{"id":"https://openalex.org/W2546131661","doi":"https://doi.org/10.1109/icecs.2004.1399736","title":"ISFET CMOS compatible design and encapsulation challenges","display_name":"ISFET CMOS compatible design and encapsulation challenges","publication_year":2005,"publication_date":"2005-03-31","ids":{"openalex":"https://openalex.org/W2546131661","doi":"https://doi.org/10.1109/icecs.2004.1399736","mag":"2546131661"},"language":"en","primary_location":{"id":"doi:10.1109/icecs.2004.1399736","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2004.1399736","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2004 11th IEEE International Conference on Electronics, Circuits and Systems, 2004. ICECS 2004.","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5036237002","display_name":"Liby Sudakov-Boreysha","orcid":null},"institutions":[{"id":"https://openalex.org/I174306211","display_name":"Technion \u2013 Israel Institute of Technology","ror":"https://ror.org/03qryx823","country_code":"IL","type":"education","lineage":["https://openalex.org/I174306211"]}],"countries":["IL"],"is_corresponding":true,"raw_author_name":"L. Sudakov-Boreysha","raw_affiliation_strings":["Bio-Medical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel"],"affiliations":[{"raw_affiliation_string":"Bio-Medical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel","institution_ids":["https://openalex.org/I174306211"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5034159041","display_name":"Arkadiy Morgenshtein","orcid":null},"institutions":[{"id":"https://openalex.org/I174306211","display_name":"Technion \u2013 Israel Institute of Technology","ror":"https://ror.org/03qryx823","country_code":"IL","type":"education","lineage":["https://openalex.org/I174306211"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"A. Morgenshtein","raw_affiliation_strings":["Electrical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel","institution_ids":["https://openalex.org/I174306211"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5015512495","display_name":"Uri Dinnar","orcid":null},"institutions":[{"id":"https://openalex.org/I174306211","display_name":"Technion \u2013 Israel Institute of Technology","ror":"https://ror.org/03qryx823","country_code":"IL","type":"education","lineage":["https://openalex.org/I174306211"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"U. Dinnar","raw_affiliation_strings":["Bio-Medical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel"],"affiliations":[{"raw_affiliation_string":"Bio-Medical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel","institution_ids":["https://openalex.org/I174306211"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5087985744","display_name":"Y. Nemirovsky","orcid":"https://orcid.org/0000-0002-0274-472X"},"institutions":[{"id":"https://openalex.org/I174306211","display_name":"Technion \u2013 Israel Institute of Technology","ror":"https://ror.org/03qryx823","country_code":"IL","type":"education","lineage":["https://openalex.org/I174306211"]}],"countries":["IL"],"is_corresponding":false,"raw_author_name":"Y. Nemirovsky","raw_affiliation_strings":["Electrical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel"],"affiliations":[{"raw_affiliation_string":"Electrical Engineering Department, Technion-Israel Institute of Technology, Haifa, Israel","institution_ids":["https://openalex.org/I174306211"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5036237002"],"corresponding_institution_ids":["https://openalex.org/I174306211"],"apc_list":null,"apc_paid":null,"fwci":0.7114,"has_fulltext":false,"cited_by_count":7,"citation_normalized_percentile":{"value":0.76465802,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"535","last_page":"538"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9936000108718872,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11429","display_name":"Semiconductor Lasers and Optical Devices","score":0.9876999855041504,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/encapsulation","display_name":"Encapsulation (networking)","score":0.8274470567703247},{"id":"https://openalex.org/keywords/isfet","display_name":"ISFET","score":0.7844622731208801},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.6358022689819336},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.44011980295181274},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41701921820640564},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3462878167629242},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.28538674116134644},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.25138235092163086},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20026469230651855},{"id":"https://openalex.org/keywords/transistor","display_name":"Transistor","score":0.17449656128883362},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.08790355920791626},{"id":"https://openalex.org/keywords/field-effect-transistor","display_name":"Field-effect transistor","score":0.0790223479270935}],"concepts":[{"id":"https://openalex.org/C81147070","wikidata":"https://www.wikidata.org/wiki/Q1172449","display_name":"Encapsulation (networking)","level":2,"score":0.8274470567703247},{"id":"https://openalex.org/C154275363","wikidata":"https://www.wikidata.org/wiki/Q904133","display_name":"ISFET","level":5,"score":0.7844622731208801},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.6358022689819336},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.44011980295181274},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41701921820640564},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3462878167629242},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.28538674116134644},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.25138235092163086},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20026469230651855},{"id":"https://openalex.org/C172385210","wikidata":"https://www.wikidata.org/wiki/Q5339","display_name":"Transistor","level":3,"score":0.17449656128883362},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.08790355920791626},{"id":"https://openalex.org/C145598152","wikidata":"https://www.wikidata.org/wiki/Q176097","display_name":"Field-effect transistor","level":4,"score":0.0790223479270935},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icecs.2004.1399736","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icecs.2004.1399736","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"Proceedings of the 2004 11th IEEE International Conference on Electronics, Circuits and Systems, 2004. ICECS 2004.","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":6,"referenced_works":["https://openalex.org/W268148305","https://openalex.org/W1538524231","https://openalex.org/W1986173272","https://openalex.org/W2056468073","https://openalex.org/W2118624184","https://openalex.org/W6677306725"],"related_works":["https://openalex.org/W1538524231","https://openalex.org/W289198894","https://openalex.org/W2791209250","https://openalex.org/W4210319942","https://openalex.org/W4310534299","https://openalex.org/W2077149778","https://openalex.org/W2362924575","https://openalex.org/W2022119225","https://openalex.org/W3191528883","https://openalex.org/W2124014882"],"abstract_inverted_index":{"This":[0],"work":[1],"presents":[2,17],"the":[3],"main":[4],"challenges":[5],"in":[6],"ISFET":[7],"encapsulation.":[8],"It":[9],"analyzes":[10],"SU8":[11],"drawbacks":[12],"as":[13],"an":[14],"encapsulant":[15],"and":[16],"a":[18],"novel":[19],"flip-chip":[20],"bonding":[21],"packaging":[22],"concept.":[23]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}