{"id":"https://openalex.org/W4416429682","doi":"https://doi.org/10.1109/iccad66269.2025.11240864","title":"Quantitative Cost Model and Cost Optimization Methods for Multi-Technology-Node Architecture","display_name":"Quantitative Cost Model and Cost Optimization Methods for Multi-Technology-Node Architecture","publication_year":2025,"publication_date":"2025-10-26","ids":{"openalex":"https://openalex.org/W4416429682","doi":"https://doi.org/10.1109/iccad66269.2025.11240864"},"language":null,"primary_location":{"id":"doi:10.1109/iccad66269.2025.11240864","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad66269.2025.11240864","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5112914856","display_name":"Qimin Yuan","orcid":null},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Qimin Yuan","raw_affiliation_strings":["Zhejiang University,College of Integrated Circuits,Hangzhou,China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University,College of Integrated Circuits,Hangzhou,China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100768452","display_name":"Kai Huang","orcid":"https://orcid.org/0000-0003-0359-7810"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Kai Huang","raw_affiliation_strings":["Zhejiang University,College of Integrated Circuits,Hangzhou,China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University,College of Integrated Circuits,Hangzhou,China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021783986","display_name":"Xiaowen Jiang","orcid":"https://orcid.org/0000-0002-6283-2262"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xiaowen Jiang","raw_affiliation_strings":["Zhejiang University,College of Integrated Circuits,Hangzhou,China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University,College of Integrated Circuits,Hangzhou,China","institution_ids":["https://openalex.org/I76130692"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5073803879","display_name":"Dongliang Xiong","orcid":"https://orcid.org/0000-0002-4882-7504"},"institutions":[{"id":"https://openalex.org/I76130692","display_name":"Zhejiang University","ror":"https://ror.org/00a2xv884","country_code":"CN","type":"education","lineage":["https://openalex.org/I76130692"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dongliang Xiong","raw_affiliation_strings":["Zhejiang University,College of Integrated Circuits,Hangzhou,China"],"affiliations":[{"raw_affiliation_string":"Zhejiang University,College of Integrated Circuits,Hangzhou,China","institution_ids":["https://openalex.org/I76130692"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5112914856"],"corresponding_institution_ids":["https://openalex.org/I76130692"],"apc_list":null,"apc_paid":null,"fwci":0.0,"has_fulltext":false,"cited_by_count":0,"citation_normalized_percentile":{"value":0.34388494,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.6625999808311462,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.6625999808311462,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.17739999294281006,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.055799998342990875,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/key","display_name":"Key (lock)","score":0.5597000122070312},{"id":"https://openalex.org/keywords/partition","display_name":"Partition (number theory)","score":0.52920001745224},{"id":"https://openalex.org/keywords/cost-reduction","display_name":"Cost reduction","score":0.5273000001907349},{"id":"https://openalex.org/keywords/cost-estimate","display_name":"Cost estimate","score":0.4519999921321869},{"id":"https://openalex.org/keywords/relevant-cost","display_name":"Relevant cost","score":0.3776000142097473},{"id":"https://openalex.org/keywords/total-cost","display_name":"Total cost","score":0.373199999332428},{"id":"https://openalex.org/keywords/manufacturing-cost","display_name":"Manufacturing cost","score":0.3522999882698059},{"id":"https://openalex.org/keywords/work","display_name":"Work (physics)","score":0.3499000072479248}],"concepts":[{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.6460999846458435},{"id":"https://openalex.org/C26517878","wikidata":"https://www.wikidata.org/wiki/Q228039","display_name":"Key (lock)","level":2,"score":0.5597000122070312},{"id":"https://openalex.org/C42812","wikidata":"https://www.wikidata.org/wiki/Q1082910","display_name":"Partition (number theory)","level":2,"score":0.52920001745224},{"id":"https://openalex.org/C2778820799","wikidata":"https://www.wikidata.org/wiki/Q3454688","display_name":"Cost reduction","level":2,"score":0.5273000001907349},{"id":"https://openalex.org/C93983250","wikidata":"https://www.wikidata.org/wiki/Q795053","display_name":"Cost estimate","level":2,"score":0.4519999921321869},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.3873000144958496},{"id":"https://openalex.org/C126221108","wikidata":"https://www.wikidata.org/wiki/Q7310977","display_name":"Relevant cost","level":3,"score":0.3776000142097473},{"id":"https://openalex.org/C182299520","wikidata":"https://www.wikidata.org/wiki/Q1289588","display_name":"Total cost","level":2,"score":0.373199999332428},{"id":"https://openalex.org/C2778337023","wikidata":"https://www.wikidata.org/wiki/Q6753108","display_name":"Manufacturing cost","level":2,"score":0.3522999882698059},{"id":"https://openalex.org/C18762648","wikidata":"https://www.wikidata.org/wiki/Q42213","display_name":"Work (physics)","level":2,"score":0.3499000072479248},{"id":"https://openalex.org/C111335779","wikidata":"https://www.wikidata.org/wiki/Q3454686","display_name":"Reduction (mathematics)","level":2,"score":0.34150001406669617},{"id":"https://openalex.org/C95821633","wikidata":"https://www.wikidata.org/wiki/Q973302","display_name":"Cost driver","level":2,"score":0.321399986743927},{"id":"https://openalex.org/C126255220","wikidata":"https://www.wikidata.org/wiki/Q141495","display_name":"Mathematical optimization","level":1,"score":0.31949999928474426},{"id":"https://openalex.org/C98025372","wikidata":"https://www.wikidata.org/wiki/Q477538","display_name":"Systems architecture","level":3,"score":0.3084999918937683},{"id":"https://openalex.org/C123657996","wikidata":"https://www.wikidata.org/wiki/Q12271","display_name":"Architecture","level":2,"score":0.29670000076293945},{"id":"https://openalex.org/C13736549","wikidata":"https://www.wikidata.org/wiki/Q4489420","display_name":"Industrial engineering","level":1,"score":0.29159998893737793},{"id":"https://openalex.org/C137836250","wikidata":"https://www.wikidata.org/wiki/Q984063","display_name":"Optimization problem","level":2,"score":0.28929999470710754},{"id":"https://openalex.org/C31352089","wikidata":"https://www.wikidata.org/wiki/Q3750474","display_name":"Systems design","level":2,"score":0.2831999957561493},{"id":"https://openalex.org/C11644782","wikidata":"https://www.wikidata.org/wiki/Q15401790","display_name":"Cost efficiency","level":2,"score":0.27549999952316284},{"id":"https://openalex.org/C3019080777","wikidata":"https://www.wikidata.org/wiki/Q1754768","display_name":"Cost effectiveness","level":2,"score":0.2743000090122223},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2630999982357025},{"id":"https://openalex.org/C42475967","wikidata":"https://www.wikidata.org/wiki/Q194292","display_name":"Operations research","level":1,"score":0.25540000200271606}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad66269.2025.11240864","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad66269.2025.11240864","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320335787","display_name":"Fundamental Research Funds for the Central Universities","ror":null}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W2015540924","https://openalex.org/W2128998437","https://openalex.org/W2151836334","https://openalex.org/W2234584938","https://openalex.org/W2532719504","https://openalex.org/W2604670770","https://openalex.org/W3003453067","https://openalex.org/W3018363946","https://openalex.org/W3080132014","https://openalex.org/W3092240006","https://openalex.org/W3136310872","https://openalex.org/W3148440458","https://openalex.org/W3188178661","https://openalex.org/W4200622472","https://openalex.org/W4244395536","https://openalex.org/W4293023438","https://openalex.org/W4379116024","https://openalex.org/W4386763434","https://openalex.org/W4390356852","https://openalex.org/W4393140919","https://openalex.org/W4406753855","https://openalex.org/W4408181586","https://openalex.org/W4408326020"],"related_works":[],"abstract_inverted_index":{"In":[0,44,70],"multi-chiplet":[1,59],"design":[2,26],"research,":[3],"cost":[4,15,30,51,56,93,110],"reduction":[5],"is":[6,17],"a":[7,49],"key":[8],"advantage":[9],"of":[10,35,57,95],"heterogeneous":[11],"integration.":[12],"Accurate":[13],"system":[14,42],"modeling":[16],"essential":[18],"for":[19,53],"making":[20],"informed":[21],"decisions":[22],"early":[23],"in":[24,106],"the":[25,33,55,58,92],"process.":[27],"However,":[28],"previous":[29],"models":[31],"overlooked":[32],"impact":[34],"mixing":[36],"different":[37],"technology":[38,63,81],"nodes":[39,64],"on":[40,78],"overall":[41],"cost.":[43],"this":[45],"paper,":[46],"we":[47],"propose":[48],"quantitative":[50],"model":[52],"estimating":[54],"systems":[60],"across":[61],"multiple":[62],"and":[65,83],"various":[66],"chiplet":[67],"partition":[68,79],"granularities.":[69],"addition,":[71],"three":[72],"optimization":[73,103],"strategies":[74,104],"are":[75],"introduced,":[76],"focusing":[77],"granularity,":[80],"node,":[82],"wafer":[84],"metal":[85],"layer,":[86],"which":[87],"work":[88],"synergistically":[89],"to":[90,108,113],"improve":[91],"efficiency":[94],"2.5D":[96,115],"design.":[97],"Case":[98],"studies":[99],"demonstrate":[100],"that":[101],"applying":[102],"results":[105],"18%":[107],"31%":[109],"savings":[111],"compared":[112],"non-optimized":[114],"designs.":[116]},"counts_by_year":[],"updated_date":"2026-04-09T08:11:56.329763","created_date":"2025-11-20T00:00:00"}