{"id":"https://openalex.org/W2165771675","doi":"https://doi.org/10.1109/iccd.2010.5647616","title":"Thermal-aware scratchpad memory design and allocation","display_name":"Thermal-aware scratchpad memory design and allocation","publication_year":2010,"publication_date":"2010-10-01","ids":{"openalex":"https://openalex.org/W2165771675","doi":"https://doi.org/10.1109/iccd.2010.5647616","mag":"2165771675"},"language":"en","primary_location":{"id":"doi:10.1109/iccd.2010.5647616","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2010.5647616","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Conference on Computer Design","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5055429651","display_name":"Morteza Damavandpeyma","orcid":null},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":true,"raw_author_name":"Morteza Damavandpeyma","raw_affiliation_strings":["Department of Electrical Engineering, Eindhovan University of Technology, Netherlands"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","institution_ids":["https://openalex.org/I83019370"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5032436846","display_name":"Sander Stuijk","orcid":"https://orcid.org/0000-0002-2518-6847"},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Sander Stuijk","raw_affiliation_strings":["Department of Electrical Engineering, Eindhovan University of Technology, Netherlands"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","institution_ids":["https://openalex.org/I83019370"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5026760188","display_name":"Twan Basten","orcid":"https://orcid.org/0000-0002-2274-7274"},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Twan Basten","raw_affiliation_strings":["Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","Embedded Systems Institute, Eindhoven, Netherlands"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","institution_ids":["https://openalex.org/I83019370"]},{"raw_affiliation_string":"Embedded Systems Institute, Eindhoven, Netherlands","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5063550119","display_name":"Marc Geilen","orcid":"https://orcid.org/0000-0002-2629-3249"},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Marc Geilen","raw_affiliation_strings":["Department of Electrical Engineering, Eindhovan University of Technology, Netherlands"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","institution_ids":["https://openalex.org/I83019370"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5081768631","display_name":"Henk Corporaal","orcid":"https://orcid.org/0000-0003-4506-5732"},"institutions":[{"id":"https://openalex.org/I83019370","display_name":"Eindhoven University of Technology","ror":"https://ror.org/02c2kyt77","country_code":"NL","type":"education","lineage":["https://openalex.org/I83019370"]}],"countries":["NL"],"is_corresponding":false,"raw_author_name":"Henk Corporaal","raw_affiliation_strings":["Department of Electrical Engineering, Eindhovan University of Technology, Netherlands"],"affiliations":[{"raw_affiliation_string":"Department of Electrical Engineering, Eindhovan University of Technology, Netherlands","institution_ids":["https://openalex.org/I83019370"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":5,"corresponding_author_ids":["https://openalex.org/A5055429651"],"corresponding_institution_ids":["https://openalex.org/I83019370"],"apc_list":null,"apc_paid":null,"fwci":0.505,"has_fulltext":false,"cited_by_count":4,"citation_normalized_percentile":{"value":0.69431015,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":null,"issue":null,"first_page":"118","last_page":"124"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":1.0,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11181","display_name":"Advanced Data Storage Technologies","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9994999766349792,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7833213210105896},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.5620105266571045},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.5314323902130127},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.48418667912483215},{"id":"https://openalex.org/keywords/predictability","display_name":"Predictability","score":0.4337610602378845},{"id":"https://openalex.org/keywords/software","display_name":"Software","score":0.4251909852027893},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.4201706349849701},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4152783751487732},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.36732903122901917},{"id":"https://openalex.org/keywords/operating-system","display_name":"Operating system","score":0.2168484926223755}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7833213210105896},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.5620105266571045},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.5314323902130127},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.48418667912483215},{"id":"https://openalex.org/C197640229","wikidata":"https://www.wikidata.org/wiki/Q2534066","display_name":"Predictability","level":2,"score":0.4337610602378845},{"id":"https://openalex.org/C2777904410","wikidata":"https://www.wikidata.org/wiki/Q7397","display_name":"Software","level":2,"score":0.4251909852027893},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.4201706349849701},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4152783751487732},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.36732903122901917},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.2168484926223755},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C153294291","wikidata":"https://www.wikidata.org/wiki/Q25261","display_name":"Meteorology","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0}],"mesh":[],"locations_count":4,"locations":[{"id":"doi:10.1109/iccd.2010.5647616","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2010.5647616","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE International Conference on Computer Design","raw_type":"proceedings-article"},{"id":"pmh:694225","is_oa":false,"landing_page_url":"http://library.tue.nl/csp/dare/LinkToRepository.csp?recordnumber=694225","pdf_url":null,"source":{"id":"https://openalex.org/S4406923046","display_name":"TU/e Research Portal (Eindhoven University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""},{"id":"pmh:oai:library.tue.nl:694225","is_oa":false,"landing_page_url":"http://repository.tue.nl/694225","pdf_url":null,"source":{"id":"https://openalex.org/S4406923046","display_name":"TU/e Research Portal (Eindhoven University of Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":""},{"id":"pmh:oai:oai-pmh.tno.nl:73952","is_oa":false,"landing_page_url":"https://resolver.tno.nl/uuid:2b11023a-9edc-4ec0-838d-111386ab4111","pdf_url":null,"source":{"id":"https://openalex.org/S7407055233","display_name":"TNO Repository","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"info:eu-repo/semantics/conferencePaper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.8899999856948853,"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":28,"referenced_works":["https://openalex.org/W1566724908","https://openalex.org/W2082698931","https://openalex.org/W2090809553","https://openalex.org/W2098511965","https://openalex.org/W2099046646","https://openalex.org/W2105102111","https://openalex.org/W2105778948","https://openalex.org/W2107114182","https://openalex.org/W2115330383","https://openalex.org/W2129960401","https://openalex.org/W2132816157","https://openalex.org/W2149590159","https://openalex.org/W2152128555","https://openalex.org/W2154696356","https://openalex.org/W2156858199","https://openalex.org/W2159600236","https://openalex.org/W2165071510","https://openalex.org/W2165447916","https://openalex.org/W2165586255","https://openalex.org/W4231523873","https://openalex.org/W4241166746","https://openalex.org/W4243079013","https://openalex.org/W4244075751","https://openalex.org/W4244816354","https://openalex.org/W4255817501","https://openalex.org/W6633795708","https://openalex.org/W6671250501","https://openalex.org/W6677413847"],"related_works":["https://openalex.org/W2726467123","https://openalex.org/W2064726690","https://openalex.org/W4252678288","https://openalex.org/W4254065731","https://openalex.org/W1607297154","https://openalex.org/W4210820789","https://openalex.org/W4237782192","https://openalex.org/W2913177154","https://openalex.org/W4235131201","https://openalex.org/W4232793539"],"abstract_inverted_index":{"Scratchpad":[0],"memories":[1,27],"(SPMs)":[2],"have":[3],"become":[4],"a":[5,72,95,116,134,182,204],"promising":[6],"on-chip":[7],"storage":[8],"solution":[9],"for":[10,131,231],"embedded":[11],"systems":[12],"from":[13,195],"an":[14,38,119,175,212],"energy,":[15],"performance":[16,238],"and":[17,47,160],"predictability":[18],"perspective.":[19],"The":[20,125,153],"thermal":[21,35,65,121],"behavior":[22,36,66,146],"of":[23,26,44,67,147,174],"these":[24],"types":[25],"has":[28],"not":[29],"been":[30],"considered":[31],"in":[32,41,48,114,177,201],"detail.":[33],"This":[34,101],"plays":[37],"important":[39],"role":[40],"the":[42,64,88,106,112,139,145,165,171,216,223],"reliability":[43],"silicon":[45,242],"devices":[46],"their":[49],"static":[50],"(leakage)":[51],"power":[52],"consumption.":[53],"In":[54],"this":[55],"paper,":[56],"we":[57,70,93,168],"propose":[58,71,94],"two":[59,154],"different":[60],"techniques":[61,155,233],"to":[62,83,104,111,198,221],"improve":[63,144],"SPMs.":[68],"First,":[69],"hardware-based,":[73],"thermal-aware":[74,97],"address":[75,98],"translation":[76],"technique":[77,102,127,141,167,218],"that":[78,108,118,170],"physically":[79],"distributes":[80],"memory":[81,90],"accesses":[82],"consecutive":[84],"addresses":[85],"evenly":[86],"over":[87],"whole":[89],"area.":[91,243],"Second,":[92],"software-based,":[96],"generation":[99],"technique.":[100],"tries":[103],"distribute":[105],"variables":[107],"are":[109,234],"allocated":[110],"SPM":[113,176],"such":[115],"way":[117],"even":[120],"distribution":[122],"is":[123,186,193,219],"achieved.":[124],"first":[126,166],"works":[128],"particularly":[129],"well":[130,162],"applications":[132,148,210],"with":[133,149,203,211],"regular":[135],"access":[136,151,214],"pattern,":[137,215],"whereas":[138],"second":[140,217],"can":[142],"also":[143],"irregular":[150,213],"patterns.":[152],"thus":[156],"complement":[157],"each":[158],"other":[159],"work":[161],"together.":[163],"Using":[164],"show":[169],"peak":[172,224],"temperature":[173,225],"65nm":[178],"technology,":[179],"when":[180],"running":[181],"typical":[183],"streaming":[184],"application,":[185],"decreased":[187],"by":[188,226],"up-to":[189,196,227],"10.0\u00b0C.":[190],"Temperature":[191],"cycling":[192],"reduced":[194],"14.8\u00b0C":[197],"almost":[199],"zero":[200],"comparison":[202],"non-thermal-aware":[205],"solution.":[206],"For":[207],"our":[208],"benchmark":[209],"able":[220],"reduce":[222],"3.5\u00b0C.":[228],"These":[229],"savings":[230],"both":[232],"obtained":[235],"without":[236],"any":[237],"degradation":[239],"or":[240],"extra":[241]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2015,"cited_by_count":1},{"year":2013,"cited_by_count":1},{"year":2012,"cited_by_count":1}],"updated_date":"2026-04-04T16:13:02.066488","created_date":"2025-10-10T00:00:00"}