{"id":"https://openalex.org/W2543303533","doi":"https://doi.org/10.1109/iceac.2012.6471021","title":"Redundancy and ECC mechanisms to improve energy efficiency of on-die interconnects","display_name":"Redundancy and ECC mechanisms to improve energy efficiency of on-die interconnects","publication_year":2012,"publication_date":"2012-12-01","ids":{"openalex":"https://openalex.org/W2543303533","doi":"https://doi.org/10.1109/iceac.2012.6471021","mag":"2543303533"},"language":"en","primary_location":{"id":"doi:10.1109/iceac.2012.6471021","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceac.2012.6471021","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 International Conference on Energy Aware Computing","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5072570254","display_name":"Amr S. Helmy","orcid":"https://orcid.org/0000-0002-8109-4058"},"institutions":[{"id":"https://openalex.org/I80693520","display_name":"American University in Cairo","ror":"https://ror.org/0176yqn58","country_code":"EG","type":"education","lineage":["https://openalex.org/I80693520"]}],"countries":["EG"],"is_corresponding":true,"raw_author_name":"Amr Helmy","raw_affiliation_strings":["Zewail City for Science and Technology, American University in Cairo, Cairo, Egypt"],"affiliations":[{"raw_affiliation_string":"Zewail City for Science and Technology, American University in Cairo, Cairo, Egypt","institution_ids":["https://openalex.org/I80693520"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5072086494","display_name":"Alaa R. Alameldeen","orcid":"https://orcid.org/0000-0002-9064-4621"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Alaa R. Alameldeen","raw_affiliation_strings":["Intel Laboratories, Hillsboro, OR, USA"],"affiliations":[{"raw_affiliation_string":"Intel Laboratories, Hillsboro, OR, USA","institution_ids":["https://openalex.org/I1343180700"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":["https://openalex.org/A5072570254"],"corresponding_institution_ids":["https://openalex.org/I80693520"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.35413093,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10018","display_name":"Advancements in Battery Materials","score":0.9976999759674072,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/redundancy","display_name":"Redundancy (engineering)","score":0.7890399098396301},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7140923142433167},{"id":"https://openalex.org/keywords/fault-tolerance","display_name":"Fault tolerance","score":0.6346503496170044},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5296204686164856},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5125067234039307},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.49451038241386414},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.48762479424476624},{"id":"https://openalex.org/keywords/die","display_name":"Die (integrated circuit)","score":0.4746685028076172},{"id":"https://openalex.org/keywords/scaling","display_name":"Scaling","score":0.47356927394866943},{"id":"https://openalex.org/keywords/network-on-a-chip","display_name":"Network on a chip","score":0.4545733630657196},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.3776269555091858},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.2527075409889221},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.20138543844223022},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.20093855261802673},{"id":"https://openalex.org/keywords/distributed-computing","display_name":"Distributed computing","score":0.17383596301078796},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.07908859848976135},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.07203096151351929}],"concepts":[{"id":"https://openalex.org/C152124472","wikidata":"https://www.wikidata.org/wiki/Q1204361","display_name":"Redundancy (engineering)","level":2,"score":0.7890399098396301},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7140923142433167},{"id":"https://openalex.org/C63540848","wikidata":"https://www.wikidata.org/wiki/Q3140932","display_name":"Fault tolerance","level":2,"score":0.6346503496170044},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5296204686164856},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5125067234039307},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.49451038241386414},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.48762479424476624},{"id":"https://openalex.org/C111106434","wikidata":"https://www.wikidata.org/wiki/Q1072430","display_name":"Die (integrated circuit)","level":2,"score":0.4746685028076172},{"id":"https://openalex.org/C99844830","wikidata":"https://www.wikidata.org/wiki/Q102441924","display_name":"Scaling","level":2,"score":0.47356927394866943},{"id":"https://openalex.org/C128519102","wikidata":"https://www.wikidata.org/wiki/Q339554","display_name":"Network on a chip","level":2,"score":0.4545733630657196},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3776269555091858},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.2527075409889221},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.20138543844223022},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.20093855261802673},{"id":"https://openalex.org/C120314980","wikidata":"https://www.wikidata.org/wiki/Q180634","display_name":"Distributed computing","level":1,"score":0.17383596301078796},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.07908859848976135},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.07203096151351929},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iceac.2012.6471021","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iceac.2012.6471021","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2012 International Conference on Energy Aware Computing","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":38,"referenced_works":["https://openalex.org/W1661368752","https://openalex.org/W1981991312","https://openalex.org/W2017521824","https://openalex.org/W2031933249","https://openalex.org/W2038721103","https://openalex.org/W2043340768","https://openalex.org/W2045297930","https://openalex.org/W2067168777","https://openalex.org/W2083774980","https://openalex.org/W2099718120","https://openalex.org/W2101267004","https://openalex.org/W2103575641","https://openalex.org/W2108990513","https://openalex.org/W2110069347","https://openalex.org/W2111927499","https://openalex.org/W2119677480","https://openalex.org/W2120185818","https://openalex.org/W2120538858","https://openalex.org/W2132719761","https://openalex.org/W2132928495","https://openalex.org/W2136444750","https://openalex.org/W2139290660","https://openalex.org/W2140325747","https://openalex.org/W2144589285","https://openalex.org/W2146352987","https://openalex.org/W2147446937","https://openalex.org/W2149130672","https://openalex.org/W2152099665","https://openalex.org/W2161648335","https://openalex.org/W2164004001","https://openalex.org/W2165576183","https://openalex.org/W2169120770","https://openalex.org/W2828695070","https://openalex.org/W3141050786","https://openalex.org/W4229808229","https://openalex.org/W4233181266","https://openalex.org/W4238002809","https://openalex.org/W4249317113"],"related_works":["https://openalex.org/W2153096481","https://openalex.org/W2148616436","https://openalex.org/W2102525122","https://openalex.org/W4245282135","https://openalex.org/W4306316843","https://openalex.org/W2130594209","https://openalex.org/W2036953450","https://openalex.org/W4300955944","https://openalex.org/W2170004886","https://openalex.org/W2108317625"],"abstract_inverted_index":{"We":[0,17],"present":[1],"a":[2,10,25,75,85],"detailed":[3],"analysis":[4],"of":[5,24,30,77],"the":[6,22,28,33,45,48,56],"bandwidth":[7],"requirements":[8],"in":[9,32,44],"network-on-chip":[11,34],"at":[12],"high":[13],"and":[14,51,79],"low":[15],"voltages.":[16],"propose":[18],"mechanisms":[19,41],"to":[20,36,84],"maintain":[21],"functionality":[23],"system-on-chip":[26],"despite":[27],"presence":[29],"failures":[31,43],"used":[35],"connect":[37],"its":[38],"components.":[39],"Our":[40,58],"alleviate":[42],"links":[46],"and/or":[47],"connected":[49],"buffers,":[50],"allow":[52],"voltage":[53],"scaling":[54],"for":[55],"network.":[57],"best":[59],"mechanism":[60],"allows":[61],"reliable":[62],"network":[63],"operation":[64],"well":[65],"below":[66],"500":[67],"mV":[68],"while":[69],"reducing":[70],"power":[71],"by":[72,81],"more":[73],"than":[74],"factor":[76],"5":[78],"energy":[80],"28%":[82],"compared":[83],"baseline":[86],"without":[87],"fault-tolerance":[88],"mechanisms.":[89]},"counts_by_year":[],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}