{"id":"https://openalex.org/W4253374773","doi":"https://doi.org/10.1109/iccad.2010.5653769","title":"Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip","display_name":"Evaluation of using inductive/capacitive-coupling vertical interconnects in 3D network-on-chip","publication_year":2010,"publication_date":"2010-11-01","ids":{"openalex":"https://openalex.org/W4253374773","doi":"https://doi.org/10.1109/iccad.2010.5653769"},"language":"en","primary_location":{"id":"doi:10.1109/iccad.2010.5653769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2010.5653769","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},"type":"article","indexed_in":["crossref"],"open_access":{"is_oa":false,"oa_status":"closed","oa_url":null,"any_repository_has_fulltext":false},"authorships":[{"author_position":"first","author":{"id":"https://openalex.org/A5103963648","display_name":"Jin Ouyang","orcid":null},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jin Ouyang","raw_affiliation_strings":["Department of Computer Science and Engineering, Pennsylvania State University, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Pennsylvania State University, USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5064910584","display_name":"Jing Xie","orcid":"https://orcid.org/0000-0003-4363-8744"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Jing Xie","raw_affiliation_strings":["Department of Computer Science and Engineering, Pennsylvania State University, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Pennsylvania State University, USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"middle","author":{"id":"https://openalex.org/A5042040286","display_name":"Matthew Poremba","orcid":"https://orcid.org/0000-0001-9399-9682"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Matthew Poremba","raw_affiliation_strings":["Department of Computer Science and Engineering, Pennsylvania State University, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Pennsylvania State University, USA","institution_ids":["https://openalex.org/I130769515"]}]},{"author_position":"last","author":{"id":"https://openalex.org/A5100385336","display_name":"Yuan Xie","orcid":"https://orcid.org/0000-0003-2093-1788"},"institutions":[{"id":"https://openalex.org/I130769515","display_name":"Pennsylvania State University","ror":"https://ror.org/04p491231","country_code":"US","type":"education","lineage":["https://openalex.org/I130769515"]}],"countries":["US"],"is_corresponding":false,"raw_author_name":"Yuan Xie","raw_affiliation_strings":["Department of Computer Science and Engineering, Pennsylvania State University, USA"],"raw_orcid":null,"affiliations":[{"raw_affiliation_string":"Department of Computer Science and Engineering, Pennsylvania State University, USA","institution_ids":["https://openalex.org/I130769515"]}]}],"institutions":[],"countries_distinct_count":1,"institutions_distinct_count":4,"corresponding_author_ids":[],"corresponding_institution_ids":[],"apc_list":null,"apc_paid":null,"fwci":1.177,"has_fulltext":false,"cited_by_count":18,"citation_normalized_percentile":{"value":0.82658009,"is_in_top_1_percent":false,"is_in_top_10_percent":false},"cited_by_percentile_year":{"min":89,"max":97},"biblio":{"volume":"7","issue":null,"first_page":"477","last_page":"482"},"is_retracted":false,"is_paratext":false,"is_xpac":false,"primary_topic":{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},"topics":[{"id":"https://openalex.org/T11527","display_name":"3D IC and TSV technologies","score":1.0,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10829","display_name":"Interconnection Networks and Systems","score":0.9995999932289124,"subfield":{"id":"https://openalex.org/subfields/1705","display_name":"Computer Networks and Communications"},"field":{"id":"https://openalex.org/fields/17","display_name":"Computer Science"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}},{"id":"https://openalex.org/T10502","display_name":"Advanced Memory and Neural Computing","score":0.9955999851226807,"subfield":{"id":"https://openalex.org/subfields/2208","display_name":"Electrical and Electronic Engineering"},"field":{"id":"https://openalex.org/fields/22","display_name":"Engineering"},"domain":{"id":"https://openalex.org/domains/3","display_name":"Physical Sciences"}}],"keywords":[{"id":"https://openalex.org/keywords/capacitive-sensing","display_name":"Capacitive sensing","score":0.6155706644058228},{"id":"https://openalex.org/keywords/capacitive-coupling","display_name":"Capacitive coupling","score":0.5483999848365784},{"id":"https://openalex.org/keywords/electronic-engineering","display_name":"Electronic engineering","score":0.5422403216362},{"id":"https://openalex.org/keywords/inductive-coupling","display_name":"Inductive coupling","score":0.5283870100975037},{"id":"https://openalex.org/keywords/transceiver","display_name":"Transceiver","score":0.4685543477535248},{"id":"https://openalex.org/keywords/chip","display_name":"Chip","score":0.4520801901817322},{"id":"https://openalex.org/keywords/computer-science","display_name":"Computer science","score":0.4398314654827118},{"id":"https://openalex.org/keywords/cmos","display_name":"CMOS","score":0.38776707649230957},{"id":"https://openalex.org/keywords/electrical-engineering","display_name":"Electrical engineering","score":0.34220778942108154},{"id":"https://openalex.org/keywords/engineering","display_name":"Engineering","score":0.2755173444747925},{"id":"https://openalex.org/keywords/voltage","display_name":"Voltage","score":0.1426883339881897}],"concepts":[{"id":"https://openalex.org/C206755178","wikidata":"https://www.wikidata.org/wiki/Q1131271","display_name":"Capacitive sensing","level":2,"score":0.6155706644058228},{"id":"https://openalex.org/C68278764","wikidata":"https://www.wikidata.org/wiki/Q444167","display_name":"Capacitive coupling","level":3,"score":0.5483999848365784},{"id":"https://openalex.org/C24326235","wikidata":"https://www.wikidata.org/wiki/Q126095","display_name":"Electronic engineering","level":1,"score":0.5422403216362},{"id":"https://openalex.org/C177872590","wikidata":"https://www.wikidata.org/wiki/Q1498289","display_name":"Inductive coupling","level":2,"score":0.5283870100975037},{"id":"https://openalex.org/C7720470","wikidata":"https://www.wikidata.org/wiki/Q954187","display_name":"Transceiver","level":3,"score":0.4685543477535248},{"id":"https://openalex.org/C165005293","wikidata":"https://www.wikidata.org/wiki/Q1074500","display_name":"Chip","level":2,"score":0.4520801901817322},{"id":"https://openalex.org/C41008148","wikidata":"https://www.wikidata.org/wiki/Q21198","display_name":"Computer science","level":0,"score":0.4398314654827118},{"id":"https://openalex.org/C46362747","wikidata":"https://www.wikidata.org/wiki/Q173431","display_name":"CMOS","level":2,"score":0.38776707649230957},{"id":"https://openalex.org/C119599485","wikidata":"https://www.wikidata.org/wiki/Q43035","display_name":"Electrical engineering","level":1,"score":0.34220778942108154},{"id":"https://openalex.org/C127413603","wikidata":"https://www.wikidata.org/wiki/Q11023","display_name":"Engineering","level":0,"score":0.2755173444747925},{"id":"https://openalex.org/C165801399","wikidata":"https://www.wikidata.org/wiki/Q25428","display_name":"Voltage","level":2,"score":0.1426883339881897}],"mesh":[],"locations_count":2,"locations":[{"id":"doi:10.1109/iccad.2010.5653769","is_oa":false,"landing_page_url":"https://doi.org/10.1109/iccad.2010.5653769","pdf_url":null,"source":null,"license":null,"license_id":null,"version":"publishedVersion","is_accepted":true,"is_published":true,"raw_source_name":"2010 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)","raw_type":"proceedings-article"},{"id":"pmh:oai:repository.hkust.edu.hk:1783.1-134299","is_oa":false,"landing_page_url":"https://repository.hkust.edu.hk/ir/Record/1783.1-134299","pdf_url":null,"source":{"id":"https://openalex.org/S4306401796","display_name":"Rare & Special e-Zone (The Hong Kong University of Science and Technology)","issn_l":null,"issn":null,"is_oa":false,"is_in_doaj":false,"is_core":false,"host_organization":"https://openalex.org/I200769079","host_organization_name":"Hong Kong University of Science and Technology","host_organization_lineage":["https://openalex.org/I200769079"],"host_organization_lineage_names":[],"type":"repository"},"license":null,"license_id":null,"version":"submittedVersion","is_accepted":false,"is_published":false,"raw_source_name":null,"raw_type":"Conference paper"}],"best_oa_location":null,"sustainable_development_goals":[{"id":"https://metadata.un.org/sdg/9","display_name":"Industry, innovation and infrastructure","score":0.4399999976158142}],"awards":[],"funders":[],"has_content":{"pdf":false,"grobid_xml":false},"content_urls":null,"referenced_works_count":15,"referenced_works":["https://openalex.org/W2025980530","https://openalex.org/W2041082417","https://openalex.org/W2055314364","https://openalex.org/W2125311920","https://openalex.org/W2150360289","https://openalex.org/W2168063067","https://openalex.org/W2169630534","https://openalex.org/W2170509098","https://openalex.org/W2175000298","https://openalex.org/W2481508967","https://openalex.org/W4236302577","https://openalex.org/W6661051383","https://openalex.org/W6678317532","https://openalex.org/W6684488286","https://openalex.org/W6685430540"],"related_works":["https://openalex.org/W2895758062","https://openalex.org/W2048683560","https://openalex.org/W2044770004","https://openalex.org/W1966070768","https://openalex.org/W1994341348","https://openalex.org/W2768092448","https://openalex.org/W2953512238","https://openalex.org/W2386473212","https://openalex.org/W2528016137","https://openalex.org/W1601015315"],"abstract_inverted_index":{"In":[0,78],"recent":[1],"3DIC":[2],"studies,":[3],"through":[4],"silicon":[5],"vias":[6],"(TSV)":[7],"are":[8,40,54],"usually":[9],"employed":[10],"as":[11,65],"the":[12,16,34,49,67,83,98,118,128],"vertical":[13,137],"interconnects":[14],"in":[15,45],"3D":[17,46,86],"stack.":[18],"Despite":[19],"its":[20],"benefit":[21],"of":[22,52,71,85,120,130],"short":[23],"latency":[24],"and":[25,63,112],"low":[26],"power,":[27],"forming":[28],"TSVs":[29,44],"adds":[30],"additional":[31],"complexities":[32,51],"to":[33,42,96],"fabrication":[35,50],"process.":[36],"Recently,":[37],"inductive/capactive-coupling":[38],"links":[39,59,73,138],"proposed":[41],"replace":[43],"stacking":[47],"because":[48],"them":[53],"lower.":[55],"Although":[56],"state-of-the-art":[57],"inductive/capacitive-coupling":[58,90,136],"show":[60,126],"comparable":[61],"bandwidth":[62],"power":[64],"TSV,":[66],"relatively":[68],"large":[69],"footprints":[70],"those":[72],"compromise":[74],"their":[75],"area":[76,99],"efficiencies.":[77],"this":[79],"work,":[80],"we":[81],"study":[82],"design":[84],"network-on-chip":[87],"(NoC)":[88],"using":[89,103,135],"links.":[91],"We":[92],"propose":[93],"three":[94,122],"techniques":[95],"mitigate":[97],"overhead":[100],"introduced":[101],"by":[102,134],"these":[104,121],"links:":[105],"(a)":[106],"serialization,":[107],"(b)":[108],"in-transceiver":[109],"data":[110],"compression,":[111],"(c)":[113],"high-speed":[114],"asynchronous":[115],"transmission.":[116],"With":[117],"combination":[119],"techniques,":[123],"evaluation":[124],"results":[125],"that":[127],"overheads":[129],"all":[131],"aspects":[132],"caused":[133],"can":[139],"be":[140],"bounded":[141],"under":[142],"10%.":[143]},"counts_by_year":[{"year":2020,"cited_by_count":1},{"year":2019,"cited_by_count":1},{"year":2018,"cited_by_count":3},{"year":2017,"cited_by_count":3},{"year":2016,"cited_by_count":2},{"year":2015,"cited_by_count":3},{"year":2014,"cited_by_count":1},{"year":2013,"cited_by_count":3}],"updated_date":"2026-06-11T09:08:48.828518","created_date":"2025-10-10T00:00:00"}