{"id":"https://openalex.org/W2146131537","doi":"https://doi.org/10.1109/icecs.2007.4511065","title":"Characterization test plan for a PCB to DIE transition in a fcCBGA application","display_name":"Characterization test plan for a PCB to DIE transition in a fcCBGA application","publication_year":2007,"publication_date":"2007-12-01","ids":{"openalex":"https://openalex.org/W2146131537","doi":"https://doi.org/10.1109/icecs.2007.4511065","mag":"2146131537"},"language":"en","primary_location":{"id":"doi:10.1109/icecs.2007.4511065","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2007.4511065","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 14th IEEE International Conference on Electronics, Circuits and Systems","raw_type":"proceedings-article"},"type":"preprint","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5033213732","display_name":"Joseph Romen Cubillo","orcid":null},"institutions":[{"id":"https://openalex.org/I4210110387","display_name":"Microelectronica (Romania)","ror":"https://ror.org/01keak954","country_code":"RO","type":"company","lineage":["https://openalex.org/I4210110387"]},{"id":"https://openalex.org/I4210112016","display_name":"Institut des Mat\u00e9riaux, de Micro\u00e9lectronique et des Nanosciences de Provence","ror":"https://ror.org/0238zyh04","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I143002897","https://openalex.org/I21491767","https://openalex.org/I3132279224","https://openalex.org/I4210098836","https://openalex.org/I4210112016"]}],"countries":["FR","RO"],"is_corresponding":true,"raw_author_name":"J.R. Cubillo","raw_affiliation_strings":["L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France. romen.cubillo@l2mp.fr","L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille"],"affiliations":[{"raw_affiliation_string":"L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France. romen.cubillo@l2mp.fr","institution_ids":["https://openalex.org/I4210110387"]},{"raw_affiliation_string":"L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille","institution_ids":["https://openalex.org/I4210112016"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5110724987","display_name":"J. Gaubert","orcid":null},"institutions":[{"id":"https://openalex.org/I4210112016","display_name":"Institut des Mat\u00e9riaux, de Micro\u00e9lectronique et des Nanosciences de Provence","ror":"https://ror.org/0238zyh04","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I143002897","https://openalex.org/I21491767","https://openalex.org/I3132279224","https://openalex.org/I4210098836","https://openalex.org/I4210112016"]},{"id":"https://openalex.org/I4210128684","display_name":"Laboratoire des Technologies de la Micro\u00e9lectronique","ror":"https://ror.org/036zswm25","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I2738703131","https://openalex.org/I3020098449","https://openalex.org/I4210095849","https://openalex.org/I4210128684","https://openalex.org/I899635006"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"J. Gaubert","raw_affiliation_strings":["L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France. jean.gaubert@l2mp.fr","L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille"],"affiliations":[{"raw_affiliation_string":"L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France. jean.gaubert@l2mp.fr","institution_ids":["https://openalex.org/I4210128684"]},{"raw_affiliation_string":"L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille","institution_ids":["https://openalex.org/I4210112016"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5057267077","display_name":"Sylvain Bourdel","orcid":"https://orcid.org/0000-0001-9930-9945"},"institutions":[{"id":"https://openalex.org/I4210112016","display_name":"Institut des Mat\u00e9riaux, de Micro\u00e9lectronique et des Nanosciences de Provence","ror":"https://ror.org/0238zyh04","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I143002897","https://openalex.org/I21491767","https://openalex.org/I3132279224","https://openalex.org/I4210098836","https://openalex.org/I4210112016"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"S. Bourdel","raw_affiliation_strings":["L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France","L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille"],"affiliations":[{"raw_affiliation_string":"L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France","institution_ids":["https://openalex.org/I4210112016"]},{"raw_affiliation_string":"L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille","institution_ids":["https://openalex.org/I4210112016"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5090594751","display_name":"H. Barth\u00e9lemy","orcid":"https://orcid.org/0000-0003-2902-1094"},"institutions":[{"id":"https://openalex.org/I4210112016","display_name":"Institut des Mat\u00e9riaux, de Micro\u00e9lectronique et des Nanosciences de Provence","ror":"https://ror.org/0238zyh04","country_code":"FR","type":"facility","lineage":["https://openalex.org/I1294671590","https://openalex.org/I1294671590","https://openalex.org/I143002897","https://openalex.org/I21491767","https://openalex.org/I3132279224","https://openalex.org/I4210098836","https://openalex.org/I4210112016"]}],"countries":["FR"],"is_corresponding":false,"raw_author_name":"H. Barthelemy","raw_affiliation_strings":["L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France","L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille"],"affiliations":[{"raw_affiliation_string":"L2MP, Dpt Micro\u00e9lectronique et T\u00e9l\u00e9communications, Marseille, France","institution_ids":["https://openalex.org/I4210112016"]},{"raw_affiliation_string":"L2MP Dpt Microelectronique et Telecommun. Marseille, Marseille","institution_ids":["https://openalex.org/I4210112016"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5033213732"],"corresponding_institution_ids":["https://openalex.org/I4210110387","https://openalex.org/I4210112016"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.1713271,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"609","last_page":"612"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10262","display_name":"Microwave Engineering and Waveguides","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/ball-grid-array","display_name":"Ball grid array","score":0.74803227186203},{"id":"https://openalex.org/keywords/printed-circuit-board","display_name":"Printed circuit board","score":0.7106706500053406},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.578605592250824},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.5238066911697388},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5036517977714539},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.484439879655838},{"id":"https://openalex.org/keywords/ball","display_name":"Ball (mathematics)","score":0.4456534683704376},{"id":"https://openalex.org/keywords/scattering-parameters","display_name":"Scattering parameters","score":0.4351212680339813},{"id":"https://openalex.org/keywords/plan","display_name":"Plan (archaeology)","score":0.42456620931625366},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.39042410254478455},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.35250625014305115},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.22098273038864136},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.21749606728553772},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.11823374032974243}],"concepts":[{"id":"https://openalex.org/C94709252","wikidata":"https://www.wikidata.org/wiki/Q570628","display_name":"Ball grid array","level":3,"score":0.74803227186203},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.7106706500053406},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.578605592250824},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.5238066911697388},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5036517977714539},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.484439879655838},{"id":"https://openalex.org/C122041747","wikidata":"https://www.wikidata.org/wiki/Q838611","display_name":"Ball (mathematics)","level":2,"score":0.4456534683704376},{"id":"https://openalex.org/C195266298","wikidata":"https://www.wikidata.org/wiki/Q2165620","display_name":"Scattering parameters","level":2,"score":0.4351212680339813},{"id":"https://openalex.org/C2776505523","wikidata":"https://www.wikidata.org/wiki/Q4785468","display_name":"Plan (archaeology)","level":2,"score":0.42456620931625366},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.39042410254478455},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.35250625014305115},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.22098273038864136},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.21749606728553772},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.11823374032974243},{"id":"https://openalex.org/C50296614","wikidata":"https://www.wikidata.org/wiki/Q211387","display_name":"Soldering","level":2,"score":0.0},{"id":"https://openalex.org/C95457728","wikidata":"https://www.wikidata.org/wiki/Q309","display_name":"History","level":0,"score":0.0},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0},{"id":"https://openalex.org/C166957645","wikidata":"https://www.wikidata.org/wiki/Q23498","display_name":"Archaeology","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/icecs.2007.4511065","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2007.4511065","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 14th IEEE International Conference on Electronics, Circuits and Systems","raw_type":"proceedings-article"},{"id":"pmh:oai:HAL:hal-01856868v1","is_oa":false,"landing_page_url":"https://hal.science/hal-01856868","pdf_url":null,"source":{"id":"https://openalex.org/S4306402512","display_name":"HAL (Le Centre pour la Communication Scientifique Directe)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I1294671590","host_organization_name":"Centre National de la Recherche Scientifique","host_organization_lineage":["https://openalex.org/I1294671590"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"2007 14th IEEE International Conference on Electronics, Circuits and Systems (ICECS '07), Dec 2007, Marrakech, France. ⟨10.1109/ICECS.2007.4511065⟩","raw_type":"Conference papers"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Sustainable cities and communities","id":"https://metadata.un.org/sdg/11","score":0.6299999952316284}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":7,"referenced_works":["https://openalex.org/W1963618150","https://openalex.org/W2107883202","https://openalex.org/W2137332959","https://openalex.org/W2140197153","https://openalex.org/W2153899867","https://openalex.org/W2157640707","https://openalex.org/W2162187160"],"related_works":["https://openalex.org/W1975509756","https://openalex.org/W2122379732","https://openalex.org/W1916213107","https://openalex.org/W4391482815","https://openalex.org/W2359189194","https://openalex.org/W567677580","https://openalex.org/W3118337685","https://openalex.org/W2046583344","https://openalex.org/W2102024339","https://openalex.org/W2898894474"],"abstract_inverted_index":{"In":[0],"this":[1],"paper":[2],"we":[3,36],"analyze":[4],"a":[5,10,16,22,38,61,69],"characterization":[6],"test":[7,58],"plan":[8,59],"of":[9,50],"printed":[11],"circuit":[12],"board":[13],"(PCB)":[14],"to":[15,41,53],"flip":[17],"chip":[18],"DIE":[19,55],"transition":[20],"trough":[21,70],"ceramic":[23],"ball":[24],"grid":[25],"array":[26],"(CBGA)":[27],"package.":[28],"From":[29],"finite":[30],"element":[31],"method":[32],"(FEM)":[33],"simulation":[34],"results,":[35],"propose":[37],"testing":[39],"methodology":[40],"extract":[42],"the":[43,51,54],"wide":[44],"band":[45],"RF":[46],"scattering":[47],"S":[48],"parameters":[49],"PCB":[52],"transition.":[56],"The":[57],"includes":[60],"deembedding":[62],"short":[63],"open":[64],"line":[65,72],"(SOL)":[66],"technique,":[67],"and":[68],"reflect":[71],"(TRL)":[73],"calibration":[74],"on":[75],"PCB.":[76]},"counts_by_year":[],"updated_date":"2026-03-20T20:47:17.329874","created_date":"2025-10-10T00:00:00"}