{"id":"https://openalex.org/W4200421630","doi":"https://doi.org/10.1109/iccad51958.2021.9643570","title":"Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections","display_name":"Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections","publication_year":2021,"publication_date":"2021-11-01","ids":{"openalex":"https://openalex.org/W4200421630","doi":"https://doi.org/10.1109/iccad51958.2021.9643570"},"language":"en","primary_location":{"id":"doi:10.1109/iccad51958.2021.9643570","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad51958.2021.9643570","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5064836620","display_name":"Mohammad Abdullah Al Shohel","orcid":"https://orcid.org/0000-0001-6845-4306"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Mohammad Abdullah Al Shohel","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN","institution_ids":["https://openalex.org/I130238516"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5069179438","display_name":"Vidya A. Chhabria","orcid":"https://orcid.org/0000-0002-3273-0724"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Vidya A. Chhabria","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN","institution_ids":["https://openalex.org/I130238516"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5008228117","display_name":"Nestor Evmorfopoulos","orcid":"https://orcid.org/0000-0002-6968-0222"},"institutions":[{"id":"https://openalex.org/I145722265","display_name":"University of Thessaly","ror":"https://ror.org/04v4g9h31","country_code":"GR","type":"education","lineage":["https://openalex.org/I145722265"]}],"countries":["GR"],"is_corresponding":false,"raw_author_name":"Nestor Evmorfopoulos","raw_affiliation_strings":["University of Thessaly, Volos, Greece"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Thessaly, Volos, Greece","institution_ids":["https://openalex.org/I145722265"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5068714995","display_name":"Sachin S. Sapatnekar","orcid":"https://orcid.org/0000-0002-5353-2364"},"institutions":[{"id":"https://openalex.org/I130238516","display_name":"University of Minnesota","ror":"https://ror.org/017zqws13","country_code":"US","type":"education","lineage":["https://openalex.org/I130238516"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Sachin S. Sapatnekar","raw_affiliation_strings":["University of Minnesota, Minneapolis, MN"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"University of Minnesota, Minneapolis, MN","institution_ids":["https://openalex.org/I130238516"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":null,"has_fulltext":false,"cited_by_count":28,"citation_normalized_percentile":null,"cited_by_percentile_year":null,"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998999834060669,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10460","display_name":"Electronic Packaging and Soldering Technologies","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9894000291824341,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.921781063079834},{"id":"https://openalex.org/keywords/transient","display_name":"Transient (computer programming)","score":0.7881494760513306},{"id":"https://openalex.org/keywords/solver","display_name":"Solver","score":0.6696570515632629},{"id":"https://openalex.org/keywords/stress","display_name":"Stress (linguistics)","score":0.6349377632141113},{"id":"https://openalex.org/keywords/finite-element-method","display_name":"Finite element method","score":0.6022523641586304},{"id":"https://openalex.org/keywords/boundary-value-problem","display_name":"Boundary value problem","score":0.5460463166236877},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.544983983039856},{"id":"https://openalex.org/keywords/boundary","display_name":"Boundary (topology)","score":0.48793575167655945},{"id":"https://openalex.org/keywords/mechanics","display_name":"Mechanics","score":0.41653379797935486},{"id":"https://openalex.org/keywords/scalability","display_name":"Scalability","score":0.4105771780014038},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.39291927218437195},{"id":"https://openalex.org/keywords/structural-engineering","display_name":"Structural engineering","score":0.2482205033302307},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.225692480802536},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.2060142457485199},{"id":"https://openalex.org/keywords/mathematical-analysis","display_name":"Mathematical analysis","score":0.1985437273979187},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.19794514775276184},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.1495549976825714}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.921781063079834},{"id":"https://openalex.org/C2780799671","wikidata":"https://www.wikidata.org/wiki/Q17087362","display_name":"Transient (computer programming)","level":2,"score":0.7881494760513306},{"id":"https://openalex.org/C2778770139","wikidata":"https://www.wikidata.org/wiki/Q1966904","display_name":"Solver","level":2,"score":0.6696570515632629},{"id":"https://openalex.org/C21036866","wikidata":"https://www.wikidata.org/wiki/Q181767","display_name":"Stress (linguistics)","level":2,"score":0.6349377632141113},{"id":"https://openalex.org/C135628077","wikidata":"https://www.wikidata.org/wiki/Q220184","display_name":"Finite element method","level":2,"score":0.6022523641586304},{"id":"https://openalex.org/C182310444","wikidata":"https://www.wikidata.org/wiki/Q1332643","display_name":"Boundary value problem","level":2,"score":0.5460463166236877},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.544983983039856},{"id":"https://openalex.org/C62354387","wikidata":"https://www.wikidata.org/wiki/Q875399","display_name":"Boundary (topology)","level":2,"score":0.48793575167655945},{"id":"https://openalex.org/C57879066","wikidata":"https://www.wikidata.org/wiki/Q41217","display_name":"Mechanics","level":1,"score":0.41653379797935486},{"id":"https://openalex.org/C48044578","wikidata":"https://www.wikidata.org/wiki/Q727490","display_name":"Scalability","level":2,"score":0.4105771780014038},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.39291927218437195},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.2482205033302307},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.225692480802536},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.2060142457485199},{"id":"https://openalex.org/C134306372","wikidata":"https://www.wikidata.org/wiki/Q7754","display_name":"Mathematical analysis","level":1,"score":0.1985437273979187},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.19794514775276184},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.1495549976825714},{"id":"https://openalex.org/C41895202","wikidata":"https://www.wikidata.org/wiki/Q8162","display_name":"Linguistics","level":1,"score":0.0},{"id":"https://openalex.org/C138885662","wikidata":"https://www.wikidata.org/wiki/Q5891","display_name":"Philosophy","level":0,"score":0.0},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C77088390","wikidata":"https://www.wikidata.org/wiki/Q8513","display_name":"Database","level":1,"score":0.0}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iccad51958.2021.9643570","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad51958.2021.9643570","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2021 IEEE/ACM International Conference On Computer Aided Design (ICCAD)","raw_type":"proceedings-article"},{"id":"pmh:oai:ir.lib.uth.gr:11615/70372","is_oa":false,"landing_page_url":"http://hdl.handle.net/11615/70372","pdf_url":null,"source":{"id":"https://openalex.org/S4306400243","display_name":"University of Thessaly Institutional Repository (University of Thessaly)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I145722265","host_organization_name":"University of Thessaly","host_organization_lineage":["https://openalex.org/I145722265"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":"IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD","raw_type":"conferenceItem"}],"best_oa_location":null,"sustainable_development_goals":[{"score":0.4000000059604645,"display_name":"Decent work and economic growth","id":"https://metadata.un.org/sdg/8"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":22,"referenced_works":["https://openalex.org/W1975354237","https://openalex.org/W1990215011","https://openalex.org/W1997860465","https://openalex.org/W2044608342","https://openalex.org/W2053008534","https://openalex.org/W2064477270","https://openalex.org/W2077036969","https://openalex.org/W2081786181","https://openalex.org/W2083090974","https://openalex.org/W2123446492","https://openalex.org/W2159543178","https://openalex.org/W2167456552","https://openalex.org/W2343272038","https://openalex.org/W2394569310","https://openalex.org/W2587645287","https://openalex.org/W2753722292","https://openalex.org/W2791362638","https://openalex.org/W3005862711","https://openalex.org/W3013474731","https://openalex.org/W3211922296","https://openalex.org/W4245316435","https://openalex.org/W4292095448"],"related_works":["https://openalex.org/W2004615523","https://openalex.org/W2055638565","https://openalex.org/W2138118262","https://openalex.org/W2542708587","https://openalex.org/W4229007131","https://openalex.org/W2364197307","https://openalex.org/W4381800218","https://openalex.org/W2034853009","https://openalex.org/W2381557379","https://openalex.org/W2128384320"],"abstract_inverted_index":{"Traditional":[0],"methods":[1,31],"that":[2,62],"test":[3],"for":[4,83,91,110],"electromigration":[5],"(EM)":[6],"failure":[7],"in":[8,73],"multisegment":[9,76],"interconnects,":[10],"over":[11,47],"the":[12,20,23,53,69,105,128],"lifespan":[13],"of":[14,22,56,59,87,96,108,114],"an":[15],"IC,":[16],"are":[17,37],"based":[18],"on":[19,139],"use":[21],"Blech":[24],"criterion,":[25],"followed":[26],"by":[27],"Black's":[28],"equation.":[29],"Such":[30],"analyze":[32],"each":[33],"segment":[34],"independently,":[35],"but":[36],"well":[38,133],"known":[39],"to":[40,44,68,103,121],"be":[41,101],"inaccurate":[42],"due":[43],"stress":[45,60,71,90],"buildup":[46],"multiple":[48],"segments.":[49],"This":[50,78],"paper":[51],"introduces":[52],"new":[54],"concept":[55],"boundary":[57],"reflections":[58],"flow":[61],"ascribes":[63],"a":[64,74,81],"physical":[65],"(wave-like)":[66],"interpretation":[67],"transient":[70,88],"behavior":[72],"finite":[75],"line.":[77],"can":[79,99],"provide":[80],"framework":[82],"deriving":[84],"analytical":[85],"expressions":[86],"EM":[89],"lines":[92],"with":[93],"any":[94,111],"number":[95,107],"segments,":[97],"which":[98],"also":[100],"tailored":[102],"include":[104],"appropriate":[106],"terms":[109],"desired":[112],"level":[113],"accuracy.":[115],"The":[116],"proposed":[117],"method":[118],"is":[119],"shown":[120],"have":[122],"excellent":[123],"accuracy,":[124],"through":[125,136],"evaluations":[126],"against":[127],"FEM":[129],"solver":[130],"COMSOL,":[131],"as":[132,134],"scalability,":[135],"its":[137],"application":[138],"large":[140],"power":[141],"grid":[142],"benchmarks.":[143]},"counts_by_year":[{"year":2026,"cited_by_count":1},{"year":2025,"cited_by_count":9},{"year":2024,"cited_by_count":3},{"year":2023,"cited_by_count":10},{"year":2022,"cited_by_count":5}],"updated_date":"2026-07-28T07:46:37.118299","created_date":"2021-12-31T00:00:00"}