{"id":"https://openalex.org/W2997514656","doi":"https://doi.org/10.1109/iccad45719.2019.8942141","title":"Power Grid Fixing for Electromigration-induced Voltage Failures","display_name":"Power Grid Fixing for Electromigration-induced Voltage Failures","publication_year":2019,"publication_date":"2019-11-01","ids":{"openalex":"https://openalex.org/W2997514656","doi":"https://doi.org/10.1109/iccad45719.2019.8942141","mag":"2997514656"},"language":"en","primary_location":{"id":"doi:10.1109/iccad45719.2019.8942141","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad45719.2019.8942141","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5020073296","display_name":"Zahi Moudallal","orcid":"https://orcid.org/0000-0002-7920-3534"},"institutions":[{"id":"https://openalex.org/I185261750","display_name":"University of Toronto","ror":"https://ror.org/03dbr7087","country_code":"CA","type":"education","lineage":["https://openalex.org/I185261750"]}],"countries":["CA"],"is_corresponding":true,"raw_author_name":"Zahi Moudallal","raw_affiliation_strings":["University of Toronto, Toronto, Canada"],"affiliations":[{"raw_affiliation_string":"University of Toronto, Toronto, Canada","institution_ids":["https://openalex.org/I185261750"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5021627904","display_name":"Valeriy Sukharev","orcid":"https://orcid.org/0000-0002-5647-0584"},"institutions":[{"id":"https://openalex.org/I4210156212","display_name":"Mentor Technologies","ror":"https://ror.org/05vewsj04","country_code":"US","type":"other","lineage":["https://openalex.org/I4210156212"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Valeriy Sukharev","raw_affiliation_strings":["Mentor Graphics Corporation, Fremont, USA"],"affiliations":[{"raw_affiliation_string":"Mentor Graphics Corporation, Fremont, USA","institution_ids":["https://openalex.org/I4210156212"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5089881278","display_name":"Farid N. Najm","orcid":"https://orcid.org/0000-0001-5393-7794"},"institutions":[{"id":"https://openalex.org/I185261750","display_name":"University of Toronto","ror":"https://ror.org/03dbr7087","country_code":"CA","type":"education","lineage":["https://openalex.org/I185261750"]}],"countries":["CA"],"is_corresponding":false,"raw_author_name":"Farid N. Najm","raw_affiliation_strings":["University of Toronto, Toronto, Canada"],"affiliations":[{"raw_affiliation_string":"University of Toronto, Toronto, Canada","institution_ids":["https://openalex.org/I185261750"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":3,"corresponding_author_ids":["https://openalex.org/A5020073296"],"corresponding_institution_ids":["https://openalex.org/I185261750"],"apc_list":null,"apc_paid":null,"fwci":0.2926,"has_fulltext":false,"cited_by_count":9,"citation_normalized_percentile":{"value":0.49393605,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":90,"max":96},"biblio":{"volume":null,"issue":null,"first_page":"1","last_page":"8"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11661","display_name":"Copper Interconnects and Reliability","score":0.9998000264167786,"subfield":{"id":"https://openalex.org/subfields/2504","display_name":"Electronic, Optical and Magnetic Materials"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11444","display_name":"Electromagnetic Compatibility and Noise Suppression","score":0.9991999864578247,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10363","display_name":"Low-power high-performance VLSI design","score":0.9986000061035156,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/electromigration","display_name":"Electromigration","score":0.9410024881362915},{"id":"https://openalex.org/keywords/grid","display_name":"Grid","score":0.6838414669036865},{"id":"https://openalex.org/keywords/reliability","display_name":"Reliability (semiconductor)","score":0.6293411254882812},{"id":"https://openalex.org/keywords/voltage-drop","display_name":"Voltage drop","score":0.6187525391578674},{"id":"https://openalex.org/keywords/reliability-engineering","display_name":"Reliability engineering","score":0.5731770992279053},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.535380482673645},{"id":"https://openalex.org/keywords/power-grid","display_name":"Power grid","score":0.5337181091308594},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.5147259831428528},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4737815856933594},{"id":"https://openalex.org/keywords/power-network-design","display_name":"Power network design","score":0.45881208777427673},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.4502972960472107},{"id":"https://openalex.org/keywords/interconnection","display_name":"Interconnection","score":0.450114369392395},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.410381019115448},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.39665457606315613},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2415938675403595},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.0839071273803711}],"concepts":[{"id":"https://openalex.org/C138055206","wikidata":"https://www.wikidata.org/wiki/Q1319010","display_name":"Electromigration","level":2,"score":0.9410024881362915},{"id":"https://openalex.org/C187691185","wikidata":"https://www.wikidata.org/wiki/Q2020720","display_name":"Grid","level":2,"score":0.6838414669036865},{"id":"https://openalex.org/C43214815","wikidata":"https://www.wikidata.org/wiki/Q7310987","display_name":"Reliability (semiconductor)","level":3,"score":0.6293411254882812},{"id":"https://openalex.org/C82178898","wikidata":"https://www.wikidata.org/wiki/Q166839","display_name":"Voltage drop","level":3,"score":0.6187525391578674},{"id":"https://openalex.org/C200601418","wikidata":"https://www.wikidata.org/wiki/Q2193887","display_name":"Reliability engineering","level":1,"score":0.5731770992279053},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.535380482673645},{"id":"https://openalex.org/C2983254600","wikidata":"https://www.wikidata.org/wiki/Q1096907","display_name":"Power grid","level":3,"score":0.5337181091308594},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.5147259831428528},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4737815856933594},{"id":"https://openalex.org/C164565468","wikidata":"https://www.wikidata.org/wiki/Q7236535","display_name":"Power network design","level":3,"score":0.45881208777427673},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.4502972960472107},{"id":"https://openalex.org/C123745756","wikidata":"https://www.wikidata.org/wiki/Q1665949","display_name":"Interconnection","level":2,"score":0.450114369392395},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.410381019115448},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.39665457606315613},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2415938675403595},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.0839071273803711},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.0},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad45719.2019.8942141","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad45719.2019.8942141","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":23,"referenced_works":["https://openalex.org/W1990215011","https://openalex.org/W2033241763","https://openalex.org/W2053737126","https://openalex.org/W2064817422","https://openalex.org/W2068484625","https://openalex.org/W2081786181","https://openalex.org/W2089024363","https://openalex.org/W2110207912","https://openalex.org/W2121496311","https://openalex.org/W2124352222","https://openalex.org/W2135277685","https://openalex.org/W2149365825","https://openalex.org/W2165823161","https://openalex.org/W2432517183","https://openalex.org/W2443947004","https://openalex.org/W2478040551","https://openalex.org/W2587645287","https://openalex.org/W2766363448","https://openalex.org/W2775814534","https://openalex.org/W3149694916","https://openalex.org/W3195605052","https://openalex.org/W4233161328","https://openalex.org/W4240059038"],"related_works":["https://openalex.org/W2136403807","https://openalex.org/W796810817","https://openalex.org/W2108172432","https://openalex.org/W2893455498","https://openalex.org/W2119232911","https://openalex.org/W121910558","https://openalex.org/W4255681223","https://openalex.org/W1987230547","https://openalex.org/W653153512","https://openalex.org/W3215613000"],"abstract_inverted_index":{"Electromigration":[0],"(EM)":[1],"is":[2],"a":[3,79,90],"major":[4],"reliability":[5],"concern":[6],"in":[7,11,51,68,98],"chip":[8],"power":[9],"grids":[10],"the":[12,30,40,45,56,84,102],"wake":[13],"of":[14,20,58,70,101],"smaller":[15],"feature":[16],"sizes.":[17],"EM":[18,74],"degradation":[19],"grid":[21,46,85],"metal":[22,86,99],"lines":[23,87],"can":[24],"cause":[25],"large":[26],"voltage":[27,61],"drops":[28],"on":[29],"grid,":[31],"leading":[32],"to":[33,44,53,88],"timing":[34],"failures":[35],"and":[36],"logic":[37],"errors.":[38],"During":[39],"design":[41,47,91],"process,":[42],"modifications":[43],"may":[48],"be":[49],"required":[50],"order":[52],"protect":[54],"from":[55],"risk":[57],"such":[59],"EM-induced":[60],"drop":[62],"failures.":[63],"We":[64,77],"consider":[65],"this":[66],"problem":[67],"light":[69],"recent":[71],"efficient":[72],"full-chip":[73],"assessment":[75],"techniques.":[76],"present":[78],"systematic":[80],"approach":[81],"that":[82],"resizes":[83],"meet":[89],"target":[92],"lifetime":[93],"while":[94],"requiring":[95],"minimal":[96],"increase":[97],"area":[100],"grid.":[103]},"counts_by_year":[{"year":2025,"cited_by_count":2},{"year":2024,"cited_by_count":1},{"year":2023,"cited_by_count":2},{"year":2022,"cited_by_count":2},{"year":2020,"cited_by_count":2}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}