{"id":"https://openalex.org/W4229786264","doi":"https://doi.org/10.1109/iccad.2013.6691198","title":"Dynamic bandwidth scaling for embedded DSPs with 3D-stacked DRAM and wide I/Os","display_name":"Dynamic bandwidth scaling for embedded DSPs with 3D-stacked DRAM and wide I/Os","publication_year":2013,"publication_date":"2013-11-01","ids":{"openalex":"https://openalex.org/W4229786264","doi":"https://doi.org/10.1109/iccad.2013.6691198"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2013.6691198","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2013.6691198","pdf_url":null,"source":{"id":"https://openalex.org/S4363608415","display_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5088178230","display_name":"Daniel W. Chang","orcid":null},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Daniel W. Chang","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5091134994","display_name":"Young Hoon Son","orcid":"https://orcid.org/0000-0002-6230-5067"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Young Hoon Son","raw_affiliation_strings":["Department of Computer Science and Engineering, Seoul National University, Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Seoul National University, Seoul, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5078262826","display_name":"Jung Ho Ahn","orcid":"https://orcid.org/0000-0003-1733-1394"},"institutions":[],"countries":[],"is_corresponding":false,"raw_author_name":"Jung Ho Ahn","raw_affiliation_strings":["Department of Computer Science and Engineering, Seoul National University, Seoul, South Korea"],"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Seoul National University, Seoul, South Korea","institution_ids":[]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100670375","display_name":"Ho\u2010Young Kim","orcid":"https://orcid.org/0000-0002-6813-2398"},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Hoyoung Kim","raw_affiliation_strings":["Samsung Advanced Institute of Technology, Samsung Electronics Company, Yongin, Kyunggi, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Advanced Institute of Technology, Samsung Electronics Company, Yongin, Kyunggi, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5102224976","display_name":"Minwook Ahn","orcid":null},"institutions":[{"id":"https://openalex.org/I2250650973","display_name":"Samsung (South Korea)","ror":"https://ror.org/04w3jy968","country_code":"KR","type":"company","lineage":["https://openalex.org/I2250650973"]}],"countries":["KR"],"is_corresponding":false,"raw_author_name":"Minwook Ahn","raw_affiliation_strings":["Samsung Advanced Institute of Technology, Samsung Electronics Company, Yongin, Kyunggi, South Korea"],"affiliations":[{"raw_affiliation_string":"Samsung Advanced Institute of Technology, Samsung Electronics Company, Yongin, Kyunggi, South Korea","institution_ids":["https://openalex.org/I2250650973"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5103196891","display_name":"Michael Schulte","orcid":"https://orcid.org/0000-0003-1305-406X"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Michael J. Schulte","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5037648751","display_name":"Nam Sung Kim","orcid":"https://orcid.org/0000-0002-0442-5634"},"institutions":[{"id":"https://openalex.org/I135310074","display_name":"University of Wisconsin\u2013Madison","ror":"https://ror.org/01y2jtd41","country_code":"US","type":"education","lineage":["https://openalex.org/I135310074"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Nam Sung Kim","raw_affiliation_strings":["Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA"],"affiliations":[{"raw_affiliation_string":"Department of Electrical and Computer Engineering, University of Wisconsin \u2013 Madison, Madison, WI, USA","institution_ids":["https://openalex.org/I135310074"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5088178230"],"corresponding_institution_ids":["https://openalex.org/I135310074"],"apc_list":null,"apc_paid":null,"fwci":1.20302514,"has_fulltext":false,"cited_by_count":2,"citation_normalized_percentile":{"value":0.80775717,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":94},"biblio":{"volume":"3602","issue":null,"first_page":"747","last_page":"754"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":0.9987999796867371,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10054","display_name":"Parallel Computing and Optimization Techniques","score":0.9980000257492065,"subfield":{"id":"https://openalex.org/subfields/1708","display_name":"Hardware and Architecture"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9968000054359436,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/dram","display_name":"Dram","score":0.8582530617713928},{"id":"https://openalex.org/keywords/memory-controller","display_name":"Memory controller","score":0.803656280040741},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.7301183342933655},{"id":"https://openalex.org/keywords/cas-latency","display_name":"CAS latency","score":0.6156675219535828},{"id":"https://openalex.org/keywords/memory-bandwidth","display_name":"Memory bandwidth","score":0.5997516512870789},{"id":"https://openalex.org/keywords/registered-memory","display_name":"Registered memory","score":0.587226927280426},{"id":"https://openalex.org/keywords/embedded-system","display_name":"Embedded system","score":0.583702802658081},{"id":"https://openalex.org/keywords/latency","display_name":"Latency (audio)","score":0.5225000977516174},{"id":"https://openalex.org/keywords/interleaved-memory","display_name":"Interleaved memory","score":0.5176016092300415},{"id":"https://openalex.org/keywords/bandwidth","display_name":"Bandwidth (computing)","score":0.5120697617530823},{"id":"https://openalex.org/keywords/energy-consumption","display_name":"Energy consumption","score":0.46975257992744446},{"id":"https://openalex.org/keywords/dynamic-random-access-memory","display_name":"Dynamic random-access memory","score":0.4600105285644531},{"id":"https://openalex.org/keywords/static-random-access-memory","display_name":"Static random-access memory","score":0.4400368332862854},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.43518713116645813},{"id":"https://openalex.org/keywords/semiconductor-memory","display_name":"Semiconductor memory","score":0.39704084396362305},{"id":"https://openalex.org/keywords/memory-management","display_name":"Memory management","score":0.2865496873855591},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11983376741409302},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.1169891357421875},{"id":"https://openalex.org/keywords/computer-network","display_name":"Computer network","score":0.07206341624259949},{"id":"https://openalex.org/keywords/telecommunications","display_name":"Telecommunications","score":0.06490138173103333}],"concepts":[{"id":"https://openalex.org/C7366592","wikidata":"https://www.wikidata.org/wiki/Q1255620","display_name":"Dram","level":2,"score":0.8582530617713928},{"id":"https://openalex.org/C100800780","wikidata":"https://www.wikidata.org/wiki/Q1175867","display_name":"Memory controller","level":3,"score":0.803656280040741},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.7301183342933655},{"id":"https://openalex.org/C189930140","wikidata":"https://www.wikidata.org/wiki/Q1112878","display_name":"CAS latency","level":4,"score":0.6156675219535828},{"id":"https://openalex.org/C188045654","wikidata":"https://www.wikidata.org/wiki/Q17148339","display_name":"Memory bandwidth","level":2,"score":0.5997516512870789},{"id":"https://openalex.org/C93446704","wikidata":"https://www.wikidata.org/wiki/Q449328","display_name":"Registered memory","level":3,"score":0.587226927280426},{"id":"https://openalex.org/C149635348","wikidata":"https://www.wikidata.org/wiki/Q193040","display_name":"Embedded system","level":1,"score":0.583702802658081},{"id":"https://openalex.org/C82876162","wikidata":"https://www.wikidata.org/wiki/Q17096504","display_name":"Latency (audio)","level":2,"score":0.5225000977516174},{"id":"https://openalex.org/C63511323","wikidata":"https://www.wikidata.org/wiki/Q908936","display_name":"Interleaved memory","level":4,"score":0.5176016092300415},{"id":"https://openalex.org/C2776257435","wikidata":"https://www.wikidata.org/wiki/Q1576430","display_name":"Bandwidth (computing)","level":2,"score":0.5120697617530823},{"id":"https://openalex.org/C2780165032","wikidata":"https://www.wikidata.org/wiki/Q16869822","display_name":"Energy consumption","level":2,"score":0.46975257992744446},{"id":"https://openalex.org/C118702147","wikidata":"https://www.wikidata.org/wiki/Q189396","display_name":"Dynamic random-access memory","level":3,"score":0.4600105285644531},{"id":"https://openalex.org/C68043766","wikidata":"https://www.wikidata.org/wiki/Q267416","display_name":"Static random-access memory","level":2,"score":0.4400368332862854},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.43518713116645813},{"id":"https://openalex.org/C98986596","wikidata":"https://www.wikidata.org/wiki/Q1143031","display_name":"Semiconductor memory","level":2,"score":0.39704084396362305},{"id":"https://openalex.org/C176649486","wikidata":"https://www.wikidata.org/wiki/Q2308807","display_name":"Memory management","level":3,"score":0.2865496873855591},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11983376741409302},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.1169891357421875},{"id":"https://openalex.org/C31258907","wikidata":"https://www.wikidata.org/wiki/Q1301371","display_name":"Computer network","level":1,"score":0.07206341624259949},{"id":"https://openalex.org/C76155785","wikidata":"https://www.wikidata.org/wiki/Q418","display_name":"Telecommunications","level":1,"score":0.06490138173103333}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad.2013.6691198","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2013.6691198","pdf_url":null,"source":{"id":"https://openalex.org/S4363608415","display_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[{"display_name":"Affordable and clean energy","score":0.8999999761581421,"id":"https://metadata.un.org/sdg/7"}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":21,"referenced_works":["https://openalex.org/W1999136361","https://openalex.org/W2023264348","https://openalex.org/W2032512814","https://openalex.org/W2036853599","https://openalex.org/W2044206819","https://openalex.org/W2046574526","https://openalex.org/W2100516830","https://openalex.org/W2110895508","https://openalex.org/W2115172404","https://openalex.org/W2122636510","https://openalex.org/W2128351153","https://openalex.org/W2132511032","https://openalex.org/W2141736089","https://openalex.org/W2152958194","https://openalex.org/W2162639668","https://openalex.org/W3139689176","https://openalex.org/W4237150160","https://openalex.org/W4249006057","https://openalex.org/W6677264922","https://openalex.org/W6679697899","https://openalex.org/W6681089294"],"related_works":["https://openalex.org/W3008068282","https://openalex.org/W2185658074","https://openalex.org/W1725472669","https://openalex.org/W2769869222","https://openalex.org/W4285245242","https://openalex.org/W4243618206","https://openalex.org/W2019238062","https://openalex.org/W2138825797","https://openalex.org/W4389041023","https://openalex.org/W3049130895"],"abstract_inverted_index":{"3D":[0,58,76,88,118,128,162],"main":[1,27,41,59,77,119],"memory":[2,28,42,60,70,78,100,120,193],"is":[3,47,61,144],"an":[4,140,203],"emerging":[5],"technology":[6,24,90],"that":[7,22,53,126,143,161],"stacks":[8],"DRAM":[9,98,114,129,163],"dies":[10],"underneath":[11],"the":[12,45,54,97,105,113,135,196],"processor":[13,142],"die":[14],"using":[15],"through-silicon":[16],"vias":[17],"(TSVs).":[18],"Prior":[19],"studies":[20],"assumed":[21],"such":[23],"would":[25],"decrease":[26,117],"access":[29],"latency":[30,55,71,121],"by":[31,83,122,152,177,215,222],"45%":[32],"to":[33,39,99,112,146,156,181,190],"60%,":[34],"while":[35,217],"also":[36],"allowing":[37],"designers":[38],"increase":[40,134,168,212],"bandwidth.":[43],"Although":[44],"latter":[46],"true,":[48],"it":[49],"was":[50],"recently":[51],"shown":[52],"savings":[56],"of":[57,87,139,173],"only":[62,223],"6.3%.":[63],"In":[64],"this":[65],"paper,":[66],"we":[67,159,188],"first":[68],"analyze":[69],"reduction":[72],"opportunities":[73],"in":[74],"a":[75,147],"system":[79,170],"with":[80,130,164],"Wide":[81,131,165],"I/O":[82,132,185,197],"taking":[84],"better":[85],"advantage":[86],"integration":[89],"and":[91,103,108],"quantify":[92],"their":[93],"benefit.":[94],"Specifically,":[95],"redesigning":[96],"controller":[101],"synchronizers":[102],"placing":[104],"address,":[106],"command,":[107],"data":[109],"pads":[110],"closer":[111],"banks":[115],"can":[116,133,167],"24.7%.":[123],"We":[124],"show":[125],"current":[127],"geometric":[136],"mean":[137],"performance":[138,214],"embedded":[141,175],"similar":[145],"Texas":[148],"instrument":[149],"C67x":[150],"DSP":[151],"9.7%":[153],"(and":[154,179],"up":[155,180],"23.3%).":[157],"Second,":[158],"observe":[160],"IO":[166],"average":[169,213,219],"energy":[171,186,220],"consumption":[172,221],"energy-constrained":[174],"DSPs":[176],"2.6%":[178],"8.9%).":[182],"To":[183],"improve":[184],"efficiency,":[187],"propose":[189],"dynamically":[191],"scale":[192],"bandwidth":[194,209],"(i.e.":[195],"width)":[198],"at":[199],"runtime":[200],"based":[201],"on":[202],"application's":[204],"program":[205],"phases.":[206],"Our":[207],"dynamic":[208],"scaling":[210],"algorithms":[211],"6.6%":[216],"increasing":[218],"0.5%.":[224]},"counts_by_year":[{"year":2016,"cited_by_count":1},{"year":2014,"cited_by_count":1}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}