{"id":"https://openalex.org/W4248126276","doi":"https://doi.org/10.1109/iccad.2013.6691117","title":"Block copolymer directed self-assembly (DSA) aware contact layer optimization for 10 nm 1D standard cell library","display_name":"Block copolymer directed self-assembly (DSA) aware contact layer optimization for 10 nm 1D standard cell library","publication_year":2013,"publication_date":"2013-11-01","ids":{"openalex":"https://openalex.org/W4248126276","doi":"https://doi.org/10.1109/iccad.2013.6691117"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2013.6691117","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2013.6691117","pdf_url":null,"source":{"id":"https://openalex.org/S4363608415","display_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5069931478","display_name":"Yuelin Du","orcid":null},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":true,"raw_author_name":"Yuelin Du","raw_affiliation_strings":["Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5054282385","display_name":"Daifeng Guo","orcid":"https://orcid.org/0000-0003-4935-6609"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Daifeng Guo","raw_affiliation_strings":["Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5053378706","display_name":"Martin D. F. Wong","orcid":"https://orcid.org/0000-0001-8274-9688"},"institutions":[{"id":"https://openalex.org/I157725225","display_name":"University of Illinois Urbana-Champaign","ror":"https://ror.org/047426m28","country_code":"US","type":"education","lineage":["https://openalex.org/I157725225"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Martin D. F. Wong","raw_affiliation_strings":["Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign","institution_ids":["https://openalex.org/I157725225"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5024014942","display_name":"He Yi","orcid":null},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"He Yi","raw_affiliation_strings":["Dept. of Electrical Engineering, Stanford University"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engineering, Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5059975258","display_name":"H.\u2010S. Philip Wong","orcid":"https://orcid.org/0000-0002-0096-1472"},"institutions":[{"id":"https://openalex.org/I97018004","display_name":"Stanford University","ror":"https://ror.org/00f54p054","country_code":"US","type":"education","lineage":["https://openalex.org/I97018004"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"H.-S. Philip Wong","raw_affiliation_strings":["Dept. of Electrical Engineering, Stanford University"],"affiliations":[{"raw_affiliation_string":"Dept. of Electrical Engineering, Stanford University","institution_ids":["https://openalex.org/I97018004"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5100461088","display_name":"Hongbo Zhang","orcid":"https://orcid.org/0000-0002-1071-4416"},"institutions":[{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Hongbo Zhang","raw_affiliation_strings":["Synopsys Inc"],"affiliations":[{"raw_affiliation_string":"Synopsys Inc","institution_ids":["https://openalex.org/I1335490905"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100648942","display_name":"Qiang Ma","orcid":"https://orcid.org/0000-0002-7355-7251"},"institutions":[{"id":"https://openalex.org/I1335490905","display_name":"Synopsys (Switzerland)","ror":"https://ror.org/03mb54f81","country_code":"CH","type":"company","lineage":["https://openalex.org/I1335490905","https://openalex.org/I4210088951"]}],"countries":["CH"],"is_corresponding":false,"raw_author_name":"Qiang Ma","raw_affiliation_strings":["Synopsys Inc"],"affiliations":[{"raw_affiliation_string":"Synopsys Inc","institution_ids":["https://openalex.org/I1335490905"]}]}],"institutions":[],"countries_distinct_count":2,"institutions_distinct_count":7,"corresponding_author_ids":["https://openalex.org/A5069931478"],"corresponding_institution_ids":["https://openalex.org/I157725225"],"apc_list":null,"apc_paid":null,"fwci":32.673,"has_fulltext":false,"cited_by_count":40,"citation_normalized_percentile":{"value":0.99824561,"is_in_top_1_percent":true,"is_in_top_10_percent":true},"cited_by_percentile_year":{"min":90,"max":100},"biblio":{"volume":null,"issue":null,"first_page":"186","last_page":"193"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11471","display_name":"Block Copolymer Self-Assembly","score":0.9997000098228455,"subfield":{"id":"https://openalex.org/subfields/2505","display_name":"Materials Chemistry"},"field":{"id":"https://openalex.org/fields/25","display_name":"Materials Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11338","display_name":"Advancements in Photolithography Techniques","score":0.9983999729156494,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T11522","display_name":"VLSI and FPGA Design Techniques","score":0.9919999837875366,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/standard-cell","display_name":"Standard cell","score":0.6864309906959534},{"id":"https://openalex.org/keywords/template","display_name":"Template","score":0.6590414047241211},{"id":"https://openalex.org/keywords/design-for-manufacturability","display_name":"Design for manufacturability","score":0.6504956483840942},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.5828099250793457},{"id":"https://openalex.org/keywords/lithography","display_name":"Lithography","score":0.5757017135620117},{"id":"https://openalex.org/keywords/node","display_name":"Node (physics)","score":0.49545609951019287},{"id":"https://openalex.org/keywords/overlay","display_name":"Overlay","score":0.48687615990638733},{"id":"https://openalex.org/keywords/block","display_name":"Block (permutation group theory)","score":0.4358750283718109},{"id":"https://openalex.org/keywords/layer","display_name":"Layer (electronics)","score":0.41987839341163635},{"id":"https://openalex.org/keywords/integrated-circuit","display_name":"Integrated circuit","score":0.35471218824386597},{"id":"https://openalex.org/keywords/algorithm","display_name":"Algorithm","score":0.3379623293876648},{"id":"https://openalex.org/keywords/computer-hardware","display_name":"Computer hardware","score":0.337898313999176},{"id":"https://openalex.org/keywords/computer-architecture","display_name":"Computer architecture","score":0.33517783880233765},{"id":"https://openalex.org/keywords/nanotechnology","display_name":"Nanotechnology","score":0.3036511540412903},{"id":"https://openalex.org/keywords/materials-science","display_name":"Materials science","score":0.2982500195503235},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.16985991597175598},{"id":"https://openalex.org/keywords/optoelectronics","display_name":"Optoelectronics","score":0.1523650884628296},{"id":"https://openalex.org/keywords/mathematics","display_name":"Mathematics","score":0.13426080346107483},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.11613529920578003}],"concepts":[{"id":"https://openalex.org/C78401558","wikidata":"https://www.wikidata.org/wiki/Q464496","display_name":"Standard cell","level":3,"score":0.6864309906959534},{"id":"https://openalex.org/C82714645","wikidata":"https://www.wikidata.org/wiki/Q438331","display_name":"Template","level":2,"score":0.6590414047241211},{"id":"https://openalex.org/C62064638","wikidata":"https://www.wikidata.org/wiki/Q553878","display_name":"Design for manufacturability","level":2,"score":0.6504956483840942},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.5828099250793457},{"id":"https://openalex.org/C204223013","wikidata":"https://www.wikidata.org/wiki/Q133036","display_name":"Lithography","level":2,"score":0.5757017135620117},{"id":"https://openalex.org/C62611344","wikidata":"https://www.wikidata.org/wiki/Q1062658","display_name":"Node (physics)","level":2,"score":0.49545609951019287},{"id":"https://openalex.org/C136085584","wikidata":"https://www.wikidata.org/wiki/Q910289","display_name":"Overlay","level":2,"score":0.48687615990638733},{"id":"https://openalex.org/C2777210771","wikidata":"https://www.wikidata.org/wiki/Q4927124","display_name":"Block (permutation group theory)","level":2,"score":0.4358750283718109},{"id":"https://openalex.org/C2779227376","wikidata":"https://www.wikidata.org/wiki/Q6505497","display_name":"Layer (electronics)","level":2,"score":0.41987839341163635},{"id":"https://openalex.org/C530198007","wikidata":"https://www.wikidata.org/wiki/Q80831","display_name":"Integrated circuit","level":2,"score":0.35471218824386597},{"id":"https://openalex.org/C11413529","wikidata":"https://www.wikidata.org/wiki/Q8366","display_name":"Algorithm","level":1,"score":0.3379623293876648},{"id":"https://openalex.org/C9390403","wikidata":"https://www.wikidata.org/wiki/Q3966","display_name":"Computer hardware","level":1,"score":0.337898313999176},{"id":"https://openalex.org/C118524514","wikidata":"https://www.wikidata.org/wiki/Q173212","display_name":"Computer architecture","level":1,"score":0.33517783880233765},{"id":"https://openalex.org/C171250308","wikidata":"https://www.wikidata.org/wiki/Q11468","display_name":"Nanotechnology","level":1,"score":0.3036511540412903},{"id":"https://openalex.org/C192562407","wikidata":"https://www.wikidata.org/wiki/Q228736","display_name":"Materials science","level":0,"score":0.2982500195503235},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.16985991597175598},{"id":"https://openalex.org/C49040817","wikidata":"https://www.wikidata.org/wiki/Q193091","display_name":"Optoelectronics","level":1,"score":0.1523650884628296},{"id":"https://openalex.org/C33923547","wikidata":"https://www.wikidata.org/wiki/Q395","display_name":"Mathematics","level":0,"score":0.13426080346107483},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.11613529920578003},{"id":"https://openalex.org/C199360897","wikidata":"https://www.wikidata.org/wiki/Q9143","display_name":"Programming language","level":1,"score":0.0},{"id":"https://openalex.org/C2524010","wikidata":"https://www.wikidata.org/wiki/Q8087","display_name":"Geometry","level":1,"score":0.0},{"id":"https://openalex.org/C111919701","wikidata":"https://www.wikidata.org/wiki/Q9135","display_name":"Operating system","level":1,"score":0.0},{"id":"https://openalex.org/C66938386","wikidata":"https://www.wikidata.org/wiki/Q633538","display_name":"Structural engineering","level":1,"score":0.0}],"mesh":[],"locations_count":1,"locations":[{"id":"doi:10.1109/iccad.2013.6691117","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2013.6691117","pdf_url":null,"source":{"id":"https://openalex.org/S4363608415","display_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":null,"host_organization_name":null,"host_organization_lineage":[],"host_organization_lineage_names":[],"type":"conference"},"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"}],"best_oa_location":null,"sustainable_development_goals":[],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":25,"referenced_works":["https://openalex.org/W1964377386","https://openalex.org/W1970561026","https://openalex.org/W1976952362","https://openalex.org/W2009024939","https://openalex.org/W2011039300","https://openalex.org/W2025304056","https://openalex.org/W2032622168","https://openalex.org/W2039283346","https://openalex.org/W2039474083","https://openalex.org/W2039485707","https://openalex.org/W2042508550","https://openalex.org/W2042534689","https://openalex.org/W2049549750","https://openalex.org/W2051947005","https://openalex.org/W2058924583","https://openalex.org/W2068165923","https://openalex.org/W2071574315","https://openalex.org/W2078550705","https://openalex.org/W2092412394","https://openalex.org/W2143996311","https://openalex.org/W2153778369","https://openalex.org/W4251247564","https://openalex.org/W6642830240","https://openalex.org/W6657052564","https://openalex.org/W6661136939"],"related_works":["https://openalex.org/W1979360617","https://openalex.org/W2975406511","https://openalex.org/W2341392992","https://openalex.org/W2143750673","https://openalex.org/W2388589331","https://openalex.org/W2520621519","https://openalex.org/W2366713167","https://openalex.org/W2023781639","https://openalex.org/W2997716136","https://openalex.org/W3146205511"],"abstract_inverted_index":{"At":[0],"the":[1,6,31,55,90,107,112,137,144,158,185,192,199,212,216,258,277],"10":[2,151],"nm":[3,25,52,152],"technology":[4],"node,":[5],"contact":[7,81,146,193],"layers":[8],"of":[9,57,93,128,139,187,195,208,215],"integrated":[10],"circuits":[11],"(IC)":[12],"designs":[13],"are":[14],"too":[15],"dense":[16],"to":[17,88,117,226],"be":[18,118,202,227,241],"printed":[19],"by":[20,120,205],"single":[21],"exposure":[22],"using":[23],"193":[24],"immersion":[26],"(193i)":[27],"lithography.":[28,122],"Among":[29],"all":[30],"emerging":[32],"patterning":[33,78,104,130],"approaches,":[34],"block":[35,94],"copolymer":[36,95],"directed":[37],"self-assembly":[38],"(DSA)":[39],"is":[40,74,218,223,270],"a":[41,125,163,178,206,232,245,252],"promising":[42,272],"candidate":[43],"with":[44,244],"high":[45],"throughput":[46],"and":[47,96,131,211,229,275],"low":[48],"cost":[49,164,214],"for":[50,77,135,150,166],"sub-20":[51],"features.":[53],"Traditionally,":[54],"study":[56],"DSA":[58,100,103,129,168],"has":[59],"focused":[60],"on":[61,171],"achieving":[62],"periodic":[63],"regular":[64],"patterns":[65],"over":[66],"large":[67],"area.":[68],"Realizing":[69],"that":[70,191,256,267],"long":[71],"range":[72],"order":[73],"not":[75],"needed":[76],"irregularly":[79],"distributed":[80],"holes,":[82],"we":[83,161,182,250],"use":[84],"topographical":[85],"guiding":[86,113,209],"templates":[87,114,217],"alter":[89],"natural":[91],"symmetry":[92],"achieve":[97],"controlled":[98],"irregular":[99],"patterns.":[101],"However,":[102],"must":[105],"satisfy":[106],"overlay":[108,173],"accuracy":[109,174],"requirements":[110],"while":[111],"also":[115],"need":[116],"printable":[119],"conventional":[121],"This":[123,141,220],"presents":[124],"unique":[126],"opportunity":[127],"layout":[132],"design":[133],"co-optimization":[134],"improving":[136],"manufacturability":[138],"DSA.":[140],"paper":[142],"discusses":[143],"DSA-aware":[145],"layer":[147,194],"optimization":[148,221,279],"problem":[149,222,259],"1D":[153],"standard":[154,179],"cell":[155,180,197],"library.":[156],"For":[157],"first":[159,224],"time":[160],"propose":[162,251],"function":[165],"each":[167],"template":[169],"based":[170],"its":[172],"performance.":[175],"Then":[176,249],"given":[177],"library,":[181],"simultaneously":[183],"optimize":[184],"layouts":[186],"every":[188],"cell,":[189],"such":[190],"any":[196],"in":[198,273],"library":[200],"can":[201,240],"fully":[203],"patterned":[204],"set":[207],"templates,":[210],"total":[213],"minimal.":[219],"proved":[225],"NP-hard":[228],"formulated":[230],"as":[231],"Weighted":[233],"Partial":[234],"Maximum":[235],"Satisfiability":[236],"(MAXSAT)":[237],"problem,":[238],"which":[239],"optimally":[242],"solved":[243],"public":[246],"SAT":[247],"solver.":[248],"bounded":[253],"approximation":[254],"algorithm":[255],"solves":[257],"much":[260],"more":[261],"efficiently.":[262],"The":[263],"experimental":[264],"results":[265],"demonstrate":[266],"our":[268],"approach":[269],"remarkably":[271],"practice":[274],"validate":[276],"proposed":[278],"problem.":[280]},"counts_by_year":[{"year":2020,"cited_by_count":2},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":2},{"year":2017,"cited_by_count":14},{"year":2016,"cited_by_count":11},{"year":2015,"cited_by_count":7},{"year":2014,"cited_by_count":3}],"updated_date":"2025-11-06T03:46:38.306776","created_date":"2025-10-10T00:00:00"}