{"id":"https://openalex.org/W7141549504","doi":"https://doi.org/10.1109/icce67443.2026.11449894","title":"Quantitative Characterization of Performance-Memory Trade-Offs in Stack Optimization for Hardware-Accelerated ML-DSA","display_name":"Quantitative Characterization of Performance-Memory Trade-Offs in Stack Optimization for Hardware-Accelerated ML-DSA","publication_year":2026,"publication_date":"2026-02-03","ids":{"openalex":"https://openalex.org/W7141549504","doi":"https://doi.org/10.1109/icce67443.2026.11449894"},"language":null,"primary_location":{"id":"doi:10.1109/icce67443.2026.11449894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce67443.2026.11449894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Conference on Consumer Electronics (ICCE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5130795770","display_name":"Eunsung Lee","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":true,"raw_author_name":"Eunsung Lee","raw_affiliation_strings":["Samsung Electronics,System LSI Business,Hwaseong-si,South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics,System LSI Business,Hwaseong-si,South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021926375","display_name":"Keunyoung Park","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Keunyoung Park","raw_affiliation_strings":["Samsung Electronics,System LSI Business,Hwaseong-si,South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics,System LSI Business,Hwaseong-si,South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100369475","display_name":"Jaeyong Lee","orcid":"https://orcid.org/0000-0003-3630-5933"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Jaeyong Lee","raw_affiliation_strings":["Samsung Electronics,System LSI Business,Hwaseong-si,South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics,System LSI Business,Hwaseong-si,South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5101415571","display_name":"Dong Jin Park","orcid":"https://orcid.org/0000-0002-2412-5292"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Dong Jin Park","raw_affiliation_strings":["Samsung Electronics,System LSI Business,Hwaseong-si,South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Electronics,System LSI Business,Hwaseong-si,South Korea","institution_ids":["https://openalex.org/I2250650973"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5130795770"],"corresponding_institution_ids":["https://openalex.org/I2250650973"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.96507937,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.743399977684021,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.743399977684021,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10904","display_name":"Embedded Systems Design Techniques","score":0.13519999384880066,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.01510000042617321,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/stack","display_name":"Stack (abstract data type)","score":0.5842000246047974},{"id":"https://openalex.org/keywords/characterization","display_name":"Characterization (materials science)","score":0.5099999904632568},{"id":"https://openalex.org/keywords/component","display_name":"Component (thermodynamics)","score":0.3021000027656555},{"id":"https://openalex.org/keywords/measure","display_name":"Measure (data warehouse)","score":0.2904999852180481},{"id":"https://openalex.org/keywords/identification","display_name":"Identification (biology)","score":0.2809000015258789}],"concepts":[{"id":"https://openalex.org/C9395851","wikidata":"https://www.wikidata.org/wiki/Q177929","display_name":"Stack (abstract data type)","level":2,"score":0.5842000246047974},{"id":"https://openalex.org/C2780841128","wikidata":"https://www.wikidata.org/wiki/Q5073781","display_name":"Characterization (materials science)","level":2,"score":0.5099999904632568},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41200000047683716},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.38029998540878296},{"id":"https://openalex.org/C168167062","wikidata":"https://www.wikidata.org/wiki/Q1117970","display_name":"Component (thermodynamics)","level":2,"score":0.3021000027656555},{"id":"https://openalex.org/C2780009758","wikidata":"https://www.wikidata.org/wiki/Q6804172","display_name":"Measure (data warehouse)","level":2,"score":0.2904999852180481},{"id":"https://openalex.org/C116834253","wikidata":"https://www.wikidata.org/wiki/Q2039217","display_name":"Identification (biology)","level":2,"score":0.2809000015258789},{"id":"https://openalex.org/C25343380","wikidata":"https://www.wikidata.org/wiki/Q277521","display_name":"Relation (database)","level":2,"score":0.262800008058548},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2606000006198883},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.25839999318122864}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icce67443.2026.11449894","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce67443.2026.11449894","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2026 IEEE International Conference on Consumer Electronics (ICCE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":4,"referenced_works":["https://openalex.org/W4312807212","https://openalex.org/W4404515025","https://openalex.org/W4405844746","https://openalex.org/W4411337927"],"related_works":[],"abstract_inverted_index":{"This":[0,108],"paper":[1],"presents":[2],"a":[3,74],"systematic":[4],"study":[5],"of":[6],"stack":[7,81],"optimization":[8,36,82],"strategies":[9,53],"for":[10,39,93,128],"the":[11,35,67,123],"NIST":[12],"PQC":[13],"standard":[14],"ML-DSA":[15],"signature":[16],"verification":[17,116],"algorithm":[18],"in":[19,113],"resource-constrained":[20],"devices":[21,114,135,138,141],"such":[22,97,142],"as":[23,73,98,143],"IoT":[24],"devices,":[25],"sensors,":[26],"and":[27,54,91,101,139],"security":[28,71,144],"modules":[29],"with":[30,63],"limited":[31],"RAM.":[32],"Building":[33],"on":[34,60],"techniques":[37],"proposed":[38],"Dilithium":[40],"by":[41],"Bos":[42],"et":[43],"al.":[44],"(AFRICACRYPT":[45],"2022),":[46],"we":[47],"reorganize":[48],"them":[49],"into":[50],"nine":[51],"distinct":[52],"systematically":[55],"evaluate":[56],"their":[57],"cumulative":[58],"impact":[59],"Cortex-M":[61],"processors":[62],"hardware":[64,89],"acceleration,":[65],"using":[66],"Samsung":[68],"Exynos":[69],"2500":[70],"subsystem":[72],"representative":[75],"platform.":[76],"Our":[77],"analysis":[78],"shows":[79],"that":[80],"must":[83],"balance":[84,109],"memory":[85,94],"savings":[86],"while":[87],"maintaining":[88],"acceleration":[90],"account":[92],"placement":[95],"constraints,":[96],"whether":[99],"keys":[100],"signatures":[102],"are":[103],"stored":[104],"internally":[105],"or":[106],"externally.":[107],"becomes":[110],"especially":[111],"critical":[112],"where":[115],"time":[117],"accumulates":[118],"across":[119],"multiple":[120],"signatures.":[121],"Overall,":[122],"findings":[124],"provide":[125],"practical":[126],"guidance":[127],"diverse":[129],"deployment":[130],"scenarios,":[131],"from":[132],"extremely":[133],"memory-limited":[134],"to":[136],"accelerator-enabled":[137],"balanced":[140],"modules.":[145]},"counts_by_year":[],"updated_date":"2026-03-29T06:01:01.467347","created_date":"2026-03-28T00:00:00"}