{"id":"https://openalex.org/W3013854210","doi":"https://doi.org/10.1109/icce46568.2020.9043069","title":"A Lightweight, Low-Cost Liquid-Metal Personal Cooling System for Prolonged Cooling","display_name":"A Lightweight, Low-Cost Liquid-Metal Personal Cooling System for Prolonged Cooling","publication_year":2020,"publication_date":"2020-01-01","ids":{"openalex":"https://openalex.org/W3013854210","doi":"https://doi.org/10.1109/icce46568.2020.9043069","mag":"3013854210"},"language":"en","primary_location":{"id":"doi:10.1109/icce46568.2020.9043069","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce46568.2020.9043069","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Conference on Consumer Electronics (ICCE)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100639561","display_name":"Mohammad Arifur Rahman","orcid":"https://orcid.org/0000-0003-2618-1404"},"institutions":[{"id":"https://openalex.org/I1330665745","display_name":"Energy Institute","ror":"https://ror.org/03fgcf430","country_code":"GB","type":"other","lineage":["https://openalex.org/I1330665745"]}],"countries":["GB"],"is_corresponding":true,"raw_author_name":"M Arifur RAHMAN","raw_affiliation_strings":["Hawai\u2019i Natural Energy Institute (HNEI)1","Hawai'i Natural Energy Institute (HNEI)1"],"affiliations":[{"raw_affiliation_string":"Hawai\u2019i Natural Energy Institute (HNEI)1","institution_ids":["https://openalex.org/I1330665745"]},{"raw_affiliation_string":"Hawai'i Natural Energy Institute (HNEI)1","institution_ids":["https://openalex.org/I1330665745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085986774","display_name":"Kareem S. Elassy","orcid":"https://orcid.org/0000-0001-7368-6267"},"institutions":[{"id":"https://openalex.org/I117965899","display_name":"University of Hawai\u02bbi at M\u0101noa","ror":"https://ror.org/01wspgy28","country_code":"US","type":"education","lineage":["https://openalex.org/I117965899"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Kareem S. ELASSY","raw_affiliation_strings":["Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]},{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5085140871","display_name":"Leon Roose","orcid":null},"institutions":[{"id":"https://openalex.org/I1330665745","display_name":"Energy Institute","ror":"https://ror.org/03fgcf430","country_code":"GB","type":"other","lineage":["https://openalex.org/I1330665745"]}],"countries":["GB"],"is_corresponding":false,"raw_author_name":"Leon R. ROOSE","raw_affiliation_strings":["Hawai\u2019i Natural Energy Institute (HNEI)1","Hawai'i Natural Energy Institute (HNEI)1"],"affiliations":[{"raw_affiliation_string":"Hawai\u2019i Natural Energy Institute (HNEI)1","institution_ids":["https://openalex.org/I1330665745"]},{"raw_affiliation_string":"Hawai'i Natural Energy Institute (HNEI)1","institution_ids":["https://openalex.org/I1330665745"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078109674","display_name":"Wayne A. Shiroma","orcid":"https://orcid.org/0000-0002-1294-2703"},"institutions":[{"id":"https://openalex.org/I117965899","display_name":"University of Hawai\u02bbi at M\u0101noa","ror":"https://ror.org/01wspgy28","country_code":"US","type":"education","lineage":["https://openalex.org/I117965899"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Wayne A. SHIROMA","raw_affiliation_strings":["Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]},{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068511935","display_name":"Aaron T. Ohta","orcid":"https://orcid.org/0000-0003-3789-897X"},"institutions":[{"id":"https://openalex.org/I117965899","display_name":"University of Hawai\u02bbi at M\u0101noa","ror":"https://ror.org/01wspgy28","country_code":"US","type":"education","lineage":["https://openalex.org/I117965899"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Aaron T. OHTA","raw_affiliation_strings":["Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai\u2019i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]},{"raw_affiliation_string":"Department of Electrical Engineering2, University of Hawai'i at M\u0101noa, Honolulu, HI, USA","institution_ids":["https://openalex.org/I117965899"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5100639561"],"corresponding_institution_ids":["https://openalex.org/I1330665745"],"apc_list":null,"apc_paid":null,"fwci":0.3598,"has_fulltext":false,"cited_by_count":5,"citation_normalized_percentile":{"value":0.58552341,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":96},"biblio":{"volume":null,"issue":null,"first_page":null,"last_page":null},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11109","display_name":"Thermoregulation and physiological responses","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2737","display_name":"Physiology"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}},"topics":[{"id":"https://openalex.org/T11109","display_name":"Thermoregulation and physiological responses","score":0.9983000159263611,"subfield":{"id":"https://openalex.org/subfields/2737","display_name":"Physiology"},"field":{"id":"https://openalex.org/fields/27","display_name":"Medicine"},"domain":{"id":"https://openalex.org/domains/4","display_name":"Health Sciences"}},{"id":"https://openalex.org/T11529","display_name":"Refrigeration and Air Conditioning Technologies","score":0.9973999857902527,"subfield":{"id":"https://openalex.org/subfields/2210","display_name":"Mechanical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12442","display_name":"Thermal Radiation and Cooling Technologies","score":0.9941999912261963,"subfield":{"id":"https://openalex.org/subfields/2205","display_name":"Civil and Structural Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-cooling","display_name":"Computer cooling","score":0.7261404991149902},{"id":"https://openalex.org/keywords/coolant","display_name":"Coolant","score":0.6181289553642273},{"id":"https://openalex.org/keywords/water-cooling","display_name":"Water cooling","score":0.5383196473121643},{"id":"https://openalex.org/keywords/liquid-metal","display_name":"Liquid metal","score":0.5038437247276306},{"id":"https://openalex.org/keywords/personal-computer","display_name":"Personal computer","score":0.5034064650535583},{"id":"https://openalex.org/keywords/active-cooling","display_name":"Active cooling","score":0.4605940580368042},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.40343213081359863},{"id":"https://openalex.org/keywords/nuclear-engineering","display_name":"Nuclear engineering","score":0.3896835446357727},{"id":"https://openalex.org/keywords/mechanical-engineering","display_name":"Mechanical engineering","score":0.3234408497810364},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.3211359977722168},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19169268012046814},{"id":"https://openalex.org/keywords/composite-material","display_name":"Composite material","score":0.1310250461101532},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.1265648901462555},{"id":"https://openalex.org/keywords/thermal-management-of-electronic-devices-and-systems","display_name":"Thermal management of electronic devices and systems","score":0.12376520037651062}],"concepts":[{"id":"https://openalex.org/C11026015","wikidata":"https://www.wikidata.org/wiki/Q840551","display_name":"Computer cooling","level":3,"score":0.7261404991149902},{"id":"https://openalex.org/C91914117","wikidata":"https://www.wikidata.org/wiki/Q1056832","display_name":"Coolant","level":2,"score":0.6181289553642273},{"id":"https://openalex.org/C7694927","wikidata":"https://www.wikidata.org/wiki/Q7667810","display_name":"Water cooling","level":2,"score":0.5383196473121643},{"id":"https://openalex.org/C2778492893","wikidata":"https://www.wikidata.org/wiki/Q6557453","display_name":"Liquid metal","level":2,"score":0.5038437247276306},{"id":"https://openalex.org/C2988821698","wikidata":"https://www.wikidata.org/wiki/Q16338","display_name":"Personal computer","level":2,"score":0.5034064650535583},{"id":"https://openalex.org/C156820238","wikidata":"https://www.wikidata.org/wiki/Q422876","display_name":"Active cooling","level":3,"score":0.4605940580368042},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.40343213081359863},{"id":"https://openalex.org/C116915560","wikidata":"https://www.wikidata.org/wiki/Q83504","display_name":"Nuclear engineering","level":1,"score":0.3896835446357727},{"id":"https://openalex.org/C78519656","wikidata":"https://www.wikidata.org/wiki/Q101333","display_name":"Mechanical engineering","level":1,"score":0.3234408497810364},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.3211359977722168},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19169268012046814},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.1310250461101532},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.1265648901462555},{"id":"https://openalex.org/C114834414","wikidata":"https://www.wikidata.org/wiki/Q15477170","display_name":"Thermal management of electronic devices and systems","level":2,"score":0.12376520037651062}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icce46568.2020.9043069","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce46568.2020.9043069","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2020 IEEE International Conference on Consumer Electronics (ICCE)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W2012008704","https://openalex.org/W2034112503","https://openalex.org/W2089143931","https://openalex.org/W2092980256","https://openalex.org/W2120411499","https://openalex.org/W2129964924","https://openalex.org/W2149789556","https://openalex.org/W2242797720","https://openalex.org/W2346768956","https://openalex.org/W2593367029","https://openalex.org/W2605293867","https://openalex.org/W2626726142","https://openalex.org/W2979595276","https://openalex.org/W4244463369","https://openalex.org/W6690314012"],"related_works":["https://openalex.org/W4300712694","https://openalex.org/W2109466369","https://openalex.org/W2025575884","https://openalex.org/W2984625909","https://openalex.org/W4313255880","https://openalex.org/W2384476784","https://openalex.org/W2147842873","https://openalex.org/W2121129873","https://openalex.org/W1968333407","https://openalex.org/W4220789877"],"abstract_inverted_index":{"The":[0,96,144],"impact":[1],"of":[2,43,48,133,165,181,188],"global":[3],"warming":[4],"on":[5],"personal":[6,55,83,173,204],"health":[7],"is":[8,32,103,125,147,176],"a":[9,24,63,78,109,113,131,141],"growing":[10],"concern,":[11],"as":[12,38,93,101],"high":[13,69],"temperatures":[14],"can":[15],"cause":[16],"heat":[17,100,154],"stress":[18],"disorders.":[19],"Personal":[20],"cooling":[21,56,65,84,110,174,205],"systems":[22,57],"are":[23,58],"promising":[25],"solution":[26],"in":[27,136,140],"environments":[28],"where":[29],"air":[30],"conditioning":[31],"not":[33],"available":[34],"or":[35,61],"infeasible":[36],"such":[37],"the":[39,88,94,119,122,150,158,163,166,169,182,189,199],"outdoor":[40],"working":[41],"environment":[42],"utility":[44],"workers,":[45],"and":[46,76,80,191],"treatment":[47],"hyperthermia":[49],"for":[50,193],"athletes.":[51],"However,":[52],"current":[53,200],"untethered":[54],"expensive,":[59],"heavy,":[60],"have":[62,74],"limited":[64],"duration":[66],"due":[67],"to":[68,108,198],"power":[70],"consumption.":[71],"Here,":[72],"we":[73],"designed":[75],"prototyped":[77],"lightweight":[79],"low-power":[81,114],"active":[82,172,203],"system":[85,175],"that":[86],"uses":[87],"non-toxic":[89],"gallium-based":[90],"liquid-metal,":[91],"Galinstan,":[92],"coolant.":[95],"Galinstan":[97,124],"absorbs":[98],"body":[99,120],"it":[102,129],"pumped":[104],"through":[105,130],"tubing":[106,134],"attached":[107],"vest":[111],"by":[112,127],"DC":[115],"pump.":[116],"After":[117],"absorbing":[118],"heat,":[121],"warm":[123,159],"cooled":[126],"passing":[128],"network":[132],"embedded":[135],"cold":[137,142,145],"phase-change":[138],"material":[139],"pack.":[143],"pack":[146],"insulated":[148],"from":[149,156],"external":[151],"environment,":[152],"allowing":[153],"absorption":[155],"only":[157],"liquid":[160,170],"metal.":[161],"To":[162],"best":[164],"author\u2019s":[167],"knowledge,":[168],"metal":[171],"1/3":[177],"<sup":[178,185],"xmlns:mml=\"http://www.w3.org/1998/Math/MathML\"":[179,186],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">rd</sup>":[180],"weight,":[183],"1/8":[184],"xmlns:xlink=\"http://www.w3.org/1999/xlink\">th</sup>":[187],"price,":[190],"cools":[192],"4":[194],"times":[195],"longer":[196],"compared":[197],"state-of-art":[201],"commercial":[202],"systems.":[206]},"counts_by_year":[{"year":2024,"cited_by_count":2},{"year":2023,"cited_by_count":2},{"year":2020,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}