{"id":"https://openalex.org/W4237278439","doi":"https://doi.org/10.1109/iccad.2014.7001435","title":"Opportunistic through-silicon-via inductor utilization in LC resonant clocks: Concept and algorithms","display_name":"Opportunistic through-silicon-via inductor utilization in LC resonant clocks: Concept and algorithms","publication_year":2014,"publication_date":"2014-11-01","ids":{"openalex":"https://openalex.org/W4237278439","doi":"https://doi.org/10.1109/iccad.2014.7001435"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2014.7001435","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2014.7001435","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"conference-paper","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5076972812","display_name":"Umamaheswara Rao Tida","orcid":"https://orcid.org/0000-0002-9724-1585"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Umamaheswara Rao Tida","raw_affiliation_strings":["Missouri S&T, Rolla, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Missouri S&T, Rolla, MO","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5075201137","display_name":"Varun Mittapalli","orcid":null},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Varun Mittapalli","raw_affiliation_strings":["Missouri S&T, Rolla, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Missouri S&T, Rolla, MO","institution_ids":["https://openalex.org/I20382870"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054211420","display_name":"Cheng Zhuo","orcid":"https://orcid.org/0000-0002-2610-7522"},"institutions":[{"id":"https://openalex.org/I1343180700","display_name":"Intel (United States)","ror":"https://ror.org/01ek73717","country_code":"US","type":"company","lineage":["https://openalex.org/I1343180700"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Cheng Zhuo","raw_affiliation_strings":["Intel Corporation, Hillsboro, OR"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Intel Corporation, Hillsboro, OR","institution_ids":["https://openalex.org/I1343180700"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5000141831","display_name":"Yiyu Shi","orcid":"https://orcid.org/0000-0002-6788-9823"},"institutions":[{"id":"https://openalex.org/I20382870","display_name":"Missouri University of Science and Technology","ror":"https://ror.org/00scwqd12","country_code":"US","type":"education","lineage":["https://openalex.org/I20382870"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yiyu Shi","raw_affiliation_strings":["Missouri S&T, Rolla, MO"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Missouri S&T, Rolla, MO","institution_ids":["https://openalex.org/I20382870"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":2,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":2.4474,"has_fulltext":false,"cited_by_count":12,"citation_normalized_percentile":{"value":0.90393288,"is_in_top_1_percent":false,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":89,"max":98},"biblio":{"volume":null,"issue":null,"first_page":"750","last_page":"757"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10187","display_name":"Radio Frequency Integrated Circuit Design","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10472","display_name":"Semiconductor materials and devices","score":0.9984999895095825,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/inductor","display_name":"Inductor","score":0.9161474704742432},{"id":"https://openalex.org/keywords/inductance","display_name":"Inductance","score":0.6809530258178711},{"id":"https://openalex.org/keywords/through-silicon-via","display_name":"Through-silicon via","score":0.5920254588127136},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5413361191749573},{"id":"https://openalex.org/keywords/footprint","display_name":"Footprint","score":0.4882388412952423},{"id":"https://openalex.org/keywords/power","display_name":"Power (physics)","score":0.44507113099098206},{"id":"https://openalex.org/keywords/idle","display_name":"Idle","score":0.4430393576622009},{"id":"https://openalex.org/keywords/q-factor","display_name":"Q factor","score":0.44057080149650574},{"id":"https://openalex.org/keywords/system-on-a-chip","display_name":"System on a chip","score":0.41589516401290894},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4124975800514221},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.411774605512619},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.3582524359226227},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.1824648082256317},{"id":"https://openalex.org/keywords/resonator","display_name":"Resonator","score":0.09101969003677368},{"id":"https://openalex.org/keywords/physics","display_name":"Physics","score":0.08436697721481323}],"concepts":[{"id":"https://openalex.org/C144534570","wikidata":"https://www.wikidata.org/wiki/Q5325","display_name":"Inductor","level":3,"score":0.9161474704742432},{"id":"https://openalex.org/C29210110","wikidata":"https://www.wikidata.org/wiki/Q177897","display_name":"Inductance","level":3,"score":0.6809530258178711},{"id":"https://openalex.org/C45632049","wikidata":"https://www.wikidata.org/wiki/Q1578120","display_name":"Through-silicon via","level":3,"score":0.5920254588127136},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5413361191749573},{"id":"https://openalex.org/C132943942","wikidata":"https://www.wikidata.org/wiki/Q2562511","display_name":"Footprint","level":2,"score":0.4882388412952423},{"id":"https://openalex.org/C163258240","wikidata":"https://www.wikidata.org/wiki/Q25342","display_name":"Power (physics)","level":2,"score":0.44507113099098206},{"id":"https://openalex.org/C16320812","wikidata":"https://www.wikidata.org/wiki/Q1812200","display_name":"Idle","level":2,"score":0.4430393576622009},{"id":"https://openalex.org/C187725362","wikidata":"https://www.wikidata.org/wiki/Q830521","display_name":"Q factor","level":3,"score":0.44057080149650574},{"id":"https://openalex.org/C118021083","wikidata":"https://www.wikidata.org/wiki/Q610398","display_name":"System on a chip","level":2,"score":0.41589516401290894},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4124975800514221},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.411774605512619},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.3582524359226227},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.1824648082256317},{"id":"https://openalex.org/C97126364","wikidata":"https://www.wikidata.org/wiki/Q349669","display_name":"Resonator","level":2,"score":0.09101969003677368},{"id":"https://openalex.org/C121332964","wikidata":"https://www.wikidata.org/wiki/Q413","display_name":"Physics","level":0,"score":0.08436697721481323},{"id":"https://openalex.org/C160671074","wikidata":"https://www.wikidata.org/wiki/Q267131","display_name":"Wafer","level":2,"score":0.0},{"id":"https://openalex.org/C86803240","wikidata":"https://www.wikidata.org/wiki/Q420","display_name":"Biology","level":0,"score":0.0},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C62520636","wikidata":"https://www.wikidata.org/wiki/Q944","display_name":"Quantum mechanics","level":1,"score":0.0},{"id":"https://openalex.org/C151730666","wikidata":"https://www.wikidata.org/wiki/Q7205","display_name":"Paleontology","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad.2014.7001435","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2014.7001435","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/7","display_name":"Affordable and clean energy","score":0.6899999976158142}],"awards":[],"funders":[{"id":"https://openalex.org/F4320306076","display_name":"National Science Foundation","ror":"https://ror.org/021nxhr62"}],"has_content":{"grobid_xml":false,"pdf":false},"content_urls":null,"referenced_works_count":26,"referenced_works":["https://openalex.org/W119718657","https://openalex.org/W1505272351","https://openalex.org/W1508592555","https://openalex.org/W1969483737","https://openalex.org/W1976151090","https://openalex.org/W1984845646","https://openalex.org/W1988317026","https://openalex.org/W2040730190","https://openalex.org/W2064892872","https://openalex.org/W2091487568","https://openalex.org/W2093033932","https://openalex.org/W2122724421","https://openalex.org/W2127545620","https://openalex.org/W2128748528","https://openalex.org/W2149033245","https://openalex.org/W2154913690","https://openalex.org/W2162484909","https://openalex.org/W2169287990","https://openalex.org/W3140078554","https://openalex.org/W3146779744","https://openalex.org/W3151257572","https://openalex.org/W4246862233","https://openalex.org/W6604903304","https://openalex.org/W6660599920","https://openalex.org/W6666591276","https://openalex.org/W6673711270"],"related_works":["https://openalex.org/W2974485871","https://openalex.org/W1577119738","https://openalex.org/W2908872315","https://openalex.org/W1600399803","https://openalex.org/W4235210722","https://openalex.org/W4388633481","https://openalex.org/W2994960476","https://openalex.org/W2049601620","https://openalex.org/W2070778588","https://openalex.org/W2796721958"],"abstract_inverted_index":{"LC":[0,66,135],"resonant":[1,67,136,171,231],"clock":[2,11,137,172],"is":[3,22,87,220],"an":[4],"attracting":[5],"option":[6],"for":[7,62,141,210],"low":[8],"power":[9,143,194],"on-chip":[10],"distribution":[12],"designs.":[13],"However,":[14,69],"a":[15,123,151,161],"major":[16],"limiting":[17],"factor":[18],"to":[19,28,71,126,131,154,189,225,229],"its":[20,94],"implementation":[21],"the":[23,29,34,63,72,76,81,84,90,147,169,184,192,213,216,221,230],"large":[24],"area":[25],"overhead":[26],"due":[27,70],"conventional":[30,170],"spiral":[31,175],"inductors.":[32],"On":[33],"other":[35],"hand,":[36],"idle":[37,79,129,204],"through-silicon-vias":[38],"(TSVs)":[39],"in":[40,106,134],"three-dimensional":[41],"integrated":[42],"circuits":[43],"(3D":[44],"ICs)":[45],"can":[46,104,182],"form":[47,132],"vertical":[48],"inductors":[49,103,133,181,199,228],"with":[50,57,109,168,179,191],"minimal":[51],"footprint":[52,186],"and":[53,97,149],"little":[54],"noise":[55],"coupling":[56,116],"horizontal":[58],"traces,":[59],"particularly":[60],"suitable":[61],"application":[64],"of":[65,78,83,93,138,215],"clock.":[68],"strict":[73],"constraints":[74],"on":[75,160],"location":[77],"TSVs,":[80],"use":[82,128],"TSV":[85,102,180,198,227],"inductor":[86,185],"limited":[88],"by":[89,187,202],"constrained":[91],"choices":[92],"location,":[95],"inductance":[96],"quality":[98],"factor.":[99],"Moreover,":[100],"these":[101,197],"be":[105],"any":[107,110],"orientation":[108],"distance":[111],"apart,":[112],"thereby":[113],"causing":[114],"complicated":[115],"effects.":[117],"In":[118],"this":[119,219],"paper,":[120],"we":[121],"present":[122],"novel":[124],"scheme":[125,178],"opportunistically":[127],"TSVs":[130,205],"3D":[139],"ICs":[140],"maximum":[142],"reduction.":[144],"We":[145],"formulate":[146],"problem":[148],"devise":[150],"greedy":[152],"algorithm":[153],"efficiently":[155],"solve":[156],"it.":[157],"Experimental":[158],"results":[159],"few":[162],"industrial":[163],"designs":[164,173],"show":[165],"that":[166],"compared":[167],"using":[174],"inductors,":[176],"our":[177],"reduce":[183],"up":[188],"6.30x":[190],"same":[193],"consumption.":[195],"Especially":[196],"are":[200],"formed":[201],"existing":[203],"so":[206],"they":[207],"essentially":[208],"come":[209],"free.":[211],"To":[212],"best":[214],"authors'":[217],"knowledge,":[218],"very":[222],"first":[223],"work":[224],"apply":[226],"CDN.":[232]},"counts_by_year":[{"year":2024,"cited_by_count":1},{"year":2020,"cited_by_count":3},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":1},{"year":2017,"cited_by_count":1},{"year":2016,"cited_by_count":4},{"year":2014,"cited_by_count":1}],"updated_date":"2026-07-29T14:22:42.915294","created_date":"2025-10-10T00:00:00"}