{"id":"https://openalex.org/W1556114801","doi":"https://doi.org/10.1109/icce-tw.2015.7216818","title":"Study of dielectric material property impact on insertion loss for advanced packaging solutions","display_name":"Study of dielectric material property impact on insertion loss for advanced packaging solutions","publication_year":2015,"publication_date":"2015-06-01","ids":{"openalex":"https://openalex.org/W1556114801","doi":"https://doi.org/10.1109/icce-tw.2015.7216818","mag":"1556114801"},"language":"en","primary_location":{"id":"doi:10.1109/icce-tw.2015.7216818","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce-tw.2015.7216818","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Conference on Consumer Electronics - Taiwan","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5068434483","display_name":"Bok Eng Cheah","orcid":null},"institutions":[{"id":"https://openalex.org/I4210142644","display_name":"Intel (Malaysia)","ror":"https://ror.org/048jw1p35","country_code":"MY","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210142644"]}],"countries":["MY"],"is_corresponding":true,"raw_author_name":"Bok Eng Cheah","raw_affiliation_strings":["Intel Microelectronics (M) Sdn Bhd, Penang, Malaysia","Intel Microelectronics (M) Sdn Bhd, Bayan Lepas FIZ, Phase 3, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Intel Microelectronics (M) Sdn Bhd, Penang, Malaysia","institution_ids":["https://openalex.org/I4210142644"]},{"raw_affiliation_string":"Intel Microelectronics (M) Sdn Bhd, Bayan Lepas FIZ, Phase 3, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I4210142644"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074588705","display_name":"Hellen Lo","orcid":null},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H. Louis Lo","raw_affiliation_strings":["Intel Corporation, Folsom, CA","Intel Corporation, 1900 Prairie City Rd. Folsom, CA 95630"],"affiliations":[{"raw_affiliation_string":"Intel Corporation, Folsom, CA","institution_ids":["https://openalex.org/I1343180700"]},{"raw_affiliation_string":"Intel Corporation, 1900 Prairie City Rd. Folsom, CA 95630","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5048131678","display_name":"Jackson Kong","orcid":"https://orcid.org/0000-0003-1839-1647"},"institutions":[{"id":"https://openalex.org/I4210142644","display_name":"Intel (Malaysia)","ror":"https://ror.org/048jw1p35","country_code":"MY","type":"company","lineage":["https://openalex.org/I1343180700","https://openalex.org/I4210142644"]}],"countries":["MY"],"is_corresponding":false,"raw_author_name":"Jackson Kong","raw_affiliation_strings":["Intel Microelectronics (M) Sdn Bhd, Penang, Malaysia","Intel Microelectronics (M) Sdn Bhd, Bayan Lepas FIZ, Phase 3, 11900 Penang, Malaysia"],"affiliations":[{"raw_affiliation_string":"Intel Microelectronics (M) Sdn Bhd, Penang, Malaysia","institution_ids":["https://openalex.org/I4210142644"]},{"raw_affiliation_string":"Intel Microelectronics (M) Sdn Bhd, Bayan Lepas FIZ, Phase 3, 11900 Penang, Malaysia","institution_ids":["https://openalex.org/I4210142644"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5068434483"],"corresponding_institution_ids":["https://openalex.org/I4210142644"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.02683403,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"134","last_page":"135"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9990000128746033,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9979000091552734,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9970999956130981,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/insertion-loss","display_name":"Insertion loss","score":0.8948230743408203},{"id":"https://openalex.org/keywords/dielectric-loss","display_name":"Dielectric loss","score":0.752537727355957},{"id":"https://openalex.org/keywords/dielectric","display_name":"Dielectric","score":0.6988343000411987},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.6657682061195374},{"id":"https://openalex.org/keywords/dissipation-factor","display_name":"Dissipation factor","score":0.6119090914726257},{"id":"https://openalex.org/keywords/classification-of-discontinuities","display_name":"Classification of discontinuities","score":0.6030164957046509},{"id":"https://openalex.org/keywords/electrical-impedance","display_name":"Electrical impedance","score":0.5882574915885925},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.5149972438812256},{"id":"https://openalex.org/keywords/tangent","display_name":"Tangent","score":0.46039527654647827},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4283546209335327},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.38100701570510864},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.3030571937561035},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.26770028471946716},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2274433672428131},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.18741604685783386},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.09260833263397217},{"id":"https://openalex.org/keywords/geometry","display_name":"Geometry","score":0.06375741958618164}],"concepts":[{"id":"https://openalex.org/C90327742","wikidata":"https://www.wikidata.org/wiki/Q947396","display_name":"Insertion loss","level":2,"score":0.8948230743408203},{"id":"https://openalex.org/C91066073","wikidata":"https://www.wikidata.org/wiki/Q1417868","display_name":"Dielectric loss","level":3,"score":0.752537727355957},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.6988343000411987},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.6657682061195374},{"id":"https://openalex.org/C97274863","wikidata":"https://www.wikidata.org/wiki/Q1040795","display_name":"Dissipation factor","level":3,"score":0.6119090914726257},{"id":"https://openalex.org/C15627037","wikidata":"https://www.wikidata.org/wiki/Q541961","display_name":"Classification of discontinuities","level":2,"score":0.6030164957046509},{"id":"https://openalex.org/C17829176","wikidata":"https://www.wikidata.org/wiki/Q179043","display_name":"Electrical impedance","level":2,"score":0.5882574915885925},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.5149972438812256},{"id":"https://openalex.org/C138187205","wikidata":"https://www.wikidata.org/wiki/Q131251","display_name":"Tangent","level":2,"score":0.46039527654647827},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4283546209335327},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.38100701570510864},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.3030571937561035},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.26770028471946716},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2274433672428131},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.18741604685783386},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.09260833263397217},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.06375741958618164},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/icce-tw.2015.7216818","is_oa":false,"landing_page_url":"https://doi.org/10.1109/icce-tw.2015.7216818","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2015 IEEE International Conference on Consumer Electronics - Taiwan","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":5,"referenced_works":["https://openalex.org/W1500697756","https://openalex.org/W1977435156","https://openalex.org/W1981188548","https://openalex.org/W1983237403","https://openalex.org/W2100371304"],"related_works":["https://openalex.org/W24861038","https://openalex.org/W2106709610","https://openalex.org/W2184626740","https://openalex.org/W2053622725","https://openalex.org/W4390098279","https://openalex.org/W2420289869","https://openalex.org/W2371118345","https://openalex.org/W2544775432","https://openalex.org/W2021071487","https://openalex.org/W2142014633"],"abstract_inverted_index":{"This":[0],"paper":[1],"evaluates":[2],"the":[3],"impact":[4],"of":[5],"dielectric":[6,58],"loss":[7,13,48,59],"tangent":[8,60],"property":[9],"on":[10],"electrical":[11],"insertion":[12,47],"performance":[14],"for":[15],"both":[16],"conventional":[17,55],"and":[18],"coreless":[19],"packaging":[20],"designs":[21],"up-to":[22],"100Gbps":[23],"datarate.":[24],"Coreless":[25],"package":[26],"with":[27,57],"metal":[28],"grid":[29],"array":[30],"(MGA)":[31],"second":[32],"level":[33],"interconnect":[34],"(SLI)":[35],"that":[36],"yields":[37],"minimal":[38],"impedance":[39],"discontinuities":[40],"was":[41],"observed":[42],"gaining":[43],"more":[44],"than":[45],"50%":[46],"improvements":[49],"i.e.":[50],"~20%":[51],"higher":[52],"compared":[53],"to":[54,64],"design":[56],"improved":[61],"from":[62],"0.03":[63],"0.006.":[65]},"counts_by_year":[{"year":2024,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}