{"id":"https://openalex.org/W4389162664","doi":"https://doi.org/10.1109/iccad57390.2023.10323648","title":"Invited Paper: Overview of 2023 CAD Contest at ICCAD","display_name":"Invited Paper: Overview of 2023 CAD Contest at ICCAD","publication_year":2023,"publication_date":"2023-10-28","ids":{"openalex":"https://openalex.org/W4389162664","doi":"https://doi.org/10.1109/iccad57390.2023.10323648"},"language":"en","primary_location":{"id":"doi:10.1109/iccad57390.2023.10323648","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad57390.2023.10323648","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5017861176","display_name":"Takashi Sat\u014d","orcid":"https://orcid.org/0000-0002-1577-8259"},"institutions":[{"id":"https://openalex.org/I4210129581","display_name":"Kyoto University of Education","ror":"https://ror.org/03zhhr656","country_code":"JP","type":"education","lineage":["https://openalex.org/I4210129581"]},{"id":"https://openalex.org/I22299242","display_name":"Kyoto University","ror":"https://ror.org/02kpeqv85","country_code":"JP","type":"education","lineage":["https://openalex.org/I22299242"]}],"countries":["JP"],"is_corresponding":true,"raw_author_name":"Takashi Sato","raw_affiliation_strings":["Kyoto University,Department of EE,Kyoto,Japan","Department of EE, Kyoto University, Kyoto, Japan"],"affiliations":[{"raw_affiliation_string":"Kyoto University,Department of EE,Kyoto,Japan","institution_ids":["https://openalex.org/I22299242","https://openalex.org/I4210129581"]},{"raw_affiliation_string":"Department of EE, Kyoto University, Kyoto, Japan","institution_ids":["https://openalex.org/I22299242"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5115602054","display_name":"Chun-Yao Wang","orcid":"https://orcid.org/0000-0002-4536-214X"},"institutions":[{"id":"https://openalex.org/I25846049","display_name":"National Tsing Hua University","ror":"https://ror.org/00zdnkx70","country_code":"TW","type":"education","lineage":["https://openalex.org/I25846049"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Chun-Yao Wang","raw_affiliation_strings":["National Tsing Hua University,Department of CS,Hsinchu,Taiwan","Department of CS, National Tsing Hua University, Hsinchu, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Tsing Hua University,Department of CS,Hsinchu,Taiwan","institution_ids":["https://openalex.org/I25846049"]},{"raw_affiliation_string":"Department of CS, National Tsing Hua University, Hsinchu, Taiwan","institution_ids":["https://openalex.org/I25846049"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5011277985","display_name":"Yuguang Chen","orcid":"https://orcid.org/0000-0003-4520-5395"},"institutions":[{"id":"https://openalex.org/I22265921","display_name":"National Central University","ror":"https://ror.org/00944ve71","country_code":"TW","type":"education","lineage":["https://openalex.org/I22265921"]}],"countries":["TW"],"is_corresponding":false,"raw_author_name":"Yu-Guang Chen","raw_affiliation_strings":["National Central University,Department of EE,Taoyuan,Taiwan","Department of EE, National Central University, Taoyuan, Taiwan"],"affiliations":[{"raw_affiliation_string":"National Central University,Department of EE,Taoyuan,Taiwan","institution_ids":["https://openalex.org/I22265921"]},{"raw_affiliation_string":"Department of EE, National Central University, Taoyuan, Taiwan","institution_ids":["https://openalex.org/I22265921"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5088685794","display_name":"Tsung\u2010Wei Huang","orcid":"https://orcid.org/0000-0001-9768-3378"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Tsung-Wei Huang","raw_affiliation_strings":["University of Wisconsin,Department of ECE,Madison,USA","Department of ECE, University of Wisconsin, Madison, USA"],"affiliations":[{"raw_affiliation_string":"University of Wisconsin,Department of ECE,Madison,USA","institution_ids":["https://openalex.org/I135310074"]},{"raw_affiliation_string":"Department of ECE, University of Wisconsin, Madison, USA","institution_ids":["https://openalex.org/I135310074"]}]}],"institutions":[],"countries_distinct_count":3,"institutions_distinct_count":4,"corresponding_author_ids":["https://openalex.org/A5017861176"],"corresponding_institution_ids":["https://openalex.org/I22299242","https://openalex.org/I4210129581"],"apc_list":null,"apc_paid":null,"fwci":0.6223,"has_fulltext":false,"cited_by_count":3,"citation_normalized_percentile":{"value":0.74893529,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":96,"max":97},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"6"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11159","display_name":"Manufacturing Process and Optimization","score":0.9878000020980835,"subfield":{"id":"https://openalex.org/subfields/2209","display_name":"Industrial and Manufacturing Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.983299970626831,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11032","display_name":"VLSI and Analog Circuit Testing","score":0.9700999855995178,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/contest","display_name":"CONTEST","score":0.7694402933120728},{"id":"https://openalex.org/keywords/cad","display_name":"CAD","score":0.6235400438308716},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5766094923019409},{"id":"https://openalex.org/keywords/engineering-drawing","display_name":"Engineering drawing","score":0.1647058129310608},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.15690207481384277},{"id":"https://openalex.org/keywords/political-science","display_name":"Political science","score":0.13530036807060242}],"concepts":[{"id":"https://openalex.org/C2777582232","wikidata":"https://www.wikidata.org/wiki/Q5013414","display_name":"CONTEST","level":2,"score":0.7694402933120728},{"id":"https://openalex.org/C194789388","wikidata":"https://www.wikidata.org/wiki/Q17855283","display_name":"CAD","level":2,"score":0.6235400438308716},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5766094923019409},{"id":"https://openalex.org/C199639397","wikidata":"https://www.wikidata.org/wiki/Q1788588","display_name":"Engineering drawing","level":1,"score":0.1647058129310608},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.15690207481384277},{"id":"https://openalex.org/C17744445","wikidata":"https://www.wikidata.org/wiki/Q36442","display_name":"Political science","level":0,"score":0.13530036807060242},{"id":"https://openalex.org/C199539241","wikidata":"https://www.wikidata.org/wiki/Q7748","display_name":"Law","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad57390.2023.10323648","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad57390.2023.10323648","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.6100000143051147,"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":39,"referenced_works":["https://openalex.org/W2007895726","https://openalex.org/W2021894415","https://openalex.org/W2056354199","https://openalex.org/W2057596653","https://openalex.org/W2059199163","https://openalex.org/W2163789430","https://openalex.org/W2533275277","https://openalex.org/W2533987500","https://openalex.org/W2536600004","https://openalex.org/W2773709731","https://openalex.org/W2774480234","https://openalex.org/W2915205650","https://openalex.org/W2997649016","https://openalex.org/W2997798154","https://openalex.org/W2997936488","https://openalex.org/W2998727840","https://openalex.org/W3112978664","https://openalex.org/W3114720194","https://openalex.org/W3117396318","https://openalex.org/W4200043277","https://openalex.org/W4200257520","https://openalex.org/W4200338900","https://openalex.org/W4200425464","https://openalex.org/W4232678353","https://openalex.org/W4232775057","https://openalex.org/W4233141835","https://openalex.org/W4239546712","https://openalex.org/W4241245376","https://openalex.org/W4242440486","https://openalex.org/W4246276176","https://openalex.org/W4247510399","https://openalex.org/W4249586904","https://openalex.org/W4251366091","https://openalex.org/W4255503355","https://openalex.org/W4312076519","https://openalex.org/W4312120997","https://openalex.org/W4312121064","https://openalex.org/W4389166726","https://openalex.org/W6634120076"],"related_works":["https://openalex.org/W4391375266","https://openalex.org/W2899084033","https://openalex.org/W2748952813","https://openalex.org/W2735088306","https://openalex.org/W4286740636","https://openalex.org/W2946214509","https://openalex.org/W2606108738","https://openalex.org/W2628063975","https://openalex.org/W2356479129","https://openalex.org/W2387346515"],"abstract_inverted_index":{"The":[0,63,102],"\u201cCAD":[1],"Contest":[2,105],"at":[3,68],"ICCAD\u201d":[4],"is":[5],"a":[6,84],"challenging,":[7],"multi-month,":[8],"research":[9,129],"and":[10,48,91,100,138,155],"development":[11],"competition,":[12],"focusing":[13],"on":[14],"advanced,":[15],"real-world":[16],"problems":[17,58,122],"in":[18,54,97],"the":[19,28,79,112,116,121,150],"field":[20],"of":[21,95,123],"electronic":[22],"design":[23,36,40],"automation":[24],"(EDA).":[25],"Since":[26],"2012,":[27],"contest":[29,80,151],"has":[30,106],"been":[31],"publishing":[32],"many":[33],"sophisticated":[34],"circuit":[35,133],"problems,":[37],"from":[38,109,144],"system-level":[39],"to":[41,74,93],"physical":[42],"design,":[43],"together":[44],"with":[45],"industrial":[46],"benchmarks":[47],"solution":[49],"evaluators.":[50],"Contestants":[51],"can":[52],"participate":[53],"one":[55],"or":[56],"more":[57,82],"provided":[59],"by":[60],"EDA/IC":[61,146],"industry.":[62],"winners":[64],"will":[65],"be":[66],"awarded":[67],"an":[69],"ICCAD":[70],"special":[71],"session":[72],"dedicated":[73],"this":[75,124],"contest.":[76],"Every":[77],"year,":[78],"attracts":[81],"than":[83],"hundred":[85],"teams,":[86],"fosters":[87],"productive":[88],"industry-academia":[89],"collaborations,":[90],"leads":[92],"hundreds":[94],"publications":[96],"top-tier":[98],"conferences":[99],"journals.":[101],"2023":[103],"CAD":[104],"210":[107],"teams":[108],"all":[110],"over":[111],"world,":[113],"which":[114],"generates":[115],"highest":[117],"participation":[118],"record.":[119],"Moreover,":[120],"year":[125],"cover":[126],"state-of-the-art":[127],"EDA":[128,143,157],"trends":[130],"such":[131],"as":[132],"verification,":[134],"hardware":[135],"security,":[136],"3D-IC,":[137],"Machine":[139],"Learning":[140],"(ML)":[141],"for":[142],"well-known":[145],"companies.":[147],"We":[148],"believe":[149],"keeps":[152],"enhancing":[153],"impact":[154],"boosting":[156],"researches.":[158]},"counts_by_year":[{"year":2025,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}