{"id":"https://openalex.org/W2786322289","doi":"https://doi.org/10.1109/iccis.2017.8274865","title":"Temperature uniformity control based on thermal resistance network model","display_name":"Temperature uniformity control based on thermal resistance network model","publication_year":2017,"publication_date":"2017-11-01","ids":{"openalex":"https://openalex.org/W2786322289","doi":"https://doi.org/10.1109/iccis.2017.8274865","mag":"2786322289"},"language":"en","primary_location":{"id":"doi:10.1109/iccis.2017.8274865","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccis.2017.8274865","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5031857396","display_name":"Chongyang Yang","orcid":"https://orcid.org/0000-0001-6027-8379"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Chongyang Yang","raw_affiliation_strings":["SASEE of Beihang University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SASEE of Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5076732815","display_name":"Shuai Wu","orcid":"https://orcid.org/0000-0003-0288-5175"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Shuai Wu","raw_affiliation_strings":["SASEE of Beihang University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SASEE of Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100317589","display_name":"Zongxia Jiao","orcid":"https://orcid.org/0000-0002-2395-2165"},"institutions":[{"id":"https://openalex.org/I82880672","display_name":"Beihang University","ror":"https://ror.org/00wk2mp56","country_code":"CN","type":"education","lineage":["https://openalex.org/I82880672"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zongxia Jiao","raw_affiliation_strings":["SASEE of Beihang University, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"SASEE of Beihang University, Beijing, China","institution_ids":["https://openalex.org/I82880672"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042477126","display_name":"Baoyong Li","orcid":null},"institutions":[{"id":"https://openalex.org/I4210121144","display_name":"China Machine Press","ror":"https://ror.org/02t1dzr71","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210121144"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Baoyong Li","raw_affiliation_strings":["Beijing Hangxing Machine Manufacturing Company, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing Hangxing Machine Manufacturing Company, Beijing, China","institution_ids":["https://openalex.org/I4210121144"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5020561518","display_name":"Kai Wu","orcid":"https://orcid.org/0000-0002-7057-0442"},"institutions":[{"id":"https://openalex.org/I4210121144","display_name":"China Machine Press","ror":"https://ror.org/02t1dzr71","country_code":"CN","type":"other","lineage":["https://openalex.org/I4210121144"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Wu","raw_affiliation_strings":["Beijing Hangxing Machine Manufacturing Company, Beijing, China"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Beijing Hangxing Machine Manufacturing Company, Beijing, China","institution_ids":["https://openalex.org/I4210121144"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":"22","issue":null,"first_page":"710","last_page":"714"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10278","display_name":"Electric Motor Design and Analysis","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10278","display_name":"Electric Motor Design and Analysis","score":0.9954000115394592,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11222","display_name":"Magnetic Properties and Applications","score":0.9574999809265137,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12564","display_name":"Sensor Technology and Measurement Systems","score":0.9438999891281128,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/thermal-resistance","display_name":"Thermal resistance","score":0.7075544595718384},{"id":"https://openalex.org/keywords/resistance","display_name":"Resistance (ecology)","score":0.5173656344413757},{"id":"https://openalex.org/keywords/temperature-control","display_name":"Temperature control","score":0.5115979313850403},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.49273446202278137},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4731922149658203},{"id":"https://openalex.org/keywords/control","display_name":"Control (management)","score":0.4208373725414276},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.38602113723754883},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.18103954195976257},{"id":"https://openalex.org/keywords/control-engineering","display_name":"Control engineering","score":0.16664573550224304},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.12712526321411133},{"id":"https://openalex.org/keywords/thermodynamics","display_name":"Thermodynamics","score":0.12508991360664368},{"id":"https://openalex.org/keywords/artificial-intelligence","display_name":"Artificial intelligence","score":0.11316096782684326}],"concepts":[{"id":"https://openalex.org/C137693562","wikidata":"https://www.wikidata.org/wiki/Q899628","display_name":"Thermal resistance","level":3,"score":0.7075544595718384},{"id":"https://openalex.org/C57473165","wikidata":"https://www.wikidata.org/wiki/Q7315604","display_name":"Resistance (ecology)","level":2,"score":0.5173656344413757},{"id":"https://openalex.org/C536315585","wikidata":"https://www.wikidata.org/wiki/Q7698332","display_name":"Temperature control","level":2,"score":0.5115979313850403},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.49273446202278137},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4731922149658203},{"id":"https://openalex.org/C2775924081","wikidata":"https://www.wikidata.org/wiki/Q55608371","display_name":"Control (management)","level":2,"score":0.4208373725414276},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38602113723754883},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.18103954195976257},{"id":"https://openalex.org/C133731056","wikidata":"https://www.wikidata.org/wiki/Q4917288","display_name":"Control engineering","level":1,"score":0.16664573550224304},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.12712526321411133},{"id":"https://openalex.org/C97355855","wikidata":"https://www.wikidata.org/wiki/Q11473","display_name":"Thermodynamics","level":1,"score":0.12508991360664368},{"id":"https://openalex.org/C154945302","wikidata":"https://www.wikidata.org/wiki/Q11660","display_name":"Artificial intelligence","level":1,"score":0.11316096782684326},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C18903297","wikidata":"https://www.wikidata.org/wiki/Q7150","display_name":"Ecology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccis.2017.8274865","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccis.2017.8274865","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.550000011920929,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W2011158577","https://openalex.org/W2018123889","https://openalex.org/W2078726777","https://openalex.org/W2112535765","https://openalex.org/W4231290648"],"related_works":["https://openalex.org/W2057619737","https://openalex.org/W2016485274","https://openalex.org/W2328209056","https://openalex.org/W2369767695","https://openalex.org/W2165370268","https://openalex.org/W2360935846","https://openalex.org/W1135062604","https://openalex.org/W3009432609","https://openalex.org/W1902410098","https://openalex.org/W4294622179"],"abstract_inverted_index":{"Superplastic":[0],"forming":[1,5,98,139],"equipment":[2,99,140],"completes":[3],"the":[4,10,22,27,46,64,72,78,84,89,96,103,108,112,115,122,133,138],"process":[6],"making":[7],"use":[8],"of":[9,13,55,71,88,95,114,137],"excellent":[11],"ductility":[12],"some":[14],"metal":[15],"(Ti":[16],"<sub":[17],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[18],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">2</sub>":[19],"AlNb)":[20],"in":[21,25,40,42,60],"ultra-high":[23],"temperature,":[24],"which":[26,82,131],"temperature":[28,47,69,93,113,124,135],"control":[29,45,125],"is":[30,38,58,75,120,127],"extremely":[31],"important.":[32],"A":[33],"thermal":[34,116],"resistance":[35,117],"network":[36,118],"model":[37,54,119],"established":[39,59],"Modelica":[41,90,109],"order":[43],"to":[44,63],"uniformity":[48],"and":[49,51,86],"stability,":[50],"a":[52],"simulation":[53],"numerical":[56],"analysis":[57],"ANSYS":[61],"according":[62],"actual":[65],"engineering":[66],"parameters.":[67],"The":[68,92],"distribution":[70,136],"two":[73],"models":[74],"consistent":[76],"under":[77],"same":[79],"boundary":[80],"condition,":[81],"verified":[83],"rationality":[85],"accuracy":[87],"model.":[91,110],"field":[94],"superplastic":[97],"performs":[100],"stably":[101],"through":[102],"PID":[104],"controller":[105],"based":[106],"on":[107],"After":[111],"analyzed,":[121],"reasonable":[123],"instruction":[126],"generated":[128],"by":[129],"decoupling,":[130],"makes":[132],"internal":[134],"uniform.":[141]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2021,"cited_by_count":1}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}