{"id":"https://openalex.org/W4416429511","doi":"https://doi.org/10.1109/iccad66269.2025.11240778","title":"LCTMwalk: GPU-Accelerated Transient Thermal Simulation for Liquid-Cooled 2.5D/3D ICs via Random Walks on Circuit Networks of Modified Compact Thermal Models","display_name":"LCTMwalk: GPU-Accelerated Transient Thermal Simulation for Liquid-Cooled 2.5D/3D ICs via Random Walks on Circuit Networks of Modified Compact Thermal Models","publication_year":2025,"publication_date":"2025-10-26","ids":{"openalex":"https://openalex.org/W4416429511","doi":"https://doi.org/10.1109/iccad66269.2025.11240778"},"language":null,"primary_location":{"id":"doi:10.1109/iccad66269.2025.11240778","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad66269.2025.11240778","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5111351889","display_name":"Zhixuan Dong","orcid":null},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":true,"raw_author_name":"Zhixuan Dong","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5086595168","display_name":"Yiyong Luo","orcid":"https://orcid.org/0000-0001-9448-9684"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yonghan Luo","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5058273238","display_name":"Yuan Meng","orcid":"https://orcid.org/0000-0003-0010-2560"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Yuan Meng","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5037328458","display_name":"Changhao Yan","orcid":"https://orcid.org/0000-0002-8936-3945"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Changhao Yan","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5039204202","display_name":"Zhaori Bi","orcid":"https://orcid.org/0000-0002-7315-3150"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Zhaori Bi","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5079056437","display_name":"Keren Zhu","orcid":"https://orcid.org/0000-0003-2698-141X"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Keren Zhu","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021251855","display_name":"Sheng\u2010Guo Wang","orcid":"https://orcid.org/0000-0001-6101-675X"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Sheng-Guo Wang","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054960059","display_name":"Dian Zhou","orcid":"https://orcid.org/0000-0002-2648-5232"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Dian Zhou","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5064213921","display_name":"Xuan Zeng","orcid":"https://orcid.org/0000-0002-8097-4053"},"institutions":[{"id":"https://openalex.org/I24943067","display_name":"Fudan University","ror":"https://ror.org/013q1eq08","country_code":"CN","type":"education","lineage":["https://openalex.org/I24943067"]}],"countries":["CN"],"is_corresponding":false,"raw_author_name":"Xuan Zeng","raw_affiliation_strings":["Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China"],"affiliations":[{"raw_affiliation_string":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,Shanghai,China","institution_ids":["https://openalex.org/I24943067"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":9,"corresponding_author_ids":["https://openalex.org/A5111351889"],"corresponding_institution_ids":["https://openalex.org/I24943067"],"apc_list":null,"apc_paid":null,"fwci":0.6973,"has_fulltext":false,"cited_by_count":1,"citation_normalized_percentile":{"value":0.77853703,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"9"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.8306999802589417,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.8306999802589417,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.05290000140666962,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.029500000178813934,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/random-walk","display_name":"Random walk","score":0.8145999908447266},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.7591999769210815},{"id":"https://openalex.org/keywords/thermal","display_name":"Thermal","score":0.5037999749183655},{"id":"https://openalex.org/keywords/electronic-circuit","display_name":"Electronic circuit","score":0.47279998660087585},{"id":"https://openalex.org/keywords/speedup","display_name":"Speedup","score":0.41769999265670776},{"id":"https://openalex.org/keywords/thermal-analysis","display_name":"Thermal analysis","score":0.4171000123023987},{"id":"https://openalex.org/keywords/topology","display_name":"Topology (electrical circuits)","score":0.38769999146461487},{"id":"https://openalex.org/keywords/network-analysis","display_name":"Network analysis","score":0.38659998774528503},{"id":"https://openalex.org/keywords/transient-response","display_name":"Transient response","score":0.36390000581741333}],"concepts":[{"id":"https://openalex.org/C121194460","wikidata":"https://www.wikidata.org/wiki/Q856741","display_name":"Random walk","level":2,"score":0.8145999908447266},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.7591999769210815},{"id":"https://openalex.org/C204530211","wikidata":"https://www.wikidata.org/wiki/Q752823","display_name":"Thermal","level":2,"score":0.5037999749183655},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.47749999165534973},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.47450000047683716},{"id":"https://openalex.org/C134146338","wikidata":"https://www.wikidata.org/wiki/Q1815901","display_name":"Electronic circuit","level":2,"score":0.47279998660087585},{"id":"https://openalex.org/C68339613","wikidata":"https://www.wikidata.org/wiki/Q1549489","display_name":"Speedup","level":2,"score":0.41769999265670776},{"id":"https://openalex.org/C129446986","wikidata":"https://www.wikidata.org/wiki/Q542419","display_name":"Thermal analysis","level":3,"score":0.4171000123023987},{"id":"https://openalex.org/C184720557","wikidata":"https://www.wikidata.org/wiki/Q7825049","display_name":"Topology (electrical circuits)","level":2,"score":0.38769999146461487},{"id":"https://openalex.org/C32946077","wikidata":"https://www.wikidata.org/wiki/Q618079","display_name":"Network analysis","level":2,"score":0.38659998774528503},{"id":"https://openalex.org/C85761212","wikidata":"https://www.wikidata.org/wiki/Q1974593","display_name":"Transient response","level":2,"score":0.36390000581741333},{"id":"https://openalex.org/C78434282","wikidata":"https://www.wikidata.org/wiki/Q11656","display_name":"Diode","level":2,"score":0.3573000133037567},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.3531000018119812},{"id":"https://openalex.org/C186937647","wikidata":"https://www.wikidata.org/wiki/Q1796959","display_name":"Heat sink","level":2,"score":0.35040000081062317},{"id":"https://openalex.org/C190560348","wikidata":"https://www.wikidata.org/wiki/Q3245116","display_name":"Circuit design","level":2,"score":0.3199000060558319},{"id":"https://openalex.org/C23572009","wikidata":"https://www.wikidata.org/wiki/Q964981","display_name":"Equivalent circuit","level":3,"score":0.31779998540878296},{"id":"https://openalex.org/C117896860","wikidata":"https://www.wikidata.org/wiki/Q11376","display_name":"Acceleration","level":2,"score":0.30979999899864197},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2989000082015991},{"id":"https://openalex.org/C2777735758","wikidata":"https://www.wikidata.org/wiki/Q817765","display_name":"Path (computing)","level":2,"score":0.2980000078678131},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.28119999170303345},{"id":"https://openalex.org/C159694833","wikidata":"https://www.wikidata.org/wiki/Q2321565","display_name":"Iterative method","level":2,"score":0.28110000491142273},{"id":"https://openalex.org/C202787564","wikidata":"https://www.wikidata.org/wiki/Q6510488","display_name":"Heat equation","level":2,"score":0.2770000100135803},{"id":"https://openalex.org/C46205389","wikidata":"https://www.wikidata.org/wiki/Q1270401","display_name":"Electronic circuit simulation","level":3,"score":0.27140000462532043},{"id":"https://openalex.org/C42196554","wikidata":"https://www.wikidata.org/wiki/Q1186179","display_name":"Synchronous circuit","level":4,"score":0.26969999074935913},{"id":"https://openalex.org/C120793396","wikidata":"https://www.wikidata.org/wiki/Q173350","display_name":"Printed circuit board","level":2,"score":0.26339998841285706},{"id":"https://openalex.org/C199310435","wikidata":"https://www.wikidata.org/wiki/Q7659121","display_name":"Switching time","level":2,"score":0.2531999945640564},{"id":"https://openalex.org/C72293138","wikidata":"https://www.wikidata.org/wiki/Q909741","display_name":"Temperature measurement","level":2,"score":0.2515000104904175}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad66269.2025.11240778","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad66269.2025.11240778","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2025 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[{"id":"https://openalex.org/F4320321001","display_name":"National Natural Science Foundation of China","ror":"https://ror.org/01h0zpd94"},{"id":"https://openalex.org/F4320321885","display_name":"Science and Technology Commission of Shanghai Municipality","ror":"https://ror.org/03kt66j61"}],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":19,"referenced_works":["https://openalex.org/W2040110853","https://openalex.org/W2099647435","https://openalex.org/W2102627844","https://openalex.org/W2129960401","https://openalex.org/W2479838429","https://openalex.org/W2942961753","https://openalex.org/W2948437533","https://openalex.org/W3142845206","https://openalex.org/W3156811509","https://openalex.org/W3163019281","https://openalex.org/W3217315228","https://openalex.org/W4241611182","https://openalex.org/W4295789384","https://openalex.org/W4382999279","https://openalex.org/W4386764223","https://openalex.org/W4389162748","https://openalex.org/W4409282640","https://openalex.org/W4409282681","https://openalex.org/W4409282844"],"related_works":[],"abstract_inverted_index":{"Thermal":[0],"issues":[1],"are":[2,41],"critical":[3],"in":[4,70,163],"2.5D/3D":[5,52,107,194],"IC":[6,195],"design,":[7],"and":[8,167,188],"liquid":[9,87],"cooling":[10],"provides":[11],"an":[12],"effective":[13],"solution":[14,148],"for":[15,29,38,43,67,101],"heat":[16],"dissipation.":[17],"Widely":[18],"used":[19],"compact":[20],"thermal":[21,31,47,103],"models":[22],"(CTMs)":[23],"convert":[24],"chips":[25],"into":[26],"circuit":[27,72,81,117,153],"networks":[28,82],"fast":[30,65],"simulations.":[32],"However,":[33],"current":[34,123],"matrix-solving":[35],"acceleration":[36],"methods":[37],"CTM-derived":[39,116],"circuits":[40],"inadequate":[42],"high-speed":[44],"iterative":[45],"transient":[46,102,134],"analysis":[48,104,135],"of":[49,83,105,149],"large-scale":[50,71],"liquid-cooled":[51,106,115],"ICs":[53],"during":[54],"design":[55],"optimization.":[56],"In":[57,89],"contrast,":[58],"the":[59,80,84,114,121,127,133,147,174],"random":[60,98,111,140],"walk":[61,99,141],"method":[62,100,180],"can":[63,159,189],"provide":[64],"solutions":[66],"local":[68,152],"nodes":[69],"networks,":[73],"but":[74],"it":[75],"is":[76],"not":[77],"applicable":[78],"to":[79,173,192,203],"CTMs":[85],"with":[86,126,142,181,197],"cooling.":[88],"this":[90],"paper,":[91],"we":[92,119,131],"propose":[93],"LCTMwalk,":[94],"a":[95,138,169],"novel":[96],"GPU-accelerated":[97],"ICs.":[108],"To":[109],"enable":[110],"walks":[112],"on":[113],"network,":[118],"replace":[120],"voltage-controlled":[122],"source":[124],"model":[125],"diode":[128],"model.":[129],"Additionally,":[130],"improve":[132],"by":[136],"using":[137],"time-backward":[139],"time-domain":[143],"path":[144],"reuse,":[145],"accelerating":[146],"temperature":[150],"at":[151],"nodes.":[154],"Experimental":[155],"results":[156],"show":[157],"LCTMwalk":[158,184],"solve":[160],"million-scale":[161],"cases":[162],"only":[164],"500":[165],"ms,":[166],"achieves":[168],"14-22\u00d7":[170],"speedup":[171],"compared":[172,202],"state-of-the-art":[175],"alternating":[176],"direction":[177],"implicit":[178],"(ADI)":[179],"GPU.":[182],"Besides,":[183],"exhibits":[185],"good":[186],"generalizability":[187],"be":[190],"applied":[191],"various":[193],"structures":[196],"high":[198],"accuracy":[199],"(error<1":[200],"K":[201],"3D-ICE).":[204]},"counts_by_year":[{"year":2026,"cited_by_count":1}],"updated_date":"2026-04-09T08:11:56.329763","created_date":"2025-11-20T00:00:00"}