{"id":"https://openalex.org/W2010808593","doi":"https://doi.org/10.1109/iccd.2014.6974679","title":"Built-in self-test for interposer-based 2.5D ICs","display_name":"Built-in self-test for interposer-based 2.5D ICs","publication_year":2014,"publication_date":"2014-10-01","ids":{"openalex":"https://openalex.org/W2010808593","doi":"https://doi.org/10.1109/iccd.2014.6974679","mag":"2010808593"},"language":"en","primary_location":{"id":"doi:10.1109/iccd.2014.6974679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2014.6974679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 32nd International Conference on Computer Design (ICCD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5101543402","display_name":"Ran Wang","orcid":"https://orcid.org/0000-0002-1434-5662"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Ran Wang","raw_affiliation_strings":["ECE Dept., Duke University, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ECE Dept., Duke University, Durham, NC, USA","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5033880864","display_name":"Krishnendu Chakrabarty","orcid":"https://orcid.org/0000-0003-4475-6435"},"institutions":[{"id":"https://openalex.org/I170897317","display_name":"Duke University","ror":"https://ror.org/00py81415","country_code":"US","type":"education","lineage":["https://openalex.org/I170897317"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Krishnendu Chakrabarty","raw_affiliation_strings":["ECE Dept., Duke University, Durham, NC, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"ECE Dept., Duke University, Durham, NC, USA","institution_ids":["https://openalex.org/I170897317"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5069773943","display_name":"Sudipta Bhawmik","orcid":null},"institutions":[{"id":"https://openalex.org/I19268510","display_name":"Qualcomm (United Kingdom)","ror":"https://ror.org/04d3djg48","country_code":"GB","type":"company","lineage":["https://openalex.org/I19268510","https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210087596","display_name":"Qualcomm (United States)","ror":"https://ror.org/002zrf773","country_code":"US","type":"company","lineage":["https://openalex.org/I4210087596"]},{"id":"https://openalex.org/I4210111675","display_name":"Market Matters","ror":"https://ror.org/021yan307","country_code":"US","type":"nonprofit","lineage":["https://openalex.org/I4210111675"]}],"countries":["GB","US"],"is_corresponding":false,"raw_author_name":"Sudipta Bhawmik","raw_affiliation_strings":["Qualcomm Inc., Bridgewater, NJ, USA","[Qualcomm Inc., Bridgewater, NJ, USA]"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Qualcomm Inc., Bridgewater, NJ, USA","institution_ids":["https://openalex.org/I4210087596","https://openalex.org/I4210111675"]},{"raw_affiliation_string":"[Qualcomm Inc., Bridgewater, NJ, USA]","institution_ids":["https://openalex.org/I19268510","https://openalex.org/I4210111675"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.0647,"has_fulltext":false,"cited_by_count":6,"citation_normalized_percentile":{"value":0.80087102,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":91,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"181","last_page":"188"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T14117","display_name":"Integrated Circuits and Semiconductor Failure Analysis","score":0.9994000196456909,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T12224","display_name":"Nanofabrication and Lithography Techniques","score":0.9957000017166138,"subfield":{"id":"https://openalex.org/subfields/2204","display_name":"Biomedical Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/interposer","display_name":"Interposer","score":0.88731849193573},{"id":"https://openalex.org/keywords/built-in-self-test","display_name":"Built-in self-test","score":0.74821537733078},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.6620451211929321},{"id":"https://openalex.org/keywords/fault","display_name":"Fault (geology)","score":0.5855275392532349},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.5497685670852661},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.5291540622711182},{"id":"https://openalex.org/keywords/overhead","display_name":"Overhead (engineering)","score":0.5083774924278259},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.4436020851135254},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.41874194145202637},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4042600691318512},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.3979368209838867},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1667037308216095},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.16332226991653442},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.10365206003189087},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.06422725319862366}],"concepts":[{"id":"https://openalex.org/C158802814","wikidata":"https://www.wikidata.org/wiki/Q6056418","display_name":"Interposer","level":4,"score":0.88731849193573},{"id":"https://openalex.org/C2780980493","wikidata":"https://www.wikidata.org/wiki/Q181142","display_name":"Built-in self-test","level":2,"score":0.74821537733078},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.6620451211929321},{"id":"https://openalex.org/C175551986","wikidata":"https://www.wikidata.org/wiki/Q47089","display_name":"Fault (geology)","level":2,"score":0.5855275392532349},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.5497685670852661},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.5291540622711182},{"id":"https://openalex.org/C2779960059","wikidata":"https://www.wikidata.org/wiki/Q7113681","display_name":"Overhead (engineering)","level":2,"score":0.5083774924278259},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.4436020851135254},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.41874194145202637},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4042600691318512},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.3979368209838867},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1667037308216095},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.16332226991653442},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.10365206003189087},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.06422725319862366},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C100460472","wikidata":"https://www.wikidata.org/wiki/Q2368605","display_name":"Etching (microfabrication)","level":3,"score":0.0},{"id":"https://openalex.org/C165205528","wikidata":"https://www.wikidata.org/wiki/Q83371","display_name":"Seismology","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C159985019","wikidata":"https://www.wikidata.org/wiki/Q181790","display_name":"Composite material","level":1,"score":0.0},{"id":"https://openalex.org/C127313418","wikidata":"https://www.wikidata.org/wiki/Q1069","display_name":"Geology","level":0,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccd.2014.6974679","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2014.6974679","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE 32nd International Conference on Computer Design (ICCD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Industry, innovation and infrastructure","score":0.5799999833106995,"id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":16,"referenced_works":["https://openalex.org/W128123307","https://openalex.org/W1986027887","https://openalex.org/W1988707365","https://openalex.org/W2033459595","https://openalex.org/W2118898957","https://openalex.org/W2130338034","https://openalex.org/W2135488595","https://openalex.org/W2146532765","https://openalex.org/W2148422687","https://openalex.org/W2154811899","https://openalex.org/W2162009815","https://openalex.org/W2185926888","https://openalex.org/W4285719527","https://openalex.org/W6605234255","https://openalex.org/W6647505608","https://openalex.org/W6686479381"],"related_works":["https://openalex.org/W2037416628","https://openalex.org/W2073725000","https://openalex.org/W2528892790","https://openalex.org/W2117988687","https://openalex.org/W2333804548","https://openalex.org/W2010808593","https://openalex.org/W1990828594","https://openalex.org/W2067111338","https://openalex.org/W2150113875","https://openalex.org/W2025912852"],"abstract_inverted_index":{"Interposer-based":[0],"2.5D":[1,27],"integrated":[2],"circuits":[3],"(ICs)":[4],"are":[5],"seen":[6],"today":[7],"as":[8],"a":[9,26],"precursor":[10],"to":[11,72,83,97],"3D":[12],"ICs":[13],"based":[14],"on":[15],"through-silicon":[16],"vias":[17],"(TSVs).":[18],"All":[19],"the":[20,23,51,74,85,89,99,102],"dies":[21,48],"and":[22,49,77,93],"interposer":[24,52],"in":[25,47,50],"IC":[28],"must":[29],"be":[30,60],"adequately":[31],"tested":[32],"for":[33,44,62],"product":[34],"qualification.":[35],"We":[36,68],"present":[37,69],"an":[38],"efficient":[39],"built-in":[40],"self-test":[41],"(BIST)":[42],"architecture":[43,57,76],"targeting":[45],"defects":[46],"interconnects.":[53],"The":[54],"proposed":[55,90,103],"BIST":[56,75,91],"can":[58],"also":[59],"used":[61],"fault":[63,79,94],"diagnosis":[64],"during":[65],"interconnect":[66],"testing.":[67],"simulation":[70],"results":[71,82,96],"validate":[73],"demonstrate":[78],"detection,":[80],"synthesis":[81],"evaluate":[84],"area":[86],"overhead":[87],"of":[88,101],"architecture,":[92],"coverage":[95],"highlight":[98],"effectiveness":[100],"technique.":[104]},"counts_by_year":[{"year":2025,"cited_by_count":1},{"year":2017,"cited_by_count":2},{"year":2016,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}