{"id":"https://openalex.org/W2087975376","doi":"https://doi.org/10.1109/icecs.2011.6122385","title":"Image processing technique for segmenting microstructural porosity of laser-welded thermoplastics","display_name":"Image processing technique for segmenting microstructural porosity of laser-welded thermoplastics","publication_year":2011,"publication_date":"2011-12-01","ids":{"openalex":"https://openalex.org/W2087975376","doi":"https://doi.org/10.1109/icecs.2011.6122385","mag":"2087975376"},"language":"en","primary_location":{"id":"doi:10.1109/icecs.2011.6122385","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2011.6122385","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 18th IEEE International Conference on Electronics, Circuits, and Systems","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5075990187","display_name":"Karl Leboeuf","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Karl Leboeuf","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","institution_ids":["https://openalex.org/I74413500"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076954084","display_name":"Iman Makaremi","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Iman Makaremi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","institution_ids":["https://openalex.org/I74413500"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5027205150","display_name":"Roberto Muscedere","orcid":null},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Roberto Muscedere","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","institution_ids":["https://openalex.org/I74413500"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada","institution_ids":["https://openalex.org/I74413500"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5116239815","display_name":"Majid Ahmadi","orcid":"https://orcid.org/0009-0006-4046-2121"},"institutions":[{"id":"https://openalex.org/I74413500","display_name":"University of Windsor","ror":"https://ror.org/01gw3d370","country_code":"CA","type":"education","lineage":["https://openalex.org/I74413500"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Majid Ahmadi","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Windsor, Windsor, ONT, Canada","institution_ids":["https://openalex.org/I74413500"]},{"raw_affiliation_string":"Department of Electrical and Computer Engineering University of Windsor Windsor, Ontario, N9B 3P4 Canada","institution_ids":["https://openalex.org/I74413500"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5075990187"],"corresponding_institution_ids":["https://openalex.org/I74413500"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.20464988,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"1","issue":null,"first_page":"760","last_page":"763"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T12111","display_name":"Industrial Vision Systems and Defect Detection","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11212","display_name":"Cultural Heritage Materials Analysis","score":0.9911999702453613,"subfield":{"id":"https://openalex.org/subfields/1204","display_name":"Archeology"},"field":{"id":"https://openalex.org/fields/12","display_name":"Arts and Humanities"},"domain":{"id":"https://openalex.org/domains/2","display_name":"Social Sciences"}},{"id":"https://openalex.org/T14339","display_name":"Image Processing and 3D Reconstruction","score":0.97079998254776,"subfield":{"id":"https://openalex.org/subfields/1707","display_name":"Computer Vision and Pattern Recognition"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/welding","display_name":"Welding","score":0.7637981176376343},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6991528868675232},{"id":"https://openalex.org/keywords/pixel","display_name":"Pixel","score":0.6470903158187866},{"id":"https://openalex.org/keywords/porosity","display_name":"Porosity","score":0.5867198705673218},{"id":"https://openalex.org/keywords/thermoplastic","display_name":"Thermoplastic","score":0.5647596120834351},{"id":"https://openalex.org/keywords/image-segmentation","display_name":"Image segmentation","score":0.5523324608802795},{"id":"https://openalex.org/keywords/process","display_name":"Process (computing)","score":0.5136911273002625},{"id":"https://openalex.org/keywords/image-processing","display_name":"Image processing","score":0.5078259110450745},{"id":"https://openalex.org/keywords/noise","display_name":"Noise (video)","score":0.5002965927124023},{"id":"https://openalex.org/keywords/segmentation","display_name":"Segmentation","score":0.49837279319763184},{"id":"https://openalex.org/keywords/laser","display_name":"Laser","score":0.47529494762420654},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.4710535705089569},{"id":"https://openalex.org/keywords/microstructure","display_name":"Microstructure","score":0.43633517622947693},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.39747196435928345},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.37305307388305664},{"id":"https://openalex.org/keywords/image","display_name":"Image (mathematics)","score":0.35378938913345337},{"id":"https://openalex.org/keywords/optics","display_name":"Optics","score":0.1725861132144928}],"concepts":[{"id":"https://openalex.org/C19474535","wikidata":"https://www.wikidata.org/wiki/Q131172","display_name":"Welding","level":2,"score":0.7637981176376343},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6991528868675232},{"id":"https://openalex.org/C160633673","wikidata":"https://www.wikidata.org/wiki/Q355198","display_name":"Pixel","level":2,"score":0.6470903158187866},{"id":"https://openalex.org/C6648577","wikidata":"https://www.wikidata.org/wiki/Q622669","display_name":"Porosity","level":2,"score":0.5867198705673218},{"id":"https://openalex.org/C2781247691","wikidata":"https://www.wikidata.org/wiki/Q380677","display_name":"Thermoplastic","level":2,"score":0.5647596120834351},{"id":"https://openalex.org/C124504099","wikidata":"https://www.wikidata.org/wiki/Q56933","display_name":"Image segmentation","level":3,"score":0.5523324608802795},{"id":"https://openalex.org/C98045186","wikidata":"https://www.wikidata.org/wiki/Q205663","display_name":"Process (computing)","level":2,"score":0.5136911273002625},{"id":"https://openalex.org/C9417928","wikidata":"https://www.wikidata.org/wiki/Q1070689","display_name":"Image processing","level":3,"score":0.5078259110450745},{"id":"https://openalex.org/C99498987","wikidata":"https://www.wikidata.org/wiki/Q2210247","display_name":"Noise (video)","level":3,"score":0.5002965927124023},{"id":"https://openalex.org/C89600930","wikidata":"https://www.wikidata.org/wiki/Q1423946","display_name":"Segmentation","level":2,"score":0.49837279319763184},{"id":"https://openalex.org/C520434653","wikidata":"https://www.wikidata.org/wiki/Q38867","display_name":"Laser","level":2,"score":0.47529494762420654},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.4710535705089569},{"id":"https://openalex.org/C87976508","wikidata":"https://www.wikidata.org/wiki/Q1498213","display_name":"Microstructure","level":2,"score":0.43633517622947693},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.39747196435928345},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.37305307388305664},{"id":"https://openalex.org/C115961682","wikidata":"https://www.wikidata.org/wiki/Q860623","display_name":"Image (mathematics)","level":2,"score":0.35378938913345337},{"id":"https://openalex.org/C120665830","wikidata":"https://www.wikidata.org/wiki/Q14620","display_name":"Optics","level":1,"score":0.1725861132144928},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icecs.2011.6122385","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2011.6122385","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2011 18th IEEE International Conference on Electronics, Circuits, and Systems","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","score":0.5799999833106995,"display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":13,"referenced_works":["https://openalex.org/W1533162639","https://openalex.org/W1569512666","https://openalex.org/W1580223426","https://openalex.org/W2081871292","https://openalex.org/W2125916419","https://openalex.org/W2143908786","https://openalex.org/W2149987068","https://openalex.org/W2156355922","https://openalex.org/W2158973473","https://openalex.org/W2256578114","https://openalex.org/W6678869746","https://openalex.org/W6681997312","https://openalex.org/W6683214161"],"related_works":["https://openalex.org/W2352588729","https://openalex.org/W2085033728","https://openalex.org/W4285411112","https://openalex.org/W2262409920","https://openalex.org/W3192220280","https://openalex.org/W2514640320","https://openalex.org/W2549651119","https://openalex.org/W2171299904","https://openalex.org/W1492141361","https://openalex.org/W2393201117"],"abstract_inverted_index":{"Plastics":[0],"are":[1,48],"used":[2],"in":[3,139],"a":[4,89,94,99,110,118,122,130,170],"truly":[5],"vast":[6],"number":[7,63],"of":[8,20,27,35,45,66,71,79,105,117,121,141,172],"applications,":[9],"and":[10,64,150],"research":[11],"is":[12,59,137,157,163],"continously":[13],"carried":[14],"out":[15],"to":[16,39,129,165],"improve":[17],"every":[18],"aspect":[19],"the":[21,36,43,55,62,72,80,115,133,160],"plastics":[22],"industry.":[23],"A":[24],"recent":[25],"study":[26],"laser":[28,124],"transmission":[29],"welding":[30],"[1]":[31],"required":[32],"cross-sectional":[33],"images":[34],"weld's":[37],"microstructure":[38],"be":[40,69],"analyzed":[41],"for":[42,82,113],"presence":[44],"pores,":[46,149],"which":[47],"tiny":[49],"bubbles":[50],"that":[51,61,98,159],"may":[52,68,102],"form":[53],"during":[54],"weld":[56,73,125],"process.":[57],"It":[58],"believed":[60],"size":[65],"pores":[67,85,168],"indicative":[70],"strength":[74],"[1].":[75],"The":[76,135],"current":[77],"state":[78],"art":[81],"detecting":[83],"these":[84],"involves":[86],"manually":[87],"drawing":[88],"contour":[90],"around":[91],"each":[92],"one;":[93],"laborious":[95],"process":[96],"given":[97],"typical":[100],"sample":[101],"have":[103],"hundreds-to-thousands":[104],"pores.":[106],"This":[107],"paper":[108],"presents":[109],"segmentation":[111],"system":[112],"classifying":[114],"pixels":[116],"microstructural":[119],"image":[120],"thermoplastic":[123],"as":[126],"either":[127],"belonging":[128],"pore":[131],"or":[132],"background.":[134],"algorithm":[136,162],"robust":[138],"terms":[140],"dealing":[142],"with":[143],"noise":[144],"from":[145],"flbreglass":[146],"strands,":[147],"cloudy":[148],"varying":[151],"exposure":[152],"time.":[153],"On":[154],"average,":[155],"it":[156],"estimated":[158],"proposed":[161],"able":[164],"correctly":[166],"classify":[167],"at":[169],"rate":[171],"approximately":[173],"90%":[174],"without":[175],"requiring":[176],"any":[177],"user":[178],"intervention.":[179]},"counts_by_year":[{"year":2021,"cited_by_count":1},{"year":2017,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}