{"id":"https://openalex.org/W2118445886","doi":"https://doi.org/10.1109/iccd.2007.4601902","title":"Scan chain design for three-dimensional integrated circuits (3D ICs)","display_name":"Scan chain design for three-dimensional integrated circuits (3D ICs)","publication_year":2007,"publication_date":"2007-10-01","ids":{"openalex":"https://openalex.org/W2118445886","doi":"https://doi.org/10.1109/iccd.2007.4601902","mag":"2118445886"},"language":"en","primary_location":{"id":"doi:10.1109/iccd.2007.4601902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2007.4601902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 25th International Conference on Computer Design","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5100837627","display_name":"Xiaoxia Wu","orcid":null},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Xiaoxia Wu","raw_affiliation_strings":["Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5074870918","display_name":"Paul Falkenstern","orcid":null},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Paul Falkenstern","raw_affiliation_strings":["Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA","institution_ids":[]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385338","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-3803-0929"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Computer Science and Engineering Department, The Pennylvavia State University, University Park, 16802 USA","institution_ids":["https://openalex.org/I130769515"]},{"raw_affiliation_string":"Dept. of Comput. Sci. & Eng., Pennylvavia State Univ., University Park, PA","institution_ids":[]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":1,"corresponding_author_ids":[],"corresponding_institution_ids":["https://openalex.org/I130769515"],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":62,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"208","last_page":"214"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9991000294685364,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/scan-chain","display_name":"Scan chain","score":0.9538465738296509},{"id":"https://openalex.org/keywords/design-for-testing","display_name":"Design for testing","score":0.6728214025497437},{"id":"https://openalex.org/keywords/benchmark","display_name":"Benchmark (surveying)","score":0.6408525109291077},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5663588643074036},{"id":"https://openalex.org/keywords/testability","display_name":"Testability","score":0.5638803839683533},{"id":"https://openalex.org/keywords/chain","display_name":"Chain (unit)","score":0.5459299683570862},{"id":"https://openalex.org/keywords/reduction","display_name":"Reduction (mathematics)","score":0.5149675011634827},{"id":"https://openalex.org/keywords/three-dimensional-integrated-circuit","display_name":"Three-dimensional integrated circuit","score":0.4718891382217407},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.4426795542240143},{"id":"https://openalex.org/keywords/physical-design","display_name":"Physical design","score":0.43444254994392395},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.4269610345363617},{"id":"https://openalex.org/keywords/circuit-design","display_name":"Circuit design","score":0.26197928190231323},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.23891595005989075},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.22683095932006836},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.19463244080543518},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.1053377091884613},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.10162225365638733}],"concepts":[{"id":"https://openalex.org/C150012182","wikidata":"https://www.wikidata.org/wiki/Q225990","display_name":"Scan chain","level":3,"score":0.9538465738296509},{"id":"https://openalex.org/C190874656","wikidata":"https://www.wikidata.org/wiki/Q5264347","display_name":"Design for testing","level":3,"score":0.6728214025497437},{"id":"https://openalex.org/C185798385","wikidata":"https://www.wikidata.org/wiki/Q1161707","display_name":"Benchmark (surveying)","level":2,"score":0.6408525109291077},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5663588643074036},{"id":"https://openalex.org/C51234621","wikidata":"https://www.wikidata.org/wiki/Q2149495","display_name":"Testability","level":2,"score":0.5638803839683533},{"id":"https://openalex.org/C199185054","wikidata":"https://www.wikidata.org/wiki/Q552299","display_name":"Chain (unit)","level":2,"score":0.5459299683570862},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.5149675011634827},{"id":"https://openalex.org/C59088047","wikidata":"https://www.wikidata.org/wiki/Q229370","display_name":"Three-dimensional integrated circuit","level":3,"score":0.4718891382217407},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.4426795542240143},{"id":"https://openalex.org/C188817802","wikidata":"https://www.wikidata.org/wiki/Q13426855","display_name":"Physical design","level":3,"score":0.43444254994392395},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.4269610345363617},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.26197928190231323},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.23891595005989075},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.22683095932006836},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.19463244080543518},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.1053377091884613},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.10162225365638733},{"id":"https://openalex.org/C13280743","wikidata":"https://www.wikidata.org/wiki/Q131089","display_name":"Geodesy","level":1,"score":0.0},{"id":"https://openalex.org/C205649164","wikidata":"https://www.wikidata.org/wiki/Q1071","display_name":"Geography","level":0,"score":0.0},{"id":"https://openalex.org/C1276947","wikidata":"https://www.wikidata.org/wiki/Q333","display_name":"Astronomy","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iccd.2007.4601902","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccd.2007.4601902","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2007 25th International Conference on Computer Design","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-133889","is_oa":false,"landing_page_url":"http://www.scopus.com/record/display.url?eid=2-s2.0-52949146354&origin=inward","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"","raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.5699999928474426,"display_name":"Industry, innovation and infrastructure","id":"https://metadata.un.org/sdg/9"}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":24,"referenced_works":["https://openalex.org/W1541633348","https://openalex.org/W1639032689","https://openalex.org/W1666750238","https://openalex.org/W1767514545","https://openalex.org/W1967401717","https://openalex.org/W1987131925","https://openalex.org/W2002041333","https://openalex.org/W2023264348","https://openalex.org/W2103573206","https://openalex.org/W2106537813","https://openalex.org/W2113911387","https://openalex.org/W2132668926","https://openalex.org/W2133965199","https://openalex.org/W2134329962","https://openalex.org/W2141736089","https://openalex.org/W2153705063","https://openalex.org/W2158921969","https://openalex.org/W2538857334","https://openalex.org/W3023540311","https://openalex.org/W4245500163","https://openalex.org/W4245549415","https://openalex.org/W6679712305","https://openalex.org/W6681089294","https://openalex.org/W6728464705"],"related_works":["https://openalex.org/W2107525390","https://openalex.org/W2157191248","https://openalex.org/W2765347974","https://openalex.org/W2553035740","https://openalex.org/W2150046587","https://openalex.org/W2164493372","https://openalex.org/W2114980936","https://openalex.org/W4249526199","https://openalex.org/W1594445436","https://openalex.org/W2128920253"],"abstract_inverted_index":{"Scan":[0],"chains":[1,25],"are":[2,82,103],"widely":[3],"used":[4],"to":[5,29,44,153],"improve":[6],"the":[7,21,53,61,87,126,132,154,160,167],"testability":[8],"of":[9,23,63,117,142,162],"IC":[10,15],"designs.":[11],"In":[12,48],"traditional":[13],"2D":[14,118,155],"designs,":[16],"various":[17],"design":[18,75,173],"techniques":[19],"on":[20,66,170],"construction":[22,56],"scan":[24,54,67,73,119,133,138,156,171],"have":[26,37],"been":[27,38],"proposed":[28,39,83],"facilitate":[30],"DFT":[31],"(Design-For-Test).":[32],"Recently,":[33],"three-dimensional":[34],"(3D)":[35],"technologies":[36,65],"as":[40,96,98],"a":[41],"promising":[42],"solution":[43],"continue":[45],"technology":[46],"scaling.":[47],"this":[49,165],"paper,":[50],"we":[51],"study":[52,169],"chain":[55,68,74,120,134,139,157,172],"for":[57,90,100,131,174],"3D":[58,64,72,175],"ICs,":[59],"examining":[60],"impact":[62],"ordering.":[69],"Three":[70],"different":[71],"approaches":[76,113],"(namely,":[77],"VIA3D,":[78],"MAP3D,":[79],"and":[80,84,111],"OPT3D)":[81],"compared,":[85],"with":[86],"experimental":[88],"results":[89,106],"ISCAS89":[91,144],"benchmark":[92],"circuits.":[93,177],"The":[94,105,136],"advantages":[95],"well":[97],"disadvantages":[99],"each":[101],"approach":[102],"discussed.":[104],"show":[107],"that":[108],"both":[109],"MAP3D":[110],"VIA3D":[112],"require":[114],"no":[115],"changes":[116],"algorithms,":[121],"but":[122],"OPT3D":[123,148],"can":[124],"achieve":[125],"best":[127,161],"wire":[128,140],"length":[129,141],"reduction":[130,151],"design.":[135,158],"average":[137],"six":[143],"benchmarks":[145],"obtained":[146],"from":[147],"has":[149],"46.0%":[150],"compared":[152],"To":[159],"our":[163],"knowledge,":[164],"is":[166],"first":[168],"integrated":[176]},"counts_by_year":[{"year":2023,"cited_by_count":1},{"year":2022,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2017,"cited_by_count":4},{"year":2016,"cited_by_count":3},{"year":2015,"cited_by_count":2},{"year":2014,"cited_by_count":2},{"year":2013,"cited_by_count":6},{"year":2012,"cited_by_count":8}],"updated_date":"2026-07-14T23:27:15.235271","created_date":"2025-10-10T00:00:00"}