{"id":"https://openalex.org/W2026746601","doi":"https://doi.org/10.1109/iccd.2014.6974699","title":"Improved signoff methodology with tightened BEOL corners","display_name":"Improved signoff methodology with tightened BEOL corners","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2026746601","doi":"https://doi.org/10.1109/iccd.2014.6974699","mag":"2026746601"},"language":"en","primary_location":{"id":"doi:10.1109/iccd.2014.6974699","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2014.6974699","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 32nd International Conference on Computer Design (ICCD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5113828714","display_name":"Tuck-Boon Chan","orcid":null},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tuck-Boon Chan","raw_affiliation_strings":["CSE","ECE Departments, UC San Diego, La Jolla, CA 92093, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CSE","institution_ids":[]},{"raw_affiliation_string":"ECE Departments, UC San Diego, La Jolla, CA 92093, USA","institution_ids":["https://openalex.org/I36258959"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5073582440","display_name":"Sorin Dobre","orcid":null},"institutions":[{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sorin Dobre","raw_affiliation_strings":["Qualcomm Technologies, Inc., San Diego, CA","Qualcomm Technologies, Inc., San Diego, CA 92121 USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Technologies, Inc., San Diego, CA","institution_ids":["https://openalex.org/I4210087596"]},{"raw_affiliation_string":"Qualcomm Technologies, Inc., San Diego, CA 92121 USA","institution_ids":["https://openalex.org/I4210087596"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073558386","display_name":"Andrew B. Kahng","orcid":"https://orcid.org/0000-0002-4490-5018"},"institutions":[{"id":"https://openalex.org/I36258959","display_name":"University of California San Diego","ror":"https://ror.org/0168r3w48","country_code":"US","type":"education","lineage":["https://openalex.org/I36258959"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Andrew B. Kahng","raw_affiliation_strings":["CSE","ECE Departments, UC San Diego, La Jolla, CA","CSE Departments, UC San Diego, La Jolla, CA 92093, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"CSE","institution_ids":[]},{"raw_affiliation_string":"ECE Departments, UC San Diego, La Jolla, CA","institution_ids":["https://openalex.org/I36258959"]},{"raw_affiliation_string":"CSE Departments, UC San Diego, La Jolla, CA 92093, USA","institution_ids":["https://openalex.org/I36258959"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":0.2129,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.59170073,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":95},"biblio":{"volume":null,"issue":null,"first_page":"311","last_page":"316"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10558","display_name":"Advancements in Semiconductor Devices and Circuit Design","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/back-end-of-line","display_name":"Back end of line","score":0.816495418548584},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.5017149448394775},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.41967537999153137},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3620092272758484},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.24908551573753357},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.10387638211250305}],"concepts":[{"id":"https://openalex.org/C2776628375","wikidata":"https://www.wikidata.org/wiki/Q4839229","display_name":"Back end of line","level":3,"score":0.816495418548584},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.5017149448394775},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.41967537999153137},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3620092272758484},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.24908551573753357},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.10387638211250305},{"id":"https://openalex.org/C133386390","wikidata":"https://www.wikidata.org/wiki/Q184996","display_name":"Dielectric","level":2,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iccd.2014.6974699","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2014.6974699","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 32nd International Conference on Computer Design (ICCD)","raw_type":"proceedings-article"},{"id":"pmh:oai:CiteSeerX.psu:10.1.1.653.2854","is_oa":false,"landing_page_url":"http://citeseerx.ist.psu.edu/viewdoc/summary?doi=10.1.1.653.2854","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"http://vlsicad.ucsd.edu/Publications/Conferences/321/c321.pdf","raw_type":"text"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/1","score":0.6499999761581421,"display_name":"No poverty"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W2007562502","https://openalex.org/W2007882196","https://openalex.org/W2012667569","https://openalex.org/W2036811207","https://openalex.org/W2043643711","https://openalex.org/W2050886972","https://openalex.org/W2074121908","https://openalex.org/W2095778540","https://openalex.org/W2108050730","https://openalex.org/W2111098826","https://openalex.org/W2114868962","https://openalex.org/W2124018090","https://openalex.org/W2124969496","https://openalex.org/W2129842308","https://openalex.org/W2153878017","https://openalex.org/W2156787775","https://openalex.org/W2158732322","https://openalex.org/W2159801533","https://openalex.org/W3144895071","https://openalex.org/W3145434650","https://openalex.org/W4248062893","https://openalex.org/W6652205267"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2748952813","https://openalex.org/W4402299999","https://openalex.org/W4246450666","https://openalex.org/W4388998267","https://openalex.org/W2898370298","https://openalex.org/W2137437058","https://openalex.org/W4390401159","https://openalex.org/W2744391499","https://openalex.org/W2800070131"],"abstract_inverted_index":{"To":[0],"ensure":[1],"functional":[2],"correctness,":[3],"conventional":[4,134],"chip":[5,108],"implementation":[6,109],"methodology":[7,53,122],"signs":[8],"off":[9],"the":[10,22,27,66,74,87,96,129,133,142,153,162,196],"SOC":[11],"design":[12,113],"at":[13,47],"extreme":[14,55],"process,":[15],"voltage":[16],"and":[17,25,111,194,198,204],"temperature":[18],"(PVT)":[19],"conditions.":[20],"At":[21],"20nm":[23],"node":[24],"beyond,":[26],"back":[28],"end":[29],"of":[30,38,89,155,172],"line":[31],"(BEOL)":[32],"layers":[33,62,72,93,157],"have":[34,73],"become":[35],"major":[36],"sources":[37],"variation,":[39],"which":[40,59],"must":[41],"be":[42],"accounted":[43],"for":[44],"by":[45,132,180,190,200],"signoff":[46,52,121],"various":[48],"BEOL":[49,56,61,71,81,92,125,135,150,156,183],"corners.":[50,136],"Conventional":[51],"uses":[54],"corners,":[57,184],"in":[58,106],"all":[60,70,91],"are":[63,158],"skewed":[64],"to":[65,127,170,192,202],"worst-case":[67,97],"condition":[68,82,98],"(e.g.,":[69],"worst":[75],"parasitic":[76],"capacitance).":[77],"However,":[78],"such":[79],"a":[80,120],"is":[83,100,139,166],"very":[84],"pessimistic":[85],"because":[86],"probability":[88],"having":[90],"skew":[94],"towards":[95],"simultaneously":[99],"extremely":[101],"small.":[102],"Such":[103],"pessimism":[104,130],"results":[105,177],"longer":[107],"schedules":[110],"poorer":[112],"quality.":[114],"In":[115],"this":[116],"paper,":[117],"we":[118,185],"propose":[119],"with":[123],"tightened":[124,182],"corners":[126],"recover":[128],"incurred":[131],"This":[137],"approach":[138],"based":[140],"on":[141],"observation":[143],"that":[144,179],"most":[145],"timing-critical":[146],"paths":[147,189],"use":[148],"different":[149],"layers.":[151],"When":[152],"variations":[154],"not":[159],"fully":[160],"correlated,":[161],"BEOL-induced":[163],"timing":[164],"variation":[165],"much":[167],"smaller":[168],"due":[169],"averaging":[171],"random":[173],"variations.":[174],"Our":[175],"experimental":[176],"show":[178],"using":[181],"can":[186],"reduce":[187],"timing-violation":[188],"up":[191,201],"100%":[193],"improve":[195],"WNS":[197],"TNS":[199],"101ps":[203],"53ns,":[205],"respectively.":[206]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2023,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2015,"cited_by_count":1}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}