":[3,34,40,58,118],"copper":[4],"pillar":[5],"are":[6,48],"generally":[7],"utilised":[8],"as":[9],"chip-to-substrate":[10],"interconnects.":[11],"In":[12,114],"this":[13],"paper,":[14],"the":[15,45,56,59,93,121],"impact":[16],"of":[17,20,26,37,70,78,83],"these":[18],"types":[19],"connections":[21],"on":[22,87],"achievable":[23,86],"quality":[24],"factor":[25],"a":[27,52,68,81,105,109,124],"planar":[28],"inductor":[29,101],"is":[30,85,95,102,128],"investigated.":[31],"A":[32],"simple":[33],"accurate":[35],"Pi-model":[36],"such":[38,100],"joints,":[39],"mathematical":[41],"expressions":[42],"to":[43,97,104,116,119],"estimate":[44],"model":[46,57],"elements":[47],"proposed.":[49],"Results":[50],"show":[51],"good":[53],"agreement":[54],"between":[55],"EM-simulation":[60],"results,":[61],"with":[62,80],"inductance":[63,77],"accuracy":[64],"within":[65],"10%.":[66],"At":[67],"frequency":[69],"2GHz,":[71],"simulation":[72],"results":[73],"demonstrate":[74],"that":[75],"an":[76,88],"1.26nH":[79],"Q-factor":[82,94],"154":[84],"organic":[89],"laminate":[90],"substrate.":[91],"However,":[92],"reduced":[96],"100":[98],"when":[99],"connected":[103],"silicon":[106],"chip":[107],"via":[108],"bump":[111],"flip-chip":[112],"process.":[113],"order":[115],"implement":[117],"achieve":[120],"required":[122],"Q-factor,":[123],"practical":[125],"design":[126],"remedy":[127],"introduced.":[129]},"counts_by_year":[],"updated_date":"2026-03-10T16:38:18.471706","created_date":"2025-10-10T00:00:00"}